Ukuhlela kwamakhemikhali ngomshini(CMP) inqubo eyisisekelo ekukhiqizweni kwe-semiconductor okuthuthukisiwe. Ihlinzeka ngokuthamba kwezinga le-athomu kuzo zonke izindawo ze-wafer, ivumela ukwakheka kwezingqimba eziningi, ukupakisha amadivayisi okuqinile, kanye nokukhiqiza okuthembekile kakhudlwana. I-CMP ihlanganisa izenzo zamakhemikhali nezomshini ngasikhathi sinye—isebenzisa iphedi ejikelezayo kanye ne-slurry ekhethekile yokupholisha—ukususa amafilimu amaningi kanye nokungahambi kahle kwendawo okubushelelezi, okubalulekile ekuphatheni izici kanye nokuqondanisa kumasekethe ahlanganisiwe.
Ikhwalithi ye-wafer ngemuva kwe-CMP incike kakhulu ekulawulweni ngokucophelela kokwakheka kwe-slurry yokupholisha kanye nezici zayo. I-slurry iqukethe izinhlayiya ezihuzukayo, njenge-cerium oxide (CeO₂), ezilengiswe ku-cocktail yamakhemikhali aklanyelwe ukuthuthukisa kokubili ukuhuzuka ngokomzimba kanye namazinga okusabela kwamakhemikhali. Isibonelo, i-cerium oxide inikeza ubulukhuni obuhle kanye ne-chemistry engaphezulu kwamafilimu asekelwe ku-silicon, okwenza kube yinto ekhethwayo ezinhlelweni eziningi ze-CMP. Ukusebenza kahle kwe-CMP akunqunywanga kuphela yizici zezinhlayiya ezihuzukayo kodwa futhi nokuphathwa okunembile kokuhlushwa kwe-slurry, i-pH, kanye nobuningi.
Ukuhlela Kwemishini Yamakhemikhali
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Izisekelo Zokupholisha Ama-slurries Ekukhiqizeni Ama-Semiconductor
Ama-slurry okupholisha abalulekile enkambisweni yokuhlela kwamakhemikhali. Ayizingxube eziyinkimbinkimbi ezenzelwe ukufeza kokubili ukuguguleka komshini kanye nokuguqulwa kobuso bamakhemikhali ezindaweni ze-wafer. Izindima ezibalulekile zama-slurry e-CMP zifaka phakathi ukususwa kwezinto okuphumelelayo, ukulawulwa kohlaka, ukufana ezindaweni ezinkulu ze-wafer, kanye nokunciphisa amaphutha.
Izindima kanye Nokwakheka Kwama-Slurries Okupholisha
I-slurry ejwayelekile ye-CMP iqukethe izinhlayiya ezihudulayo ezilengiswe ku-matrix yoketshezi, ezingezwe yizithasiselo zamakhemikhali kanye neziqinisi. Ingxenye ngayinye idlala indima ehlukile:
- Izinto zokukhuhla:Lezi zinhlayiya ezincane neziqinile—ikakhulukazi i-silica (SiO₂) noma i-cerium oxide (CeO₂) ekusetshenzisweni kwe-semiconductor—zenza ingxenye yokukhishwa kwezinto ngomshini. Ukuhlushwa kwazo kanye nosayizi wokusatshalaliswa kwezinhlayiya kulawula kokubili izinga lokususwa kanye nekhwalithi yobuso. Okuqukethwe okukhukhumezayo ngokuvamile kusuka ku-1% kuya ku-5% ngesisindo, kanye nobubanzi bezinhlayiya obuphakathi kuka-20 nm no-300 nm, obucaciswe kahle ukuze kugwenywe ukuklwebheka ngokweqile kwe-wafer.
- Izithasiselo Zamakhemikhali:Lezi zinto zisungula indawo yamakhemikhali ukuze kuhlanganiswe kahle. Ama-oxidizer (isb., i-hydrogen peroxide) enza kube lula ukwakheka kwezingqimba ezingaphezulu okulula ukuzisusa. Izinto eziyinkimbinkimbi noma ezihlukanisayo (njenge-ammonium persulfate noma i-citric acid) zibopha ama-ion ensimbi, zithuthukise ukususwa nokucindezela ukwakheka kwesici. Izinto ezivimbelayo zethulwa ukuvimbela ukugqwala okungafuneki kwezingqimba ze-wafer eziseduze noma ezingaphansi, kuthuthukiswe ukukhetha.
- Iziqinisi:Ama-surfactant nama-pH buffers agcina ukuzinza kwe-slurry kanye nokusabalala okufanayo. Ama-surfactant avimbela ukuhlangana okunamandla, aqinisekisa amazinga okususwa afanayo. Ama-pH buffers avumela amazinga okusabela kwamakhemikhali ahambisanayo futhi anciphisa amathuba okuqhekeka kwezinhlayiya noma ukugqwala.
Ukwakheka kanye nokuhlushwa kwengxenye ngayinye kulungiselelwe ngokwezinto ezithile ze-wafer, isakhiwo sedivayisi, kanye nesinyathelo senqubo esihilelekile enqubweni yokuhlela kwamakhemikhali.
Ama-slurries avamile: i-Silica (i-SiO₂) vs i-Cerium Oxide (i-CeO₂)
Ama-slurries okupholisha e-Silica (SiO₂)Ilawula izinyathelo zokuhlelwa kwe-oxide, njenge-interlayer dielectric (ILD) kanye ne-shallow trench isolation (STI) polishing. Basebenzisa i-colloidal noma i-fumed silica njenge-abrasives, ngokuvamile endaweni eyisisekelo (pH ~ 10), futhi ngezinye izikhathi bagcwaliswa ngama-surfactants amancane kanye nama-corrosion inhibitors ukuze banciphise amaphutha okuklwebheka futhi bathuthukise amazinga okususa. Izinhlayiya ze-silica ziyaziswa ngobukhulu bazo obufanayo kanye nobunzima obuphansi, okunikeza ukususwa kwezinto okuthambile, okufanayo okufanele izendlalelo ezithambile.
Ama-slurries okupholisha e-Cerium oxide (CeO₂)zikhethwa ngenxa yezinhlelo zokusebenza eziyinselele ezidinga ukukhetha okuphezulu nokunemba, njengokupholisha i-substrate yokugcina yengilazi, ukuhleleka kwe-substrate okuthuthukisiwe, kanye nezendlalelo ezithile ze-oxide kumadivayisi e-semiconductor. Ama-abrasives e-CeO₂ abonisa ukusabela okuhlukile, ikakhulukazi ngezindawo ze-silicon dioxide, okuvumela kokubili izindlela zokususa amakhemikhali kanye nemishini. Lokhu kuziphatha kwezenzo ezimbili kunikeza amazinga aphezulu okuhleleka emazingeni aphansi okukhubazeka, okwenza ama-slurries e-CeO₂ akhetheke kakhulu kuma-glass, ama-hard disk substrates, noma ama-node edivayisi ye-logic athuthukisiwe.
