Izisindo zokulinganisa i-viscosity ezinembile kuukugcwalisa okungaphansi, isinamathiseli sedayi, futhiukugoqa of semii-coni-duci-tori-packaging for optii-malokuqondilei-sionand rei-liabi-ility.I-Underfill yakha i-compound esekelwe ku-epoxy ethatha isikhala esiphakathi kwe-semiconductor die kanye ne-substrate yayo noma ibhodi lesifunda eliphrintiwe, iqinisa ukuxhumana kwe-solder ngokumelene nezinhlobo ze-thermomechanical ezivela kuma-coefficients ahlukene okwanda kokushisa. Ukwakheka kwe-flip chip kubeka uhlangothi olusebenzayo lwe-die phansi, kusungula izixhumanisi zikagesi eziqondile ngama-solder bumps, okusiza ukuhlanganiswa okuqinile kunezindlela ezivamile zokubopha izintambo. I-Underfill iqinisa ukuthembeka ngokusabalalisa ngokulinganayo ukucindezeleka okuvela ekushintsheni kokushisa, ukuvikela amalunga ekugugeni, emiphumeleni, ekunyakazeni, nasekungcoleni okufana nomswakama, ngaleyo ndlela kwandise ukukhuthazela kokusebenza kuzo zonke izigaba ezahlukene kusukela kumadivayisi eselula kuya ezinhlelweni zezimoto.
Ukuqina Kwezinto Zokunamathela
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Ukubaluleka Kokuqina Okunamathelayo Ekugcwaliseni Okungaphansi, Ekunamathiseleni Okudayiwe, kanye Nokumbozwa Kwesivikelo
Ukufundisaukunamathela okunamathelayokuvela njengesu eliyisisekelo emigqeni yokuhlanganisa ye-semiconductor, okuthonya ngqo ukufana kokugeleza, ukuphelela kokumbozwa, kanye nokungabikho kwamaphutha kuukugcwaliswa okungaphansi kwephakeji ye-semiconductor, i-semiconductor enamathiselwe nge-die attach, futhii-pcbukugoqa. Okuhle kakhuluukulinganiswa kwe-glue viscositykuvimbela izinkinga ezifana nama-air pocket, ukungalingani, noma ukufakwa okungaphelele okuqeda ukuqina kwemishini kanye nokuqhuba ukushisa. Ukusebenzisa amathuluzi ayinkimbinkimbi njenge-Imitha ye-viscosity ye-Lonnmeter yama-glue noma ama-glueInika amandla abakhiqizi ngokuqapha okusheshayo, ivumela ukuguqulwa okuqondile kwe-adhesive dynamics ukuze kuhambisane nezidingo zokupakisha eziqinile, ekugcineni kuphakamise amazinga okukhiqiza kanye nokuqina kwedivayisi.
Kuyini Ukungagcwalisi Okuphelele ku-PCB?
Ukuhlolayini ukugcwalisa okunganele ku-pcbiveza into e-resinous epoxy noma i-polymeric enikezwayo ukuze ifihle isici esingaphansi sezinto ezifakiwe, ikakhulukazi ekuhleleni kwe-flip chip kumabhodi wesekethe. Le nto iqinisa izibopho ze-solder, inciphise ukungezwani kwemishini, futhi ivikele ezihlaselini ezizungezile okuhlanganisa umswakama noma ukuhlukahluka kokushisa. Ngokungena ezindaweni ezingenalutho phakathi kwe-die nesisekelo, yandisa ukusabalala kokushisa kanye nokuqina kwezakhiwo, okubonakala kubalulekile ekulungiselelweni okuqinile nokusebenza okuphezulu kwesekethe esisezingeni eliphezulu.
Inqubo Yokugcwalisa Ngaphansi Kwe-Flip Chip
Ukwenzainqubo yokugcwalisa i-chip ngaphansikuhilela ukwaba i-epoxy ewuketshezi ye-viscosity elinganisiwe eceleni kwemingcele ye-inverted die ngemuva kokushiswa, kusetshenziswa amandla e-capillary ukuze kungene ezindaweni ezincane phakathi kwama-solder protuberances ngaphambi kokuqina ngokwelashwa kokushisa. Ukulungiswa okufana nokufudumala kwe-substrate kusheshisa ukungena, kudinga ukuphathwa okuqinile kwe-viscosity ukuze kugwenywe ukufakwa kwegesi futhi kuqinisekiswe imiphumela engenaphutha. Izindlela ezifana nokuhlelwa kokusabalalisa okuqondile noma kwe-perimeter kuvumelanisa ukuqhubekela phambili kwe-adhesive ne-enclosure contours, kunciphisa ukungapheleli kanye nokukhulisa ukukhuthazela ngokumelene nokushisa okujikelezayo.
