Ukulinganiswa kokugeleza kubalulekile ekusikeni ucingo lwedayimane lwe-silicon wafer, njengoba kuqinisekisa ukulethwa okunembile koketshezi lokusika esibonakalayo se-wire-wafer—okubalulekile ekugcineni ukupholisa okuhle, ukuthambisa, kanye nokususwa kwemfucumfucu.RIdatha yokugeleza kwesikhathi se-eal ivimbela ukunikezwa koketshezi okunganele noma okweqile, obekungadala ukushisa ngokweqile, ukuphuka kwentambo, amaphutha obuso, noma imfucuza. Ukulinganisa okunembile kunciphisa ukuguquguquka kwenqubo, kuvikela ukuthamba kwe-wafer kanye nobuqotho bobuso, kwandise isikhathi sokuphila kwentambo, futhi kuthuthukisa ukusebenza kahle kwezinsizakusebenza.
Ukubuka Konke Kokusika I-Silicon Wafer kanye Nendima Yokusika Amanzi
Ukusikwa kwentambo yedayimane kuyindlela evelele yokusika ama-ingot e-silicon e-monocrystalline kanye ne-multicrystalline abe ama-wafer ukuze kusetshenziswe ama-semiconductor kanye ne-photovoltaic. Kule nqubo, intambo yensimbi—ngokuvamile engu-40–70 μm ububanzi—imbozwa ngama-grain abrasive edayimane. Intambo ihamba ngesivinini esikhulu, futhi amadayimane afakwe ngaphakathi agaya i-silicon ngokuhuzuka, anciphise amaphutha ebusweni futhi akhuthaze ukufana kwe-wafer. Izintambo ezinobubanzi obuncishisiwe ezethulwe eminyakeni yamuva zinciphisa ukulahleka kwe-kerf, okubhekisela ezintweni ezichithwa njengezinhlayiya ze-silicon ezincane ngesikhathi sokusika. Ukulahleka kwe-kerf kunqunywa ububanzi bentambo kanye nokuphakama kwama-grain abrasive avela ebusweni bentambo.
Ukusikwa Kwentambo Yedayimane
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Ukusika uketshezi kudlala indima ebalulekile ekusaheni ucingo lwedayimane. Umsebenzi wabo oyinhloko ukupholisa kokubili i-ingot kanye nocingo, ukuvimbela ukushisa ngokweqile okungalimaza i-silicon noma kunciphise impilo yocingo. Baphinde bahlanze izinhlayiya ezincane ze-silicon ezikhiqizwa ngesikhathi sokusika, okusiza ukugcina indawo ehlanzekile, ukuvimbela ukuphinda kubekwe udoti, kanye nokunciphisa imifantu emincane ebusweni be-wafer. Ngaphezu kwalokho, ukusika uketshezi kugcoba inqubo, kunciphisa ukungqubuzana phakathi kocingo ne-silicon, ngaleyo ndlela kwandise isikhathi sokuphila kocingo futhi kuthuthukise ikhwalithi yokusika. Ukwakheka kanye nezakhiwo zomzimba zoketshezi lokusika lwe-wafer ye-silicon—njengokujiya kanye nobuningi—kumele kuphathwe ngokucophelela ukuze kuthuthukiswe ukupholisa, ukususwa kwe-chip, kanye nokuvikelwa kocingo.
Kunezinhlobo eziningana zoketshezi lokusika i-wafer, okuhlanganisa uketshezi olusekelwe emanzini olunezithasiselo zokukhulisa ukuthambisa kanye nokumiswa kwezinhlayiya. Ukukhetha kuncike ekwakhiweni kwemishini, imininingwane ye-wafer, kanye nemikhawulo yemvelo. Izibonelo zifaka amanzi angenawo ama-ion anama-surfactants noma ama-glycols, aklanyelwe ukulinganisela ukusebenza kahle kokupholisa ngokwakhiwa kwezinsalela eziphansi.
Ukuthuthuka kwezintambo zedayimane ezincane kakhulu ezitshalweni zesimanje ze-wafer kwandisa izinselele ekulethweni koketshezi kanye nokulawulwa kwenqubo. Njengoba ububanzi bezintambo buncipha ngaphansi kwama-μm angu-40, ingozi yokuphuka kwentambo iyanda futhi ukubekezelela ukuguquguquka kwenqubo kuyaqina. Ukulinganiswa kwezinga lokugeleza okunembile—okusekelwa ubuchwepheshe obufana nokusika amamitha okugeleza koketshezi, izinzwa zokulinganisa ukugeleza okunembile kakhulu, kanye nezinzwa zokugeleza kobuningi be-Coriolis—kubalulekile ukuze kulondolozwe ukupholisa okuphumelelayo kanye nokususwa kwemfucuza. Izinzwa zokuqapha uketshezi kanye nezixazululo zokulinganisa ukugeleza koketshezi olusika ezimbonini zenza opharetha bakwazi ukulandelela nokulungisa amazinga okugeleza ngesikhathi sangempela, bafinyelele ukugcotshwa okuhle kakhulu kanye nekhwalithi ephezulu. Ukunemba kwamamitha okugeleza e-Coriolis kubaluleke kakhulu ekuphatheni uketshezi olunobukhulu obuhlukahlukene kanye nokuqina, ukuqinisekisa izimo ezihambisanayo ngisho nalapho isivinini sokusika kanye nokucindezelwa kwentambo kukhuphuka.