Inhloso Yokusebenza Kwezinto Ezisusa Ukuvuvukala, Izithasiselo, kanye Nezinto Eziqinisa Umzimba
- Ama-Abrasives: Yenza ukuhuzuka komshini. Usayizi wazo, ukuma, kanye nokuhlushwa kwazo kunquma izinga lokususwa kanye nokuphela kobuso. Isibonelo, ama-silica abrasives afanayo angu-50 nm aqinisekisa ukuhlelwa okuthambile, okulinganayo kwezingqimba ze-oxide.
- Izithasiselo Zamakhemikhali: Nika amandla ukususwa okukhethiwe ngokwenza kube lula ukungcoliswa kobuso kanye nokuncibilika. Ku-CMP yethusi, i-glycine (njenge-complexing agent) kanye ne-hydrogen peroxide (njenge-oxidizer) zisebenza ngokubambisana, kuyilapho i-BTA isebenza njengesivimbeli esivikela izici zethusi.
- Iziqinisi: Gcina ukwakheka kwe-slurry kufana ngokuhamba kwesikhathi. Ama-surfactant avimbela ukubola kanye nokuhlangana, aqinisekise ukuthi izinhlayiya ezihuquzelayo zihlakazeka njalo futhi ziyatholakala kule nqubo.
Izakhiwo Ezihlukile Nezimo Zokusetshenziswa: Ama-slurries e-CeO₂ kanye ne-SiO₂
i-CeO₂ polishing slurryinikeza ukukhetha okuphezulu phakathi kwengilazi ne-silicon oxide ngenxa yokusabela kwayo kwamakhemikhali okungokwemvelo. Isebenza kahle kakhulu ekuhleleni ama-substrate aqinile, aqhekekayo noma ama-composite oxide stacks lapho ukukhetha okuphezulu kwezinto kubalulekile khona. Lokhu kwenza ama-slurries e-CeO₂ abe yizinga elijwayelekile ekulungiseleleni i-substrate ethuthukisiwe, ekuqedeni ingilazi ngokunemba, kanye nezinyathelo ezithile ze-shallow trench isolation (STI) CMP embonini ye-semiconductor.
I-SiO₂ polishing slurryinikeza inhlanganisela elinganiselayo yokususwa kwemishini namakhemikhali. Isetshenziswa kabanzi ekuhleleni kwe-bulk oxide kanye ne-interlayer dielectric, lapho kudingeka khona ukuphuma okuphezulu kanye nokukhubazeka okuncane. Usayizi wezinhlayiya ze-silica ofanayo, olawulwayo nawo ukhawulela ukukhiqizwa kokuklwebheka futhi uqinisekisa ikhwalithi ephezulu yokuphela kobuso.
Ukubaluleka Kobukhulu Bezinhlayiya Nokuhlakazeka Kokufana
Usayizi wezinhlayiya kanye nokufana kokusabalala kubalulekile ekusebenzeni kahle kokusaphazeka. Izinhlayiya ezihuquzelayo ezifanayo, ezilingana ne-nanometer ziqinisekisa amazinga okususwa kwezinto ahambisanayo kanye nobuso be-wafer obungenasici. Ukuhlangana kuholela ekuklwebheni noma ekupholisheni okungalindelekile, kuyilapho ukusatshalaliswa kosayizi obanzi kubangela ukuhleleka okungafani kanye nokwanda kobuningi beziphambeko.
Ukulawulwa kokuhlushwa kwe-slurry okuphumelelayo—okuqashwe ubuchwepheshe obufana ne-slurry density meter noma amadivayisi okulinganisa i-slurry density ultrasonic—kuqinisekisa ukulayisha okuqhubekayo kanye nemiphumela yenqubo ebikezelwayo, okuthinta ngqo isivuno kanye nokusebenza kwedivayisi. Ukufinyelela ukulawula ukuxinana okunembile kanye nokuhlakazeka okufanayo kuyizidingo ezibalulekile zokufakwa kwemishini yokuhlelwa kwemishini yamakhemikhali kanye nokwenza ngcono inqubo.
Ngamafuphi, ukwakheka kwama-slurries okupholisha—ikakhulukazi ukukhetha nokulawula uhlobo lokuhuzuka, usayizi wezinhlayiya, kanye nezindlela zokuzinzisa—kusekela ukuthembeka nokusebenza kahle kwenqubo yokuhlela imishini yamakhemikhali ezisetshenziswa embonini ye-semiconductor.
Ukubaluleka Kokulinganiswa Kobuningi Be-Slurry ku-CMP
Enqubweni yokuhlela kwamakhemikhali ngomshini, ukulinganisa okunembile nokulawula ubuningi be-slurry kuthinta ngqo ukusebenza kahle kanye nekhwalithi ye-wafer polishing. Ubuningi be-slurry—ukuhlushwa kwezinhlayiya ezihuquzelayo ngaphakathi kwe-slurry polishing—kusebenza njenge-lever yenqubo ephakathi, okwakha izinga lokupholisha, ikhwalithi yokugcina yobuso, kanye nokukhiqizwa kwe-wafer iyonke.
Ubudlelwano Phakathi Kobuningi Be-Slurry, Izinga Lokupholisha, Ikhwalithi Yomphezulu, kanye Nokukhiqizwa Kwe-Wafer
Ukuhlushwa kwezinhlayiya ezishwabene ngaphakathi kwe-CeO₂ polishing slurry noma olunye uhlobo lwe-polishing slurry lunquma ukuthi izinto zisuswa ngokushesha kangakanani ebusweni be-wafer, okuvame ukubizwa ngokuthi izinga lokususwa noma izinga lokususwa kwezinto (MRR). Ukwanda kobuningi be-slurry ngokuvamile kuphakamisa inani lokuxhumana okushwabene endaweni ngayinye, okusheshisa izinga lokupholisha. Isibonelo, ucwaningo olulawulwa ngo-2024 lubike ukuthi ukuphakamisa ukuhlushwa kwezinhlayiya ze-silica kufika ku-5 wt% ku-colloidal slurry kwandisa amazinga okususwa kwama-wafer e-silicon angu-200 mm. Kodwa-ke, lobu budlelwano abuqondile—kukhona iphuzu lokuncipha kokubuya. Ekuxinaneni okuphezulu kwe-slurry, ukuhlangana kwezinhlayiya kubangela i-plateau noma ngisho nokwehla kwesilinganiso sokususwa ngenxa yokuphazamiseka kokuthuthwa kwesisindo kanye nokwanda kwe-viscosity.
Ikhwalithi yobuso iyazwela ngokulinganayo ekuminyaneni kwe-slurry. Uma kugxilwe kakhulu, amaphutha anjengokuklwebheka, udoti ohlanganisiwe, kanye nemigodi kuba maningi. Ucwaningo olufanayo lubone ukwanda okuqondile kokungalungi kobuso kanye nobukhulu bokuklwebheka okukhulu lapho kwandiswa ubuningi be-slurry ngaphezu kuka-8-10 wt%. Ngakolunye uhlangothi, ukwehlisa ubuningi kunciphisa ingozi yamaphutha kodwa kunganciphisa ukususwa futhi kubeke engcupheni ukulingana.