Inqubo Yokunamathisela I-Die ku-Semiconductor
Iinqubo yokunamathisela i-die ku-semiconductorKuhlanganisa ukunamathisela idayisi elingavaliwe ku-carrier noma uhlaka olusebenzisa izibopho eziqhubayo noma ezivikelayo, njenge-epoxies noma ama-fusible alloys, ukuqinisekisa ukudluliselwa kokushisa kanye nogesi okusebenzayo. Lesi sigaba esiyisisekelo, esibalulekile ekuxhumeni okulandelayo noma ekugoqweni, sidinga ukufakwa kwe-adhesive okunembile ngokuphathwa kwerobhothi ukuze kugwenywe imigodi futhi kugcinwe ukuqina kokuxhumana. Ukuqapha i-viscosity kubaluleke kakhulu ekuvimbeleni ukuphambuka nokuqinisekisa ukunamathela okufanayo, kuqinisa ukwenziwa kobuningi ngaphandle kokwethenjelwa.
Inqubo Yokufaka I-Encapsulation ku-Semiconductor
Ngaphakathi kweinqubo yokufaka i-capsulation ku-semiconductor, ama-resin avikelayo amboza idayisi kanye nokuxhumana, abeke isithiyo ngokumelene nokulimala ngokomzimba, ukungena komswakama, kanye nokuwohloka kokushisa ngezindlela ezifana nokubumba okucindezelwe, okuvame ukwandiswa ukuphuma ukuze kukhishwe izikhala. Ukulawulwa kokuqina kubaluleke kakhulu ekufinyeleleni ukufinyela okuncane, ukwakheka kwezinhlayiya eziphakeme okuthuthukisa ukuphuma kokushisa futhi kugcine ukuqina kokuvala ngaphansi kwezimo ezimbi.
Imiphumela Yokugoba Okungalawulwa
Ukuphambuka ekuqineni kudala ukungalingani okukhulu, okuhlanganisa ukusatshalaliswa kwezinhlayiya eziveza ama-strata angajwayelekile, okwandisa ukungalingani kokushisa, ukuhlukaniswa kwe-interfacial, kanye nokuwohloka kwamalunga ngokushesha. Amazinga angajwayelekile akhuthaza imigodi noma ukufakwa okwanele, okubangela ukuqhekeka phakathi kokuguquguquka kokushisa kanye nokwanda kwezindleko zokulungisa. Ukwehluka okunjalo kwandisa ukugoba kwe-enclosure, kunciphisa izibopho futhi kubangele ukuguguleka okuvela emswakama, okwenza abakhiqizi abahlakaniphile banciphise ngokuqapha ngokucophelela ukuze balondoloze ukusebenza okuhlala njalo.
Ubuchwepheshe Bokulinganisa Ukuqina
Ukuhlolwa kwe-viscosity yesimanje kuma-adhesive kusebenzisa izindlela ezahlukahlukene, ama-probe ashukumisayo abonakala kakhulu alinganisa ukumelana koketshezi ngaphandle kokuncipha komshini, ahlinzeka ngezilinganiso ezingapheli nezinembile endaweni edingakalayo. Lawa madivayisi angaphakathi, ahluka kusuka ekuthatheni isampula ngezikhathi ezithile ngezinkomishi noma amadivayisi ajikelezayo, anikeza ukuqonda okusheshayo ngezici ezingezona ezaseNewtonian njengokuncibilikisa i-shear noma ukugeleza okuncike esikhathini, okubalulekile kuma-adhesive emisebenzini ye-semiconductor. Izinto ezintsha ezinjalo zisiza ukushintshashintsha okuguquguqukayo, okuhambisana nokuzenzakalelayo ukuze kuncishiswe ukungafani futhi kuqiniswe ukwethembeka kwenqubo.
Indima Yokugoba Ku-Flow Dynamics
Ukuqina kushintsha kakhulu ubude bokufakwa kanye nokufana kokugcwaliswa okungaphansi, lapho amazinga akhulisiwe avela ekufakweni kwezinhlayiya eqhubeka isikhathi eside kodwa aqinise izimfanelo zomshini ngemva kokuqina. Ekunamathiselweni kwe-die kanye nokuvalelwa, kusho amandla okubopha kanye nokusebenza kahle kokuvikela, ngokunciphisa okubangelwa amazinga okushisa okudinga amaqhinga okubuyisela ukuze kugcinwe ukuhlakazeka okuhle ngaphandle kokweqisa noma ukushoda, ngaleyo ndlela kuncishiswe izingozi ezifana nokungena ngokweqile noma ukugoqana.
Funda Ngamamitha Obuningi Engeziwe
Amamitha Ezinqubo Engeziwe Ku-inthanethi
Imitha Yokugoba yeLonnmeter yamaGlue noma ama-Adhesive
Iimitha ye-viscosity yeglue, okuboniswe yiLonnmeter, inikeza ithuluzi eliqinile lokuqapha njalo izimfanelo zokunamathela. Isebenzisa ukuzwa kwe-oscillatory, ilinganisa ukumelana okusuka ku-1 kuya ku-1,000,000 cP ngokunemba okungu-±2% ~ 5% kanye nokuphendula okusheshayo, okulungele izilungiselelo eziqinile kufaka phakathi ukucindezela okuphezulu noma izindawo eziyingozi. Ama-probe ayo aguquguqukayo kanye nokufakwa okulula kuma-conduits noma imikhumbi kuyenza ibe yisibonelo sokugcina ukufana kokunamathela kuchungechunge lokwenziwa kwe-semiconductor olusebenzisa imishini, oluhlanganisa ama-epoxies, ama-hotmelts, kanye nezinhlobo zesitashi.