Lesi sidingo esikhulayo sokunemba sishintshe ukugxila ekuqapheni amapharamitha oketshezi aguqukayo njengesilinganiso sokugeleza, ubuningi, kanye ne-viscosity. Amathuluzi afana nalawo avela eLonnmeter ahlinzeka ngezilinganiso ezithembekile, zesikhathi sangempela ezibalulekile ekuqinisekisweni kwekhwalithi kanye nokwenza ngcono inqubo emisebenzini yokusika ucingo lwedayimane ethuthukisiwe. Njengoba ubuchwepheshe bezintambo buqhubeka nokuthuthuka, ukuhlanganiswa kobuchwepheshe obuqinile bokulinganisa ukugeleza kubalulekile ekusekeleni ukugeleza kwe-wafer, ukunciphisa ukulahleka kwe-kerf, kanye nokunciphisa izidingo zokuqeda ezingezansi zomkhakha wokukhiqiza i-wafer ye-silicon.
Izinselele Zokulethwa Koketshezi Ekusikeni Izintambo Zedayimane Ngokuqondile
Ekusikweni kwentambo yedayimane kwama-wafer e-silicon amancane kakhulu—ikakhulukazi lawo angaphansi kwama-µm angu-40—ukuletha inani elifanele loketshezi lokusika lwe-silicon wafer endaweni yokusika kuba yinselele enkulu. Njengoba ukujiya kwentambo kuncipha, nendawo yokugeleza koketshezi iyancipha. Ukugcina ukutholakala koketshezi lokusika njalo kubalulekile ukuqinisekisa ukugcotshwa, ukulawulwa kokushisa, kanye nokususwa kwemfucumfucu endaweni yokuxhumana.
Ukugeleza koketshezi okungaguquki noma okunganele kuholela ngqo ekumuncweni kwe-wafer, lapho i-wafer inamathela khona ngokungathandeki emishinini ngenxa yokungagcobi ngokwanele. Lokhu akugcini nje ngokuphazamisa inqubo yokusika kodwa futhi kwandisa ingozi yokuphuka kwe-wafer noma ukulimala. Ukungalungi kwendawo kukhuphuka kakhulu lapho ucingo ne-wafer kungatholi ukugcotshwa okuqhubekayo nokupholisa okuvela kuketshezi lokusika i-wafer yedayimane. Izindawo ezonakele kanye namaphutha amancane aphumelayo kunciphisa ikhwalithi ye-wafer kanye nokukhiqiza, okudala izithiyo ezinkulu ezimbonini ze-semiconductor kanye ne-photovoltaic.
Izici ezintathu eziyinhloko zithinta ukungena koketshezi esikhaleni sokusika esincane: i-geometry yentambo, isivinini sokusika, kanye nesenzo se-capillary. I-geometry yentambo—ikakhulukazi ububanzi bentambo kanye nokusatshalaliswa kwezinhlayiya zedayimane—ithonya ngqo ukuthi uketshezi lokusika i-silicon wafer lugeleza kalula kangakanani futhi lunamathele endaweni yokuxhumana. Uma usebenzisa izintambo ezingaphansi kwama-µm angu-40, indawo encane yobuso ivimbela ukunyakaza okukhululekile koketshezi. Isivinini sokusika esiphezulu sinciphisa isikhathi esitholakalayo soketshezi ukufinyelela nokupholisa isixhumi, okuholela ekushiseni ngokweqile kwendawo kanye nokugcotshwa okubi. Isenzo se-capillary, ikhono lemvelo loketshezi lokudonswa ezindaweni ezincane, linquma kakhulu ukugcinwa koketshezi. Kodwa-ke, amabhuloho afanayo oketshezi athuthukisa ukuthuthwa koketshezi angaletha ukunamathela kwe-capillary phakathi kwezintambo eziseduze, okubangela ukucindezeleka okungafani kanye nokwehluka kobukhulu be-wafer.
Ukwethulwa kwezinhlobo zoketshezi olusezingeni eliphezulu lokusika i-wafer—kufaka phakathi izixazululo ezithuthukisiwe ze-nanoparticle—kuhlinzeka ngentuthuko elinganisekayo. Uketshezi oluklanywe nge-nanoparticles ze-SiO₂ noma ze-SiC lungena ezikhaleni ezincane ngempumelelo enkulu ngenxa ye-viscosity ethuthukisiwe kanye nokusebenzisana kobuso. Lawa manzi athuthukisa ukuthambisa futhi athwala ukushisa kahle kakhulu, okuholela ekubeni lukhuni okuphansi kobuso kanye nokuba bushelelezi kwe-wafer okuthuthukisiwe. Ucwaningo lubonisa ukuthi ukusebenzisa uketshezi olugcwele i-nanoparticle kushintsha insimu yokushisa ngesikhathi sokusika, kunciphisa kakhulu ukucindezeleka okusongela ubuqotho be-wafer. Lokhu, kuhlanganiswe namasu afana nokudlidliza kwe-ultrasonic ukukhulisa ukuthuthwa kwe-capillary, kuvumela ukulethwa koketshezi olufana kakhulu lokusika i-diamond wire.