Isivuno se-wafer, isilinganiso sama-wafer ahlangabezana nemininingwane yenqubo ngemuva kokupholisha, silawulwa yile miphumela ehlanganisiwe. Amazinga aphezulu okukhubazeka kanye nokususwa okungafani kokubili kunciphisa isivuno, kugcizelela ibhalansi ebucayi phakathi kokuphuma kanye nekhwalithi ekwakhiweni kwe-semiconductor yesimanje.
Umthelela Wokuguquguquka Kokuhlushwa Okuncane Kwe-Slurry Enqubweni Ye-CMP
Ngisho nokuphambuka okuncane kakhulu kusukela ekubuneni kwe-slurry okulungile—izingxenyana zephesenti—kungathinta kakhulu umkhiqizo wenqubo. Uma ukuhlushwa okunamandla kudlula okuqondiwe, ukuhlangana kwezinhlayiya kungase kwenzeke, okuholela ekugugeni okusheshayo kuma-pad nama-conditioning disc, amazinga aphezulu okuklwebheka kobuso, kanye nokuvaleka okungenzeka noma ukuguguleka kwezingxenye eziwuketshezi emishinini yokuhlelwa kwamakhemikhali. Ukuminyana okungaphansi kungashiya amafilimu asele kanye nezindawo ezingavamile zokwakheka komhlaba, okuphonsela inselelo izinyathelo ezilandelayo ze-photolithography futhi kunciphise isivuno.
Ukwehluka kobuningi be-slurry nakho kuthinta ukusabela kwamakhemikhali-kwemishini ku-wafer, nemiphumela engezansi ekungaphelelini nasekusebenzeni kwedivayisi. Isibonelo, izinhlayiya ezincane noma ezingasakazeki ngokulinganayo kuma-slurry axutshwe zithinta amazinga okususwa kwendawo, okudala i-microtopography engasakazeka njengamaphutha enqubo ekukhiqizweni okuphezulu. Lokhu okucashile kudinga ukulawulwa okuqinile kokuhlushwa kwe-slurry kanye nokuqapha okuqinile, ikakhulukazi kuma-node athuthukile.
Ukulinganiswa Nokwenziwa Kahle Kobuningi Be-Slurry Yesikhathi Sangempela
Ukulinganiswa kwesikhathi sangempela kobuningi be-slurry, okuvunyelwe ngokusetshenziswa kwamamitha obuningi obungaphakathi komugqa—njengamamitha obuningi be-slurry e-ultrasonic akhiqizwe yi-Lonnmeter—manje sekujwayelekile ezisetshenziswa embonini ehamba phambili ye-semiconductor. Lawa mathuluzi avumela ukuqapha okuqhubekayo kwamapharamitha e-slurry, okunikeza impendulo esheshayo ngokuguquguquka kobuningi njengoba i-slurry ihamba ngamasethi amathuluzi e-CMP kanye nezinhlelo zokusabalalisa.
Izinzuzo ezibalulekile zokulinganisa ubuningi be-slurry ngesikhathi sangempela zifaka:
- Ukutholwa ngokushesha kwezimo ezingacacisiwe, ukuvimbela ukusabalala kwamaphutha ngezinqubo ezibizayo ezingezansi
- Ukuthuthukiswa kwenqubo—kuvumela onjiniyela ukuthi balondoloze ifasitela elifanele lokuxinana kwe-slurry, bandise izinga lokususa ngenkathi benciphisa ukungasebenzi kahle
- Ukuthuthukiswa kwe-wafer kuya ku-wafer kanye nokuvumelana kwe-lot-to-lot, okuhumusha isivuno esiphezulu sokukhiqiza jikelele
- Impilo yemishini ende, njengoba ama-slurries agxilile kakhulu noma angagxilile ngokwanele angasheshisa ukuguguleka kwama-polishing pads, ama-mixer, kanye namapayipi okusabalalisa
Ukufakwa kwemishini ye-CMP kuvame ukuhambisa ama-loop esampula noma imigqa yokujikeleza ngokusebenzisa indawo yokulinganisa, ukuqinisekisa ukuthi ukufundwa kobuningi kumele ukugeleza kwangempela okulethwa kuma-wafer.
Kunembile futhi ngesikhathi sangempelaukulinganiswa kobuningi be-slurryYakha umgogodla wezindlela zokulawula ubuningi be-slurry eziqinile, isekela kokubili ukwakheka kwe-slurry okusunguliwe kanye nokusha, kufaka phakathi i-slurry ye-Cerium oxide (CeO₂) eyinselele ye-interlayer ethuthukisiwe kanye ne-oxide CMP. Ukugcina le pharamitha ebalulekile kuhlobene ngqo nokukhiqiza, ukulawulwa kwezindleko, kanye nokuthembeka kwedivayisi kuyo yonke inqubo yokuhlela kwamakhemikhali.
Izimiso kanye nobuchwepheshe bokulinganisa ubuningi be-slurry
Ubuningi be-slurry buchaza isisindo sezinto eziqinile ngevolumu ngayinye ku-slurry yokupholisha, njenge-Cerium oxide (CeO₂) formulations esetshenziswa ekuhleleni kwamakhemikhali okusebenza ngomshini (CMP). Lokhu kuguquguquka kunquma amazinga okususwa kwezinto, ukufana kokukhipha, kanye namazinga okukhubazeka kuma-wafer apholishiwe. Ukulinganisa ubuningi be-slurry okuphumelelayo kubalulekile ekulawuleni ukuhlushwa kwe-slurry okuthuthukisiwe, okuthonya ngqo isivuno kanye nokukhubazeka kwezicelo zemboni ye-semiconductor.
Uhla lwamamitha obuningi be-slurry luyasetshenziswa emisebenzini ye-CMP, ngayinye isebenzisa izimiso ezahlukene zokulinganisa. Izindlela ze-gravimetric zithembele ekuqoqeni nasekulinganiseni ivolumu ye-slurry echaziwe, enikeza ukunemba okuphezulu kodwa engenakho ikhono lesikhathi sangempela futhi izenze zingasebenzi ukusetshenziswa okuqhubekayo ekufakweni kwemishini ye-CMP. Amamitha obuningi be-electromagnetic asebenzisa amasimu kagesi ukuze anqume ubuningi ngokusekelwe ekushintsheni kokuqhuba kanye nokuvumela ngenxa yezinhlayiya ezilengayo. Amamitha okudlidliza, njenge-vibrating tube densitometers, alinganisa impendulo yemvamisa yepayipi eligcwele i-slurry; ukuhlukahluka kobuningi kuthinta imvamisa yokudlidliza, okuvumela ukuqapha okuqhubekayo. Lobu buchwepheshe busekela ukuqapha okuqondile kodwa bungazwela ekungcoleni noma ekushintsheni kwamakhemikhali.
Amamitha okulinganisa uketshezi oluyi-Ultrasonic amelela intuthuko ebalulekile kwezobuchwepheshe yokuqapha uketshezi ngesikhathi sangempela ekuhleleni kwamakhemikhali nokwemishini. Lawa mathuluzi akhipha amaza e-ultrasonic ngokusebenzisa uketshezi oluyi-slurry futhi alinganise isikhathi sokundiza noma ijubane lokusabalala komsindo. Ijubane lomsindo endaweni esetshenziswayo lincike ekuxineni kwawo kanye nokuhlushwa kwezinto eziqinile, okuvumela ukunqunywa okunembile kwezakhiwo zoketshezi oluyi-slurry. Indlela ye-ultrasonic ifaneleka kakhulu ezindaweni ezihlukumezayo nezinolaka lwamakhemikhali ezivamile ze-CMP, njengoba ingaphazamisi futhi inciphisa ukungcola kwenzwa uma kuqhathaniswa namamitha okuxhumana ngqo. I-Lonnmeter ikhiqiza amamitha okulinganisa uketshezi oluyi-Ultrasonic angaphakathi aklanyelwe imigqa ye-CMP yemboni ye-semiconductor.
Izinzuzo zamamitha okulinganisa ubuningi be-slurry e-ultrasonic zifaka:
- Ukulinganisa okungaphazamisi: Izinzwa zivame ukufakwa ngaphandle noma ngaphakathi kwamaseli okugeleza kwe-bypass, okunciphisa ukuphazamiseka kokusaphazeka nokugwema ukuguguleka kwezindawo zokuzwa.
- Amandla esikhathi sangempela: Ukukhishwa okuqhubekayo kwenza ukulungiswa kwenqubo okusheshayo, okuqinisekisa ukuthi ubuningi be-slurry buhlala ngaphakathi kwamapharamitha acacisiwe ukuze kube nekhwalithi ephezulu yokupholisha i-wafer.
- Ukunemba okuphezulu nokuqina: Izikena ze-Ultrasonic zinikeza ukufundwa okuzinzile nokuphindaphindekayo, okungathinteki yi-chemistry ye-slurry eguquguqukayo noma umthwalo wezinhlayiya phezu kokufakwa okunwetshiwe.
- Ukuhlanganiswa nemishini ye-CMP: Umklamo wabo usekela ukufakwa kokufakwa emigqeni ye-slurry ejikelezayo noma kuma-manifold okulethwa, okwenza kube lula ukulawula inqubo ngaphandle kwesikhathi eside sokungasebenzi.
Izifundo zakamuva zokwenziwa kwe-semiconductor zibika ukwehla kokukhubazeka okungafika ku-30% lapho ukuqapha ubuningi be-ultrasonic okusemgqeni kuhambisana nokufakwa kwemishini yokuhlelwa kwemishini yamakhemikhali yezinqubo ze-slurry yokupholisha i-Cerium oxide (CeO₂). Impendulo ezenzakalelayo evela kuzinzwa ze-ultrasonic ivumela ukulawula okuqinile kokwakheka kwe-slurry yokupholisha, okuholela ekufaneni okuthuthukisiwe kokujiya kanye nokulahlekelwa kwezinto ezisetshenziswayo okuphansi. Amamitha obuningi be-Ultrasonic, uma ehlanganiswa nezinqubo zokulinganisa eziqinile, agcina ukusebenza okuthembekile lapho ebhekene nokushintsha kokwakheka kwe-slurry, okuvamile emisebenzini ethuthukisiwe ye-CMP.
Ngamafuphi, ukulinganiswa kobuningi be-slurry ngesikhathi sangempela—ikakhulukazi kusetshenziswa ubuchwepheshe be-ultrasonic—sekuyiyona nto ebalulekile ezindleleni zokulawula ubuningi be-slurry eziqondile ku-CMP. Lokhu kuthuthuka kuthuthukisa ngqo isivuno, ukusebenza kahle kwenqubo, kanye nekhwalithi ye-wafer embonini ye-semiconductor.
Ukufakwa Nokuhlanganiswa Kwezinhlelo ze-CMP
Ukulinganisa kahle ubuningi be-slurry kubalulekile ekulawuleni ukugcwala kwe-slurry enqubweni yokuhlela kwamakhemikhali. Ukukhetha izindawo zokufaka ezisebenzayo zamamitha obuningi be-slurry kuthinta ngqo ukunemba, ukuzinza kwenqubo, kanye nekhwalithi ye-wafer.
Izici Ezibalulekile Zokukhetha Amaphuzu Okufaka
Kumasethingi e-CMP, amamitha obuningi kufanele abekwe ukuze kuqashwe udoti wangempela osetshenziselwa ukupholisha i-wafer. Izindawo zokufaka eziyinhloko zifaka:
- Ithangi Lokujikeleza Igazi:Ukubeka imitha endaweni yokukhipha amanzi kunikeza ukuqonda ngesimo se-slurry eyisisekelo ngaphambi kokusatshalaliswa. Kodwa-ke, le ndawo ingase iphuthelwe izinguquko ezenzeka kamuva, njengokwakheka kwamabhamuza noma imiphumela yokushisa yendawo.
- Imigqa Yokulethwa:Ukufaka ngemva kokuxuba amayunithi nangaphambi kokufaka ama-manifold okusabalalisa kuqinisekisa ukuthi ukulinganiswa kobuningi kubonisa ukwakheka kokugcina kwe-slurry, okuhlanganisa i-slurry yokupholisha ye-Cerium oxide (CeO₂) nezinye izithasiselo. Lesi sikhundla sivumela ukutholakala okusheshayo kokushintsha kokuhlushwa kwe-slurry ngaphambi nje kokuba ama-wafer acutshungulwe.
- Ukuqapha Indawo Yokusebenzisa:Indawo efanele itholakala phezulu kwevalvu noma ithuluzi lokusebenzisa. Lokhu kubamba ubuningi be-slurry ngesikhathi sangempela futhi kuxwayise opharetha ngokuphambuka ezimweni zenqubo okungavela ekushiseni komugqa, ukuhlukaniswa, noma ukukhiqizwa kwama-microbubble.
Uma ukhetha izindawo zokufaka, izici ezengeziwe ezifana nohlelo lokugeleza, ukuqondiswa kwepayipi, kanye nokusondela kwamaphampu noma amavalvu kumele kucatshangelwe:
- Ukuthandaukufakwa okuqondilengokugeleza okuphezulu ukuze kuncishiswe ukunqwabelana kwebhamuza lomoya kanye nenhlabathi entweni yokuzwa.
- Gcina ububanzi obuningana bepayipi phakathi kwemitha kanye nemithombo emikhulu yokuxokozela (amaphampu, amavalvu) ukuze ugweme amaphutha okufunda ngenxa yokuphazamiseka kokugeleza kwamanzi.
- Sebenzisaukulungiswa kokugeleza kwamanzi(iziqondisi noma izingxenye ezizolisayo) zokuhlola ukulinganiswa kobuningi endaweni eqinile ye-laminar.
Izinselele Ezivamile kanye Nemikhuba Emihle Yokuhlanganiswa Kwezinzwa Okuthembekile
Izinhlelo ze-CMP slurry ziletha izinselele eziningana zokuhlanganisa:
- Ukungena Komoya Namabhamuza:Amamitha okulinganisa ukungcola kwe-Ultrasonic angakufunda kabi ubuningi uma kukhona ama-microbubbles. Gwema ukubeka izinzwa eduze kwamaphuzu okungena komoya noma ukuguquka kokugeleza okungazelelwe, okuvame ukwenzeka eduze kokukhishwa kwephampu noma amathangi okuxuba.