Ukulethwa koketshezi njalo kudinga ukuqapha kanye nokulungiswa okunembile, ngesikhathi sangempela. Ukulinganiswa kokugeleza koketshezi olusikiwe kwezimboni ngokunemba okuphezulu kuba yinto ebalulekile, ikakhulukazi ezinqubweni ezilawulwa ngokuqinile. Ukusebenzisa imitha yokugeleza koketshezi yokusika—njengenzwa yokulinganisa ukugeleza kobuningi beCoriolis enembile kakhulu—kuvumela ukulawulwa okunembile kwesilinganiso sokulethwa. Amamitha okujiya kanye ne-viscosity kaLonnmeter, uma ehambisana namathuluzi okulinganisa izinga lokugeleza anembile, anegalelo ekwenzeni ngcono ukuhlinzekwa koketshezi ukuze ngisho nama-wafer amancane kakhulu asikwe kahle, ngengozi encane yokukhubazeka.
Ukulinganisa Ukugeleza Koketshezi Emisebenzini Yokusika I-Wafer
Ukulinganisa izinga lokugeleza okunembile kubalulekile ekwenzeni ngcono ukulethwa koketshezi lokusika ekusikeni intambo yedayimane yama-wafer e-silicon. Ukusebenza kahle koketshezi lokusika i-wafer ye-silicon kwakheka ngqo ukupholisa, ukuthambisa, kanye nokususwa kwemfucumfucu endaweni yokuxhumana, kuthinta ikhwalithi yobuso be-wafer, ukulahlekelwa yi-kerf, kanye nesivuno sokukhiqiza sonke. Ukugeleza okunganele noma okweqile kushintsha ukusebenza kahle okunamandla, kwandisa ukuguguleka kwamathuluzi, futhi kungabangela ikhwalithi ye-wafer engaguquki noma izindleko zezinsiza eziphezulu. Ucwaningo oluqavile lubonisa ukuthi ukugoba kobuso (i-Ra) kanye nomonakalo ongaphansi komhlaba kungancishiswa ngokugcina izinga lokugeleza koketshezi lokusika ngaphakathi kobubanzi obufanele be-0.15–0.25 L/min yemishini ejwayelekile yentambo eyodwa, njengoba ukugeleza okunganele kuholela ekuqhekekeni okuncane kanye nokuqongelela udoti, kuyilapho ukugeleza okweqile kungenisa ukuphazamiseka kanye nokusetshenziswa okungadingekile.
Ubuchwepheshe Bokusika Ukulinganisa Izinga Lokugeleza Koketshezi
Amamitha okugeleza koketshezi okusika ahlanganiswa emigqeni yokuphakelwa koketshezi, elinganisa umthamo woketshezi oluhlinzekiwe lokusika ucingo lwedayimane ngesikhathi sangempela. Ubuchwepheshe obuvamile bokulinganisa ukugeleza buhlanganisa izinhlobo zemishini, ze-elekthronikhi, neze-ultrasonic:
- Amamitha okugeleza omshini, njengemiklamo ye-turbine kanye ne-paddlewheel, asebenzisa izingxenye ezijikelezayo ezisuswa ukugeleza koketshezi. Alula futhi aqinile kodwa aguga kalula ngenxa yoketshezi olugcwele ukurhawuzelela.
- Amamitha okugeleza kagesi, ikakhulukazi imiklamo kagesi, alinganisa ijubane loketshezi kusetshenziswa izimiso zokungeniswa kagesi, okunikeza ukusebenza okuthembekile, okukhanyayo kokugcina uketshezi oluqhubayo.
- Amamitha okugeleza e-Ultrasonic asebenzisa amaza omsindo avame kakhulu adluliselwa futhi amukelwe kuwo wonke umbhobho. Ngokulinganisa umehluko wesikhathi wokuhamba komsindo kanye nokugeleza, lawa madivayisi ahlinzeka ngesilinganiso esingaphazamisi nesinembile esifanele izinhlobo ezahlukene zoketshezi lokusika i-wafer.
Ukulinganiswa kokugeleza kobuningi beCoriolis kuvelele ekusetshenzisweni lapho kudingeka khona ukulawulwa okunembile kobuningi boketshezi, kungakhathaliseki ukuthi i-viscosity noma izinguquko zokushisa. Izinzwa zokugeleza kobuningi beCoriolis zilinganisa ngqo izinga lokugeleza kobuningi ngokusekelwe kumphumela weCoriolis, zinikeza ukunemba okuphezulu nokufaneleka kokubili uketshezi lokusika ucingo lwedayimane olusekelwe emanzini kanye nolusekelwe ku-oyili. I-Lonnmeter ikhiqiza amamitha okuqina kanye ne-viscosity, okuvumela futhi ukuqapha izakhiwo zoketshezi ukuze kube nokuvumelana kanye nokulawula inqubo efanele ekusikeni kwe-silicon wafer.