- Ukususwa kwenhlabathi:Emigqeni evundlile, izinzwa zingase zihlangane nezinto eziqinile ezihlala phansi, ikakhulukazi nge-CeO₂ polishing slurry. Ukufakwa noma ukubeka phezulu ngaphezu kwezindawo ezihlala phansi ezingaba khona kuyanconywa ukuze kulondolozwe ukulawulwa okunembile kobuningi be-slurry.
- Ukungcola kwenzwa:Ama-slurry e-CMP aqukethe izinto ezihudulayo nezamakhemikhali ezingase ziholele ekungcoleni noma ekumbozeni inzwa. Amathuluzi angaphakathi e-Lonnmeter aklanyelwe ukunciphisa lokhu, kodwa ukuhlolwa nokuhlanza njalo kusabalulekile ukuze kube nokuthembeka.
- Ukudlidliza Kwemishini:Ukubekwa eduze kwamadivayisi asebenzayo emishini kungadala umsindo ngaphakathi kwenzwa, kwehlise ukunemba kokulinganisa. Khetha izindawo zokufaka ezinokuvezwa okuncane kokudlidliza.
Ukuze uthole imiphumela emihle kakhulu yokuhlanganisa:
- Sebenzisa izingxenye zokugeleza kwe-laminar ukuze ufake.
- Qinisekisa ukuthi uqondanisa kahle lapho kungenzeka khona.
- Nikeza ukufinyelela okulula kokulungiswa nokulinganiswa ngezikhathi ezithile.
- Hlukanisa izinzwa ekuphazamisekeni kokudlidliza nokugeleza.
I-CMP
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Amasu Okulawula Ukuhlushwa Okuludaka
Ukulawulwa kokugxila kwe-slurry okuphumelelayo enkambisweni yokuhlela kwamakhemikhali kubalulekile ukuze kulondolozwe amazinga okususwa kwezinto ahambisanayo, kuncishiswe amaphutha ebusweni be-wafer, futhi kuqinisekiswe ukufana kuwo wonke ama-wafer e-semiconductor. Izindlela eziningana kanye nobuchwepheshe kusetshenziswa ukufeza lokhu kunemba, okusekela kokubili ukusebenza okulula kanye nokukhiqiza okuphezulu kwamadivayisi.
Amasu Namathuluzi Okugcina Ukugxila Okuhle Kakhulu Kwe-Slurry
Ukulawulwa kokuhlushwa kwe-slurry kuqala ngokuqapha ngesikhathi sangempela kokubili izinhlayiya ezihudulayo kanye nezinhlobo zamakhemikhali ku-slurry yokupholisha. Ku-slurry yokupholisha ye-Cerium oxide (CeO₂) kanye nezinye izindlela ze-CMP, izindlela eziqondile ezifana nokulinganisa ubuningi be-slurry ngaphakathi ziyisisekelo. Amamitha obuningi be-slurry e-Ultrasonic, njengalawo akhiqizwe yi-Lonnmeter, aletha izilinganiso eziqhubekayo zobuningi be-slurry, okuhambisana kakhulu nokuqukethwe okuphelele okuqinile kanye nokufana.
Amasu ahambisanayo afaka phakathi ukuhlaziywa kokungcola—lapho izinzwa zokukhanya zibona khona ukuhlakazeka okuvela ezinhlayiyeni ezilengayo—kanye nezindlela ze-spectroscopic ezifana ne-UV-Vis noma i-Near-Infrared (NIR) spectroscopy ukuze kulinganiswe ama-reactant ayisihluthulelo emsinga. Lezi zilinganiso zakha umgogodla wezinhlelo zokulawula inqubo ye-CMP, okuvumela ukulungiswa okubukhoma ukugcina amafasitela okuhlushwa okuqondiwe nokunciphisa ukuhlukahluka kwe-batch-to-batch.
Izinzwa ze-electrochemical zisetshenziswa ekwakhiweni okucebile ngama-ion ensimbi, okuhlinzeka ngolwazi lokuphendula okusheshayo ngama-concentration athile e-ionic futhi kusekela ukulungiswa okwengeziwe kwezicelo zemboni ye-semiconductor ezithuthukisiwe.
Ama-Feedback Loops kanye Nokuzenzakalela Kokulawula Okuvaliwe
Ukufakwa kwemishini yokuhlelwa kwamakhemikhali nemishini yesimanje kusebenzisa kakhulu izinhlelo zokulawula ezivaliwe ezixhumanisa i-inline metrology nezinhlelo zokusabalalisa ezenzakalelayo. Idatha evela kumamitha obuningi be-slurry kanye nezinzwa ezihlobene inikezwa ngqo kubalawuli be-logic abahleliwe (ama-PLC) noma izinhlelo zokulawula ezisatshalaliswa (ama-DCS). Lezi zinhlelo zivuselela ngokuzenzakalelayo ama-valve ukuze kufakwe amanzi okuzenzela, kufakwe i-slurry dosing egxilile, kanye nokujova i-stabilizer, okuqinisekisa ukuthi inqubo ihlala ngaphakathi kwe-envelope yokusebenza edingekayo ngaso sonke isikhathi.
Lo mklamo wempendulo uvumela ukulungiswa okuqhubekayo kwanoma yikuphi ukuphambuka okutholwe yizinzwa zesikhathi sangempela, ukugwema ukuxutshwa ngokweqile, ukulondoloza ukuhlushwa okunamandla, nokunciphisa ukusetshenziswa kwamakhemikhali ngokweqile. Isibonelo, kuthuluzi le-CMP elisebenzisa amandla aphezulu lama-wafer node athuthukile, imitha yobuningi be-slurry ye-inline ultrasonic izobona ukwehla kokuhlushwa okunamandla futhi ibonise ngokushesha uhlelo lokulinganisa ukwandisa ukwethulwa kwe-slurry, kuze kube yilapho ukuhlushwa kubuyela endaweni yalo. Ngokuphambene nalokho, uma ukuhlushwa okulinganiselwe kudlula ukucaciswa, i-logic yokulawula iqala ukwengeza amanzi okuzenzela ukuze kubuyiselwe ukuhlushwa okulungile.
Indima Yokulinganisa Ubuningi Ekulungiseni Amazinga Okwengeza Amanzi Nodaka
Ukulinganiswa kobuningi be-slurry kuyisici esiyinhloko sokulawula ukuhlushwa okusebenzayo. Inani lobuningi elinikezwa yizinsimbi ezifana namamitha obuningi be-Lonnmeter angaphakathi komugqa linikeza ngqo imingcele emibili ebalulekile yokusebenza: umthamo wamanzi wokwakheka kanye nesilinganiso sokudla kwe-slurry okugxilile.
Ngokubeka amamitha obuningi ezindaweni eziqondile—njengangaphambi kokufakwa kwethuluzi le-CMP noma ngemuva komxube wokusebenzisa—idatha yesikhathi sangempela ivumela izinhlelo ezizenzakalelayo ukuthi zilungise izinga lokwengeza amanzi okwenziwa, ngaleyo ndlela zinciphise i-slurry ngokwezidingo ezifunwayo. Ngesikhathi esifanayo, uhlelo lungashintsha izinga lokuphakelwa kwe-slurry egxilile ukuze kugcinwe amazinga okukhuhla kanye namakhemikhali ngokunembile, kubalwa ukusetshenziswa kwamathuluzi, imiphumela yokuguga, kanye nokulahlekelwa okubangelwa yinqubo.