Amapharamitha Okulinganisa Okubalulekile kanye Nokubekwa Kwezinzwa
Ukulinganisa okunembile kokugeleza koketshezi kokusika kwe-wafer kudinga ukunakwa kwemingcele eminingana ebalulekile:
- Izinga lokugeleza (L/min): Ukulinganisa okuyinhloko kokuthuthukisa inqubo nokuqinisekisa ikhwalithi.
- Ubuningi kanye nokujiya: Kokubili kuthinta kakhulu ukusebenza kokupholisa, ukuthuthwa okuhudulayo, kanye nokususwa kwemfucumfucu.
- Izinga lokushisa: Lithinta ukujiya kanye nokuziphatha koketshezi endaweni yokusikwa.
Ukubekwa kwenzwa kubaluleke kakhulu. Izinzwa zokulinganisa ukugeleza kumele zibekwe ngqo emgqeni wokulethwa koketshezi eduze nendawo yokusika ngangokunokwenzeka ukuze kuncishiswe ukungafani okubangelwa ukumelana kwamapayipi, ukuvuza, noma ukuhwamuka ngaphambi kwesixhumi esinqunyiwe. Ukulinganiswa kwe-inline kwesikhathi sangempela kuqinisekisa ukuthi inani lokugeleza elibikiwe lihambisana nokuphakelwa kwangempela endaweni yokusika ucingo lwedayimane.
Umsebenzi Wokulinganisa Ukugeleza Ekulondolozeni Izindawo Ezinhle Zokusika
Izinzwa zokulinganisa ukugeleza zibalulekile ekuqapheni ngesikhathi sangempela kanye nokulawula okuguquguqukayo kokulethwa koketshezi ekusikeni kwe-silicon wafer yezimboni. Ukugcina izinga lokugeleza elifanele kuqinisekisa ukushabalaliswa okwanele kokushisa, ukususwa okuqhubekayo kwemfucumfucu, kanye nokugcotshwa okufanayo entanjeni yedayimane. Ngaphandle kwalokhu, ukuzinza kwenqubo kuyehla, impilo yentambo iyafinyela, futhi isivuno siyahlupheka ngenxa yengozi eyengeziwe yokukhubazeka kobuso noma ukulahlekelwa kakhulu kwe-kerf.
Ngokuhlanganisa ukulinganisa izinga lokugeleza okunembile kakhulu nezinye izinhlaka zempendulo (isb., isivinini sentambo, izinga lokuphakelayo), abakhiqizi bangaphoqelela ukulawulwa okuguquguqukayo komkhawulo wenqubo, bexhumanisa ngqo ukulungiswa kwezinga lokugeleza nokusebenza kokusika okubonwe. Ngenxa yalokho, noma yikuphi ukuphambuka emvilophini yokugeleza okuhleliwe kubangela isenzo sokulungisa ngokushesha, kuvikele kokubili ikhwalithi yenqubo kanye nokusebenza kahle kwezinsiza.
Ngamafuphi, ukulinganisa ukugeleza koketshezi lokusika kwezimboni—okuncike ezinzwa zokulinganisa ukugeleza okuqinile kanye nedatha yesikhathi sangempela—kusebenza njengesisekelo sokukhiqizwa kwe-silicon wafer ekhiqiza kakhulu futhi engabizi kakhulu enkathini yokusika ucingo lwedayimane.
Ukulinganiswa Kokugeleza Kwesisindo Se-Coriolis: Izimiso Nokusetshenziswa
Ukulinganiswa kokugeleza kobuningi beCoriolis kusekelwe ekutholeni amandla asetshenziswa uketshezi oluhamba ngamapayipi adlidlizayo. Njengoba uketshezi lugeleza—njengoketshezi lokusika ucingo lwedayimane noma uketshezi olukhethekile lokusika i-silicon wafer—amapayipi abhekana nokushintsha kwesigaba okuncane, okulinganiselwe. Lokhu kushintsha kuhambisana nesilinganiso sokugeleza kobuningi, okunikeza ukulinganiswa okuqondile, kwesikhathi sangempela kwesisindo soketshezi lokusika olulethwayo. Isimiso esifanayo sivumela ukulinganiswa ngasikhathi sinye kobuningi boketshezi, kusekela ukunemba okuphezulu kuzo zonke izinhlobo zoketshezi ezishintshayo, ukwakheka, kanye namazinga okushisa—isidingo esibalulekile ekukhiqizweni kwe-silicon wafer kanye nezicelo zokusika ucingo lwedayimane.
Izinzuzo zale ndlela yezinhlobo zoketshezi lokusika i-wafer, ikakhulukazi uma kusetshenziswa uketshezi lokusika ucingo lwedayimane olusebenza kahle kakhulu, zinkulu kakhulu. Ukulinganiswa kokugeleza kwe-Coriolis akuxhomekile ekuqineni koketshezi kanye noshintsho lokwakheka, kuhlala kunembe kakhulu phakathi kokuba khona kwezinhlayiya ezihudulayo, izithako ezincane, noma izingxube ezingafani ezivame ukutholakala ekusikeni uketshezi lwe-wafer ye-silicon. Lokhu kuqina kuyenza ibe ngcono kunezindlela zendabuko zokugeleza kwe-volumetric, ezingathinteka ngamabhamuza, izinhlayiya ezilengisiwe, kanye nezakhiwo ezishintshayo zomzimba zoketshezi lokusika oluthuthukisiwe.
Ukusikwa kwe-wafer ye-semiconductor kuncike kakhulu kubuchwepheshe obuthuthukisiwe benzwa yokugeleza koketshezi ukuqinisekisa ukuqapha okuthembekile koketshezi lokusika kwama-wafer e-silicon. Izinzwa zokugeleza kobuningi be-Lonnmeter eziqondile, ezisebenzisa umphumela we-Coriolis, zisetshenziswa ngqo emigqeni yenqubo. Lokhu kwenza ukulethwa okunembile nokuqapha koketshezi lokusika i-nano-fluid kanye ne-diamond wire ngesikhathi sokusika i-wafer. Izimpawu zokuwohloka koketshezi, ukungahambisani kwengxube, noma ukushintsha kobuningi kutholwa ngokushesha, okuvumela ukungenelela kokulawula okusheshayo ukuze kugcinwe isivuno senqubo kanye nekhwalithi yobuso.
Ukuqhathanisa izinzwa zokugeleza kobuningi beCoriolis nezinye izinzwa zokuqapha uketshezi olusikiwe—njengezinhlelo zokugeleza ezishisayo, ze-electromagnetic, noma ze-ultrasonic—kwembula amandla amaningana. Izinzwa zokugeleza kobuningi beCoriolis zihamba phambili ekulinganisweni kokugeleza okunembile okuphezulu futhi ziletha ukufundwa okusekelwe kubuningi okungathinteki ukushintshashintsha kwe-viscosity noma izakhiwo ze-magnetic. Amamitha e-electromagnetic kanye ne-ultrasonic alwa nezingxube zoketshezi ezisikiwe eziqukethe ama-nanoparticles, ama-air pocket, noma ukushintshashintsha kobuningi bemizuzu, okuvame ukuholela ekulinganisweni kwesilinganiso sokugeleza okungathembekile kanye nokwanda kwemvamisa yokugcinwa.
Ukunemba kwemitha yokugeleza kwe-Coriolis kugcinwa ngaphansi kokushintshashintsha kokwakheka koketshezi, njengoba izinhlelo zokucubungula isignali kanye nokunciphisa izinga lokushisa zihlunga kahle umsindo kanye nokwehluka kwemvelo. Abasebenzi bangasebenzisa idatha yesikhathi sangempela ukuze bathuthukise ukupholisa, ukugcoba, kanye nokususwa kwezinhlayiya, besabela ezicini ezahlukahlukene zezinhlobo ezahlukene zoketshezi olusikwa nge-wafer kanye nezingxube ze-nanofluid.
Ukuguqulwa kokulinganiswa kokugeleza kwesisindo se-Coriolis kube ukusaha kwentambo okunciphile kakhulu kanye noketshezi lokusika olunezinhlayiya ezincane kubonisa ushintsho ekuqapheni kwezimboni. Izinzwa zilinganisa ngokuthembekile ukugeleza kwesisindo sangempela kanye nobuningi, kungakhathalekile ukuthi okuqukethwe yizinhlayiya noma ukungafani koketshezi, okuvumela ukulawulwa kwe-closed-loop kanye nokuphathwa koketshezi okuzenzakalelayo okwenzelwe ukusika i-wafer. Leli zinga lokulinganisa ukugeleza okunembile okuphezulu libalulekile ekugcineni ukuzinza kwenqubo, ukunciphisa ukulahleka kwezinto, kanye nokuqinisekisa ubuqotho bomphezulu ngesikhathi sokwenziwa kwe-wafer ye-silicon kanye nezinqubo zokusika intambo yedayimane.
Ukuhlanganisa Idatha Yokulinganisa Ukugeleza Ekulawuleni Inqubo
Ukulinganisa ukugeleza kwesikhathi sangempela kusetshenziswa izinzwa zokugeleza kobuningi beCoriolis kushintshe ukuphathwa koketshezi olusikayo ngesikhathi sokusika i-wafers ye-silicon wire wire. Amamitha okujiya kanye ne-viscosity, njengalawo akhiqizwa yi-Lonnmeter, avumela ukuqapha ngokushesha izakhiwo zoketshezi kanye nesivinini sokugeleza, okusekela ngqo ukulawulwa kwenqubo okunembile.
Ukugcina amazinga okugeleza afanele kubalulekile ekupholiseni, ekuhlanzeni, nasekugcobeni ucingo lwedayimane kanye nama-wafer e-silicon ngempumelelo. Amamitha okugeleza kobuningi be-Coriolis ayaphumelela kule ndawo ngokunikeza impendulo enembile kakhulu, yesikhathi sangempela mayelana nokugeleza kobuningi kanye nezici zoketshezi. Ngale datha, izinhlelo ezizenzakalelayo zingalungisa isivinini sephampu, izikhundla zamavalvu, noma ziphinde zisebenzise amazinga ukuze zilethe ngokunembile ivolumu edingekayo kanye nokwakheka koketshezi lokusika i-wafer. Isibonelo, ngesikhathi semijikelezo yokusika okusheshayo, idatha yenzwa ingabangela ukulethwa koketshezi okwandisiwe ukuze kususwe udoti ongcono futhi kuphole, kuyilapho imijikelezo ehamba kancane ingadinga ukugeleza okuncishisiwe ukuze kugwenywe imfucuza.