Isibonelo, ngesikhathi sokuqhutshwa kwe-planarization ende yezakhiwo ze-3D NAND, ukuqapha okuqhubekayo kobuningi kuthola ukuhlanganiswa kwe-slurry noma izitayela zokuxazulula, okubangela ukwanda okuzenzakalelayo kwamanzi okuzenzela noma ukushukuma, njengoba kudingeka ukuze inqubo izinze. Lo mjikelezo wokulawula olawulwa kahle uyisisekelo ekugcineni imigomo eqinile yokufana kwe-wafer kuya ku-wafer kanye ne-in-wafer, ikakhulukazi njengoba ubukhulu bedivayisi namafasitela enqubo encipha.
Ngamafuphi, amasu okulawula ukuhlushwa kwe-slurry ku-CMP ancike ekuxubeni kwezilinganiso ezithuthukisiwe eziku-line kanye nezimpendulo ezizenzakalelayo ze-closed-loop. Amamitha obuningi be-slurry, ikakhulukazi amayunithi e-ultrasonic afana nalawo avela eLonnmeter, adlala indima ebalulekile ekuletheni idatha enesinqumo esiphezulu, esifike ngesikhathi edingekayo yokuphathwa kwenqubo eqinile ezinyathelweni ezibalulekile zokukhiqiza i-semiconductor. Lawa mathuluzi nezindlela zinciphisa ukuguquguquka, zisekela ukusimama ngokwenza ngcono ukusetshenziswa kwamakhemikhali, futhi zivumela ukunemba okudingekayo kubuchwepheshe be-node besimanje.
Umhlahlandlela Wokukhetha Imitha Yobuningi Be-Slurry Yemboni Ye-Semiconductor
Ukukhetha imitha yobuningi be-slurry yokuhlelwa kwemishini yamakhemikhali (i-CMP) embonini ye-semiconductor kudinga ukunakwa ngokucophelela ezidingweni zobuchwepheshe ezahlukahlukene. Izindlela zokusebenza ezibalulekile kanye nezindlela zokusebenzisa zifaka phakathi ukuzwela, ukunemba, ukuhambisana namakhemikhali e-slurry anamandla, kanye nokulula kokuhlanganiswa ngaphakathi kwezinhlelo zokulethwa kwe-slurry ze-CMP kanye nokufakwa kwemishini.
Izidingo Zokuzwela Nokunemba
Ukulawulwa kwenqubo ye-CMP kuncike ekushintsheni okuncane kokwakheka kwe-slurry. Imitha yobuningi kumele ibone izinguquko ezincane ezingu-0.001 g/cm³ noma ngaphezulu. Leli zinga lokuzwela libalulekile ekuboneni ngisho nokushintsha okuncane kakhulu kokuqukethwe okuhlukumezayo—njengalokho okutholakala ku-CeO₂ polishing slurry noma ku-silica-based slurry—ngoba lokhu kuthinta amazinga okususwa kwezinto, i-wafer planarity, kanye nokukhubazeka. Ububanzi obujwayelekile bokunemba obamukelekayo bamamitha obuningi be-slurry we-semiconductor bungu-±0.001–0.002 g/cm³.
Ukuhambisana nama-Aggressive Slurries
Ama-slurries asetshenziswa ku-CMP angaqukatha ama-nanoparticles abrasive njenge-cerium oxide (CeO₂), i-alumina, noma i-silica, alengiswe ezindaweni ezisebenzisa amakhemikhali. Imitha yobuningi kumele imelane nokuchayeka isikhathi eside kokubili ekukhungathekeni ngokomzimba nasezindaweni ezigqwalisayo ngaphandle kokuphuma ekulinganisweni noma ukuhlushwa ukungcola. Izinto ezisetshenziswa ezingxenyeni ezimanzi kufanele zingabi yingozi kuzo zonke izinhlobo zamakhemikhali e-slurry asetshenziswa njalo.
Ukulula Kokuhlanganiswa
Amamitha okulinganisa ukungcola okuqondile kumele avumelane kalula nokufakwa kwemishini ye-CMP ekhona. Izinto okufanele uzicabangele zifaka:
- Umthamo omncane wokufa kanye nokwehla komfutho ophansi ukuze kugwenywe ukuthonya ukulethwa kwe-slurry.
- Ukusekelwa kokuxhumeka okujwayelekile kwenqubo yezimboni ukuze kufakwe futhi kulungiswe ngokushesha.
- Ukuhambisana kokukhipha (isb., izimpawu ze-analog/zedijithali) zokuhlanganiswa kwesikhathi sangempela nezinhlelo zokulawula ukuhlushwa kwe-slurry, kodwa ngaphandle kokuhlinzeka lezo zinhlelo ngokwazo.
Izici Eziqhathaniswayo Zobuchwepheshe Bezinzwa Ezihamba Phambili
Ukulawulwa kobuningi be-slurries yokupholisha kuphathwa ikakhulukazi ngezigaba ezimbili zezinzwa: amamitha asekelwe ku-densitometry kanye namamitha asekelwe ku-refractometry. Ngayinye iletha amandla afanele ukusetshenziswa embonini ye-semiconductor.
Amamitha Asekelwe Ku-Densitometry (isb., Imitha Yobuningi Be-Ultrasonic Slurry)
- Isebenzisa ijubane lokusabalala komsindo phakathi kwe-slurry, okuhlobene ngqo nobuningi.
- Inikeza ukulingana okuphezulu ekulinganisweni kobuningi kuzo zonke izinhlobo zokugxila kwe-slurry kanye nezinhlobo zokuhudula.
- Ifaneleka kahle kuma-slurry okupholisha anamandla, kufaka phakathi i-CeO₂ kanye ne-silica formulations, njengoba izakhi zokuzwa zingenziwa zihlukaniswe ngokomzimba kumakhemikhali.
- Ukuzwela okuvamile kanye nokunemba kuhlangabezana nemfuneko engaphansi kuka-0.001 g/cm³.
- Ukufakwa kuvame ukuba ngaphakathi komugqa, okuvumela ukulinganiswa kwesikhathi sangempela okuqhubekayo ngesikhathi sokusebenza kwemishini yokuhlelwa kwemishini yamakhemikhali.
Amamitha asekelwe ku-Refractometry
- Ilinganisa inkomba yokubuyisa ukuze inqume ubuningi be-slurry.
- Isebenza kahle ekutholeni izinguquko ezincane ekwakhiweni kwe-slurry ngenxa yokuzwela okuphezulu ekushintsheni kokuhlushwa; iyakwazi ukuxazulula izinguquko zengxenye yobukhulu ezingaphansi kuka-0.1%.
- Kodwa-ke, inkomba yokubuyisa i-refractive iyazwela eziguquguqukweni zemvelo ezifana nokushisa, okudinga ukulinganiswa okucophelelayo kanye nokubuyiselwa kwezinga lokushisa.