Impendulo evela ezinzwa zokulinganisa ukugeleza nayo ibalulekile ekuphenduleni ezimweni zoketshezi ezishintshayo. Njengoba i-viscosity noma ubuningi boketshezi bushintsha—ngenxa yokushintsha kwezinga lokushisa noma ukungcola—amamitha angaphakathi e-Lonnmeter abona lokhu kushintsha ngokushesha, okuvumela izinhlelo zokulawula ukuthi zibuyisele ngokulungisa amazinga okugeleza noma ukuqala ukuhlunga uketshezi. Le ndlela equkethe idatha eningi, eqondiswa idatha iqinisekisa ukuthi uketshezi luhlala ngaphakathi kwezidingo eziqinile ukuze kusebenze kahle ukusika.
Ezindaweni ezinomthamo omkhulu, ikhono lokuqapha nokulawula ukugeleza koketshezi ngesikhathi sangempela lisekela ukujiya okuhambisanayo futhi linciphisa ukuvela kwamaphutha abizayo, njengoba kuboniswe emigqeni yokukhiqiza ehamba phambili e-Asia naseYurophu. Ukuphathwa koketshezi okuthuthukisiwe kusekela nokugcinwa kokubikezela, kwandise isikhathi sokuphila kwentambo yedayimane.
Imisebenzi yezimboni izuza kakhulu ezinhlelweni zokusika uketshezi ezilawulwa ukugeleza. Ukuphathwa koketshezi okusebenzayo kunciphisa izindleko zokusetshenziswa kanye nokulahla ngokuqinisekisa ukuthi kusetshenziswa uketshezi olwanele ku-wafer ngayinye, okusekela ukusimama kanye nokuhambisana nemithetho. Ukunciphisa imfucuza yoketshezi—okuvunyelwe yimpendulo eqhubekayo kanye nokulungiswa okusekelwe kudatha yezinzwa—kuhumushela ekunciphiseni izindleko zokusebenza kanye nokunciphisa umthelela wemvelo.
Ngamafuphi, ukuhlanganiswa kwedatha yokulinganisa ukugeleza kwesikhathi sangempela, okunikwe amandla yizixazululo ze-Lonnmeter eziqondile, akuyona nje isisekelo sokuqinisekisa ikhwalithi ye-wafer kodwa futhi kuyinzuzo yokusebenza kwenqubo yokusika ucingo lwedayimane. Kuletha ukuthuthuka okulinganiselwe ekuqedweni kwendawo, ukuthembeka kwemishini, isivuno sokukhiqiza, kanye nokusebenza kahle kwezindleko.
Ukuqonda Kokuhlola kanye Nesiqondiso Sezimboni
Izifundo zokuhlola zakamuva zishintshe izindlela ezinhle kakhulu zokulethwa koketshezi lokusika ama-wafer e-silicon wire. Ucwaningo lubonisa ukuthi ukuhlinzekwa koketshezi lokusika okulawulwa kahle, ikakhulukazi kusetshenziswa amasu athuthukile, kuhlobene ngqo nokumuncwa kwe-wafer okuphansi kanye nekhwalithi engcono yobuso.
Ukusetshenziswa komphumela we-capillary we-ultrasonic ekulethweni koketshezi kuvele njengento eshintsha umdlalo. Amagagasi e-Ultrasonic aqhuba uketshezi olusikayo lujule luye ezinqeni ezincane kakhulu—ikakhulukazi ezindaweni ezincane kune-50 μm—lapho izindlela zokuphakelwa zendabuko zivame ukwehluleka khona. Lokhu kungena okuthuthukisiwe kunciphisa kakhulu ukumuncwa kwezinhlayiya ezihuquzelayo kanye nemfucumfucu ebusweni be-wafer. Ukuhlolwa okubonakalayo kubonisa ukuthi ama-wafer ahlinzekwe ngokunikezwa koketshezi olusizwa yi-ultrasonic abonisa amaphutha amancane kakhulu ebusweni, ngaleyo ndlela isivuno esiphezulu kanye nokuthembeka ezinqubweni ezingezansi.
Ukulungiswa kwamapharamitha kubalulekile ekwandiseni izinzuzo zokuthuthukiswa kwe-ultrasonic kanye nobuchwepheshe be-nano-fluid ekunqumeni ukulethwa koketshezi. Amapharamitha abalulekile afaka:
- Ibanga lepuleti: Igebe eliphakathi kwedamu loketshezi nendawo yokusika kumele lincishiswe ukuze kukhuphuke uketshezi kahle.
- Indawo ye-Ultrasonic transducer kanye nokulinganisa kokusetha: I-geometry echazwe ngokucacile iqinisekisa ukudluliselwa kwamagagasi okufanayo kanye nesenzo se-capillary.
- Izinga lokushisa loketshezi: Ukushisa okulawulwayo kwandisa ukuhamba koketshezi kanye nokusebenza kahle kwe-capillary.
- Ubude kanye nokuvama kokusetshenziswa kwe-ultrasound: Isikhathi esifanele sivimbela ukushisa ngokweqile ngenkathi kukhulisa ukungena.
- Ukukhetha uhlobo loketshezi: Uketshezi oluyisisekelo oluhlukene kanye nezithasiselo zisabela ngokukhethekile ekukhuthazweni kwe-ultrasonic.
Ubuchwepheshe be-Nanofluid buletha enye intuthuko enkulu. Uketshezi lokusika olufakwe ama-nanoparticles afana ne-SiO2 ne-SiC lubonisa ukuqhutshwa kokushisa okuthuthukisiwe kanye nokugcotshwa. Lokhu kuguqulwa kuholela ekupholiseni okuphumelelayo, ukususwa kwemfucumfucu okuthuthukisiwe, kanye nokuncipha kokuqina komphezulu we-wafer. Idatha ikhombisa ukuthi ukwakheka kwama-nano-particle ahlanganisiwe kunikeza ukuthuthuka okuhambisanayo, kunciphisa kakhulu i-warpage futhi kukhiqize isimo se-wafer esingcono kakhulu kune-single-type noma uketshezi lokusika oluvamile.
Abakhiqizi abafuna ukuthuthukisa ukusebenza kahle koketshezi lwabo lokusika bangasebenzisa lezi ziqondiso zokusebenza ezilandelayo:
- Sebenzisa amamitha okuqina angaphakathi kanye namamitha e-viscosity (njengalawo avela eLonnmeter) ukuqapha nokulawula ukuqina koketshezi, uqinisekise ukuthi izakhiwo zokugeleza zihlala zilungele usizo lwe-ultrasonic kanye ne-nano.
- Gada futhi ulungise amazinga okugeleza koketshezi olusikayo usebenzisa inzwa yokulinganisa ukugeleza okunembile kakhulu. Ukulinganiswa kokugeleza kobuningi be-Coriolis kuwusizo ikakhulukazi ekulinganisweni kokugeleza koketshezi olusikayo kwezimboni, okunikeza ukunemba kwesikhathi sangempela kokubili ubuningi kanye nomthamo.
- Linganisa njalo izinzwa zokulinganisa ukugeleza ukuze ugcine ukufundwa okuthembekile, okubalulekile ekucutshungulweni kwe-wafer okuqhubekayo.
- Khetha izinhlobo zoketshezi lokusika i-wafer kanye nokuhlushwa kwe-nanoparticle okuhambisana nosayizi othile we-wafer, izici zentambo yedayimane, kanye nendawo yokusebenza.
Izifundo zokuqhathanisa ziqinisekisa ukuthi izinguquko zepharamitha yesici esisodwa—njengokwandisa ijubane lentambo noma ukulungisa izinga lokuphakelayo—zihambisana nokushintsha kokuguguleka kwentambo, ubulukhuni bendawo, kanye nokwehluka kobukhulu obuphelele (i-TTV). Ukugcina ukuchaneka kokugeleza kanye nokuhlinzekwa koketshezi okusheshayo nokuphendulayo kubalulekile kokubili ekunciphiseni amaphutha kanye nokwandisa impilo yentambo.
imibuzo ejwayelekile ukubuzwa
Uketshezi lokusika i-silicon wafer luthuthukisa kanjani ukusebenza kokusika ucingo lwedayimane?
Uketshezi lokusika i-silicon wafer lusebenza njenge-lubricant kanye ne-coolant ekusikeni i-diamond wire. Umsebenzi walo oyinhloko ukunciphisa ukungqubuzana nokususa ukushisa okukhiqizwa esibonakalayo se-wire-wafer. Ukungqubuzana okuphansi kanye namazinga okushisa kunciphisa ukuqhekeka okuncane kanye nokuklwebheka kobuso, okungaholela ekulimaleni kwe-wafer kanye nokwehla kwesivuno sonke. Uketshezi luphinde luthwale udoti endaweni yokusika, lugcine i-diamond wire kanye ne-wafer surface ihlanzekile. Lokhu kususwa okuqhubekayo kwezinhlayiya kuphumela ezindaweni ze-wafer ezibushelelezi futhi kusekela ukukhiqizwa okuqhubekayo, kwekhwalithi ephezulu. Isibonelo, uketshezi oluthuthukisiwe lwe-nano-cutting olune-SiO₂ kanye ne-SiC nanoparticles lungangena lujule e-kerf, lunciphise ukujiya kobuso kanye ne-wafer warpage, luthuthukise kakhulu umkhiqizo we-wafer wokusetshenziswa kwe-semiconductor.
Iyini imitha yokugeleza koketshezi yokusika, futhi kungani ibalulekile ekusikeni i-wafer?