- Kungaba nokuhambisana okulinganiselwe kwamakhemikhali, ikakhulukazi ezindaweni ezimanzi ezinolaka kakhulu noma ezingacacile.
I-Metology Yosayizi Wezinhlayiyana Njengesiphelelisi
- Ukufundwa kobuningi kungaphazanyiswa izinguquko ekusabalaleni kosayizi wezinhlayiya noma ukuhlangana.
- Ukuhlanganiswa nokuhlaziywa kosayizi wezinhlayiya ngezikhathi ezithile (isb., ukusabalala kokukhanya okuguquguqukayo noma i-electron microscopy) kunconywa yimikhuba emihle yemboni, okuqinisekisa ukuthi ukushintsha kobuningi okubonakalayo akubangelwa nje ukuhlangana kwezinhlayiya.
Izinto Okumelwe Uzicabangele Ngamamitha Obuningi Obungaphakathi eLonnmeter
- I-Lonnmeter igxile ekukhiqizeni amamitha okuqina kanye ne-viscosity angaphakathi, ngaphandle kokunikeza isofthiwe noma ukuhlanganiswa kwesistimu okusekelayo.
- Amamitha e-Lonnmeter angachazwa ukuze amelane nokuguguleka kwe-CMP, okusebenzayo ngamakhemikhali futhi aklanyelwe ukufakwa okuqondile ngaphakathi kwemishini yenqubo ye-semiconductor, okuhambisana nezidingo zokulinganisa ubuningi be-slurry ngesikhathi sangempela.
Uma ubuyekeza izinketho, gxila ezindinganisweni zokusetshenziswa eziyinhloko: qiniseka ukuthi imitha yobuningi ifinyelela ukuzwela nokunemba okudingekayo, yakhiwe ngezinto ezihambisana nekhemistri yakho yokungcola, imelana nokusebenza okuqhubekayo, futhi ihlangana kalula nemigqa yokulethwa kokungcola kokungcola enkambisweni ye-CMP. Embonini ye-semiconductor, ukulinganisa okunembile kobuningi bokungcola kusekela ukufana kwe-wafer, isivuno, kanye nokukhiqiza.
Umthelela Wokulawulwa Kokuqina Kodaka Okuphumelelayo Emiphumeleni Ye-CMP
Ukulawulwa kobuningi be-slurry okunembile kubalulekile enkambisweni yokuhlela kwamakhemikhali ngomshini. Uma ubuningi bugcinwa bufana, inani lezinhlayiya ezihuzukayo ezikhona ngesikhathi sokupholisha lihlala lizinzile. Lokhu kuthinta ngqo izinga lokususwa kwezinto (MRR) kanye nekhwalithi yobuso be-wafer.
Ukunciphisa Amaphutha Okungaphezulu Kwe-Wafer kanye ne-WIWNU Ethuthukisiwe
Ukugcina ubuningi be-slurry obufanele kufakazelwe ukuthi kunciphisa amaphutha ebusweni be-wafer njengokuklwebheka okuncane, ukusaphaza, ukuguguleka, kanye nokungcola kwezinhlayiya. Ucwaningo oluvela ngo-2024 lubonisa ukuthi ububanzi bobuningi obulawulwayo, ngokuvamile obuphakathi kuka-1 wt% kuya ku-5 wt% wezakhiwo ezisekelwe ku-colloidal silica, buveza ibhalansi engcono kakhulu phakathi kokusebenza kahle kokususa kanye nokunciphisa amaphutha. Ubuningi obukhulu kakhulu bukhulisa ukushayisana okunamandla, okuholela ekukhuphukeni okuphindwe kabili kuya kathathu kokubalwa kwamaphutha ngesentimitha lesikwele, njengoba kuqinisekiswe yi-atomic force microscopy kanye nokuhlaziywa kwe-ellipsometry. Ukulawulwa kobuningi obuqinile kuthuthukisa nokungalingani kwe-with-wafer (WIWNU), ukuqinisekisa ukuthi izinto zisuswa ngokulinganayo kulo lonke i-wafer, okubalulekile kumadivayisi e-node semiconductor athuthukile. Ubuningi obuhlala njalo buyasiza ukuvimbela ukuhamba kwenqubo okungabeka engcupheni izinhloso zobukhulu befilimu noma ukuba flat.
Ukwandiswa Kwempilo Yokudakwa Kwe-Slurry kanye Nokunciphisa Izindleko Zokusetshenziswa
Amasu okulawula ukuhlushwa kwe-slurry—kufaka phakathi ukuqapha ngesikhathi sangempela ngamamitha obuningi be-slurry e-ultrasonic—andisa isikhathi sokuphila esiwusizo se-slurry yokupholisha ye-CMP. Ngokuvimbela ukumunca ngokweqile noma ukuxutshwa ngokweqile, imishini yokuhlelwa kwemishini yamakhemikhali ifinyelela ukusetshenziswa okuhle kwezinto ezisetshenziswayo. Le ndlela inciphisa imvamisa yokufakwa esikhundleni kwe-slurry futhi ivumela amasu okuvuselela kabusha, yehlisa izindleko eziphelele. Isibonelo, ekusetshenzisweni kwe-slurry yokupholisha ye-CeO₂, ukulungiswa kobuningi ngokucophelela kuvumela ukulungiswa kabusha kwamaqoqo e-slurry futhi kunciphisa ivolumu yemfucuza ngaphandle kokulahlekelwa ukusebenza. Ukulawulwa kobuningi okuphumelelayo kwenza onjiniyela bezinqubo bakwazi ukubuyisa nokuphinda basebenzise i-slurry yokupholisha ehlala ngaphakathi kwemingcele yokusebenza eyamukelekayo, okuqhuba ukonga izindleko okwengeziwe.
Ukuphindaphinda Okuthuthukisiwe kanye Nokulawulwa Kwenqubo Yokukhiqiza Ama-Node Athuthukisiwe
Izinhlelo zokusebenza zezimboni ze-semiconductor zanamuhla zidinga ukuphindaphindeka okuphezulu esinyathelweni sokuhlela amakhemikhali-mechanical. Ekukhiqizweni kwama-node athuthukile, ngisho nokushintshashintsha okuncane kobuningi be-slurry kungabangela ukuhlukahluka okungamukeleki emiphumeleni ye-wafer. Ukuzenzakalela kanye nokuhlanganiswa kwamamitha e-slurry density e-inline ultrasonic—njengalawo akhiqizwe yi-Lonnmeter—kwenza kube lula ukuphendula okuqhubekayo, kwesikhathi sangempela kokulawula inqubo. Lawa mathuluzi anikeza izilinganiso ezinembile ezindaweni zamakhemikhali ezinzima ezivamile ze-CMP, esekela izinhlelo ze-closed-loop eziphendula ngokushesha ekuphambukeni. Ukulinganisa ubuningi okuthembekile kusho ukufana okukhulu kusuka ku-wafer kuya ku-wafer kanye nokulawula okuqinile phezu kwe-MRR, okubalulekile ekukhiqizweni kwe-semiconductor engaphansi kwe-7nm. Ukufakwa kwemishini efanele—ukubekwa kahle emgqeni wokulethwa kwe-slurry—nokugcinwa njalo kubalulekile ukuqinisekisa ukuthi amamitha asebenza ngokwethembeka futhi anikeze idatha ebalulekile ukuze inqubo izinze.