Imitha yokugeleza koketshezi eqoshiwe ilinganisa inani eliqondile loketshezi olulethwa endaweni yokusaha. Ukugcina ukugeleza okunembile kubalulekile ukuze kugcotshwe ngokwanele, kushabalale ukushisa, futhi kususwe udoti. Uma ukugeleza kuphansi kakhulu, ucingo luyashisa kakhulu noma luqoqe udoti, okubangela imihuzuko nokuqhekeka. Ukugeleza ngokweqile kungachitha uketshezi futhi kudale ukungalingani kwengcindezi, kuthinte ukuthamba kwe-wafer nokuphila kwamathuluzi. Ukusika amamitha okugeleza koketshezi, njengemitha yobuningi obungaphakathi kanye namamitha e-viscosity akhiqizwe yi-Lonnmeter, kusiza opharetha ukuthi baqaphele futhi balungise ukuphakelwa ngesikhathi sangempela. Lokhu kuqinisekisa ukuthi inqubo ihlala ngaphakathi kwemingcele efanele, kukhulisa isivuno se-wafer futhi kunciphise ukuguguleka kwamathuluzi.
Ukulinganiswa kokugeleza kwesisindo seCoriolis kuzuzisa kanjani ukulawulwa koketshezi lokusika i-silicon wafer?
Ukulinganiswa kokugeleza kobuningi beCoriolis kubaluleke kakhulu ekulinganisweni kokugeleza okunembile kakhulu ekukhiqizweni kwe-silicon wafer. Ngokungafani namamitha okugeleza endabuko, izinzwa zeCoriolis zilinganisa ngqo ukugeleza kobuningi kungakhathaliseki ukuthi uketshezi lungakanani, ubuningi, noma ukushintshashintsha kwezinga lokushisa. Lesi sici senza kube lula ukuqapha ngokunembile izinhlobo ezahlukene zoketshezi lokusika i-wafer, kufaka phakathi lezo ezinezinhlayiya ezincane. Umphumela uba ukulethwa okuqhubekayo koketshezi lokusika ngesivinini esifanele, kugcinwa ukugcotshwa okuzinzile nokupholisa naphezu kokushintshashintsha kwenqubo. Lezi zinzuzo zinegalelo ngqo kwikhwalithi ephezulu ye-wafer ekusetshenzisweni kokusika ucingo lwedayimane oludingayo, lapho ukulawula okunembile kunciphisa khona amaphutha futhi kuthuthukisa umkhiqizo.
Yiziphi izici ezithinta ukulinganiswa kwesilinganiso sokugeleza kokusetshenziswa kwesaha lensimbi yedayimane?
Ukulinganisa izinga lokugeleza okunembile kuncike eziguquguqukweni eziningana ezixhumene. Ukukhetha inzwa kubalulekile; isibonelo, izinzwa zokugeleza kobuningi beCoriolis zinikeza idatha ethembekile ngisho noketshezi oluqinile noma olugcwele izinhlayiya. Ukwakheka koketshezi—njengokuba khona kwezinhlayiya ezincane—kungashintsha i-viscosity kanye nobuningi futhi kuthonye izidingo zokulinganisa inzwa. Ububanzi bentambo kanye nesivinini sokusika nakho kuthinta ukuthi kungakanani uketshezi oludingekayo ukuze kuphole kahle futhi kususwe udoti. Ukulinganisa inqubo ngayinye ethile kubalulekile ukuqinisekisa ukuthi inzwa ifunda amanani angempela, ukuqinisekisa ukuthi kusetshenziswa inani elifanele loketshezi lokusika kuqoqo ngalinye.
Ingabe ama-nano-fluids kanye namasu e-ultrasonic angathuthukisa ukungena koketshezi ngesikhathi sokusika i-silicon wafer?
Ucwaningo lubonisa ukuthi ama-nano-fluid, ikakhulukazi lawo ane-SiO₂ kanye ne-SiC nanoparticles, andisa ukusebenza kahle kokulethwa koketshezi esibonakalayo esibalulekile se-wire-wafer. Lezi zinhlayiya zisiza uketshezi ukuthi lufinyelele izikhala ezincane kakhulu, okuqinisekisa ukupholisa okungcono kanye nokuthambisa. Ngaphezu kwalokho, amasu e-ultrasonic capillary effect athuthukisa kakhulu ukunyakaza koketshezi kanye nokungena, ikakhulukazi ekusikeni kwentambo okunciphile kakhulu. Lokhu kusho ukuthi kudingeka uketshezi oluncane lokusika ukuze kufezwe ukusebenza kahle, futhi imiphumela ifaka phakathi ukuncipha kokumuncwa koketshezi, ukuthuthuka kokwakheka kwendawo, kanye namazinga aphansi okukhubazeka. Lezi ntuthuko zisekela ukuqhubekela phambili kuma-wafer amancane, anobubanzi obukhulu kokubili ezimbonini ze-semiconductor kanye ne-photovoltaic, ngezinzwa zokuqapha uketshezi ezisikayo eziqinisekisa ukuthi inqubo ihlala ilawulwa futhi ihambisana kuyo yonke imjikelezo yokukhiqiza.
Isikhathi sokuthunyelwe: Disemba-25-2025