Ukugcina ubuningi obanele be-slurry kubalulekile ekukhuliseni isivuno somkhiqizo, ukunciphisa ukukhubazeka, kanye nokuqinisekisa ukwenziwa okungabizi kakhulu ezinqubweni ze-CMP.
Imibuzo Evame Ukubuzwa (Imibuzo Evame Ukubuzwa)
Uyini umsebenzi wemitha yobuningi be-slurry enqubweni yokuhlela kwamakhemikhali?
Imitha yobuningi be-slurry idlala indima ebalulekile enqubweni yokuhlela kwamakhemikhali ngokulinganisa njalo ubuningi kanye nokuhlushwa kwe-slurry yokupholisha. Umsebenzi wayo oyinhloko ukuhlinzeka ngedatha yesikhathi sangempela ngebhalansi yokuhluza kanye neyamakhemikhali ku-slurry, ukuqinisekisa ukuthi kokubili kungaphakathi kwemingcele eqondile yokuhlela kahle kwe-wafer. Lokhu kulawula kwesikhathi sangempela kuvimbela amaphutha njengokuklwebheka noma ukususwa kwezinto ezingalingani, okuvamile ngezingxube ze-slurry ezixutshwe kakhulu noma ezingaxutshwe kahle. Ubuningi be-slurry obuqhubekayo buyasiza ekugcineni ukuphindaphindeka kuyo yonke imisebenzi yokukhiqiza, kunciphisa ukuhlukahluka kwe-wafer kuya ku-wafer, futhi kusekela ukwenziwa ngcono kwenqubo ngokubangela izenzo zokulungisa uma kutholwa ukuphambuka. Ekwenziweni kwe-semiconductor okuthuthukisiwe kanye nezicelo zokuthembeka okuphezulu, ukuqapha okuqhubekayo kunciphisa nokungcola futhi kusekela izinyathelo zokuqinisekisa ikhwalithi eziqinile.
Kungani i-CeO₂ polishing slurry ikhethwa ezinyathelweni ezithile zokuhlela embonini ye-semiconductor?
I-Cerium oxide (CeO₂) polishing slurry ikhethwa ngezinyathelo ezithile ze-semiconductor planarization ngenxa yokukhetha kwayo okuhlukile kanye nokuhambisana kwamakhemikhali, ikakhulukazi kumafilimu engilazi ne-oxide. Izinhlayiya zayo ezifanayo zokuhuzuka ziphumela ekuhleleni kwekhwalithi ephezulu ngezilinganiso eziphansi kakhulu zeziphambeko kanye nokuklwebheka okuncane kobuso. Izakhiwo zamakhemikhali ze-CeO₂ zivumela amazinga okususa azinzile futhi aphindaphindekayo, abalulekile ezinhlelweni ezithuthukisiwe ezifana ne-photonics kanye namasekethe ahlanganisiwe aphezulu. Ngaphezu kwalokho, i-CeO₂ slurry imelana nokuhlangana, igcina ukumiswa okuqhubekayo ngisho nangesikhathi sokusebenza kwe-CMP ende.
Imitha yokulinganisa i-slurry density isebenza kanjani uma iqhathaniswa nezinye izinhlobo zokulinganisa?
Imitha yokulinganisa ubuningi be-slurry esebenza ngokudlulisa amaza omsindo nge-slurry kanye nokulinganisa isivinini kanye nokunciphisa kwala maza. Ubuningi be-slurry buthinta ngqo ukuthi amaza ahamba ngesivinini esingakanani kanye nezinga lokuncipha kwawo. Le ndlela yokulinganisa ayiphazamisi futhi inikeza idatha yokuhlushwa kwe-slurry ngesikhathi sangempela ngaphandle kokudinga ukuhlukanisa noma ukuphazamisa ngokomzimba ukugeleza kwenqubo. Izindlela ze-Ultrasonic zibonisa ukuzwela okuncane eziguquguqukweni ezifana nesivinini sokugeleza noma usayizi wezinhlayiya uma kuqhathaniswa nezinhlelo zokulinganisa ubuningi be-mechanical (ezisekelwe ku-float) noma ze-gravimetric. Ekuhleleni kwe-chemical mechanical, lokhu kuhunyushwa kube ukulinganisa okuthembekile, okuqinile ngisho nasezinhlayiya ezigeleza kakhulu, ezicebile ngezinhlayiya.
Amamitha okulinganisa ukungcola kufanele afakwe kuphi ohlelweni lwe-CMP?
Izindawo zokufaka ezifanele kakhulu zemitha yobuningi be-slurry emishinini yokuhlelwa kwemishini yamakhemikhali zifaka:
- Ithangi lokujikeleza kwegazi: ukuqapha njalo ubuningi be-slurry ngaphambi kokusatshalaliswa.
- Ngaphambi kokulethwa endaweni yokupholisha: ukuqinisekisa ukuthi i-slurry enikeziwe ihlangabezana nezimfuneko zobuningi obuqondiwe.
- Ngemva kwezindawo zokuxuba udoti: ukuqinisekisa ukuthi amaqoqo asanda kulungiswa ahambisana nezindlela ezidingekayo ngaphambi kokungena ku-process loop.
Lezi zikhundla zamasu zivumela ukutholwa okusheshayo nokulungiswa kwanoma yikuphi ukuphambuka ekugxilweni kwe-slurry, ukuvimbela ikhwalithi ye-wafer ephazamisekile kanye nokuphazamiseka kwenqubo. Ukubekwa kunqunywa yi-dynamics yokugeleza kwe-slurry, ukuziphatha okuvamile kokuxuba, kanye nesidingo sempendulo esheshayo eduze kwe-planarization pad.
Ukulawulwa okuqondile kokuhlushwa kwe-slurry kuthuthukisa kanjani ukusebenza kwenqubo ye-CMP?
Ukulawulwa kokuhlushwa kwe-slurry okunembile kuthuthukisa inqubo yokuhlela kwamakhemikhali ngokuqinisekisa amazinga okususa afanayo, ukunciphisa ukuhlukahluka kokumelana kweshidi, kanye nokunciphisa imvamisa yeziphambeko zomphezulu. Ubuningi be-slurry obuzinzile bandisa kokubili i-polishing pad kanye ne-wafer lifetime ngokuvimbela ukusetshenziswa ngokweqile noma ukusetshenziswa okungafanele. Futhi kunciphisa izindleko zenqubo ngokwenza ngcono ukusetshenziswa kwe-slurry, ukunciphisa ukuvuselelwa kabusha, kanye nokusekela isivuno esiphezulu sedivayisi ye-semiconductor. Ikakhulukazi ekukhiqizeni okuthuthukisiwe kanye nokwakhiwa kwedivayisi ye-quantum, ukulawulwa kwe-slurry okuqinile kusekela ukuthamba okuphindaphindekayo, ukusebenza kukagesi okuqhubekayo, kanye nokuvuza okuncishisiwe kuzo zonke izakhiwo zedivayisi.
Isikhathi sokuthunyelwe: Disemba-09-2025