Izicelo Ezinqubweni Zokunamathela
I-Lonnmeter ifinyelela emikhakheni eminingi efana ne-elekthronikhi kanye nezimoto, iqondisa iglue ekusabalaliseni, ekubekeni, noma ekusebenzeni kokubopha. Ezindaweni ze-semiconductor, ihlola ama-epoxies ngesikhathi sokugcwalisa kanye nokufaka i-capsulation, iqinisekisa ukuhlanganiswa okungenamthungo kumapayipi noma kuma-mixer ukuthola idatha engapheli, evumelana nokuziphatha okungeyona i-Newtonian kanye nama-scope okushisa aphezulu afinyelela ku-350°C.
Izici Zobuchwepheshe
Yakhiwe ngezinto eziqinile ezingagqwali ezingenazo izingxenye ze-kinetic, i-Lonnmeter imelana nokungcola ngenkathi ihlangana nge-Modbus ukuze ihleleke ngokuzenzakalela. I-vibration core yayo iyashintshashintsha ngezikhathi ezithile ukuze ibone ukushintsha kwe-viscosity kanye nobuningi, okwenza kube noshintsho olusheshayo kumafomula e-HMA noma ama-epoxy blends, okukhuthaza ukunemba ezindaweni ezisezingeni eliphezulu.
Izinzuzo
Ukufaka isilinganiso se-viscosity ezindleleni zokupakisha kuveza intuthuko enkulu ekukhiqizeni, ukwethembeka, kanye nokuhlakanipha kwezezimali. Ngokubhekana nokuphazamiseka kwe-viscosity ngaphambi kokwenza, abakhiqizi bathuthukisa ukufakwa kwe-adhesive, banciphise ukungalingani, futhi bandise isivuno sokukhiqiza esiphelele, ngokunciphisa okubonakalayo kokulahlwa kanye nokumiswa kokusebenza.
| Inzuzo | Incazelo | Umthelela Ezinqubweni |
| Ukuqapha Kwangempela | Ukulandelela njalo kokuphambuka kwe-viscosity | Igwema imigodi, ihlanza ukugeleza komoya endaweni engaphansi kokugcwalisa |
| Ukuhlanganiswa kwe-PLC/DCS | Ukujikeleziswa kwedatha ngomshini ukuze kuhambisane ngokuguquguqukayo | Kunciphisa ukungena ngesandla, kuthuthukisa ikhono lokuhlanganisa izinto |
| Ukubikezela Okuphelele Kwephutha | Ukubikezela izinkinga ezifana nezimbobo ngokuhlola izitayela | Inciphisa ukulungiswa, yandisa isivuno ekufakweni kwe-capsulation |
| Ukuzenzakalela Okuhlakaniphile | Ukulungiswa kwe-algorithm ukuze kufezwe kahle kakhulu | Iqinisekisa ukwethembeka, isekela ukugcinwa kwesikhathi eside |
| Ukungaguquguquki Kwekhwalithi | Izimfanelo ze-batch ezifanayo zokunamathela okuphezulu | Kuthuthukisa ukuthembeka ekupakisheni kwe-semiconductor |
| Ukunciphisa Imfucuza | Kuncishiswe inani eliningi ngokulawula okunembile | Yehlisa izindleko kanye nomthelela emvelweni kuzo zonke izinqubo |
Ukulinganisa Ukuqina Kwesikhathi Sangempela
Ukulinganiswa kwe-viscosity yesikhathi sangempelaIvumela ukuhlonza okusheshayo kokuguqulwa kwempahla, ukuvumela izinguquko ezisheshayo ukuze kulondolozwe ukugeleza okuhle kanye nezici zokungenisa. Leli khono linciphisa amaphutha afana nezimbobo noma ama-effervescences, liqinisekisa ukufakwa okufanayo ekugcwalisweni nasekufakweni kwempahla, okuholela ekulinganeni kwempahla okuphezulu kanye nokuchithakala okuncishisiwe ezindaweni ezinabile, okungase kunciphise ukwenqatshwa ngekota ekucushweni okucwengekile.
Ukuhlanganiswa kuhlelo lwe-PLC/DCS
Akukho umzamoukuhlanganiswa ohlelweni lwe-PLC/DCSisheshisa ukuphathwa kwe-viscosity okuzenzakalelayo ngokudlulisa amamethrikhi nge-analog noma i-digital conduits njenge-Modbus. Lokhu kuxhumanisa kuvumelanisa ukusebenza kwe-adhesive neziguquguquko zokukhiqiza, kuqalise ukuphendula okufika ngesikhathi okwandisa umkhiqizo osebenzayo futhi kunciphise ukuphazamiseka kuzo zonke izindlela zokugcwalisa, ukufaka i-die attach, kanye ne-encapsulation.
Ukulungiswa Kwepharamitha, Ukubikezela Iphutha, kanye Nokulawula Okuhlakaniphile
Izigqoko zokuqapha eziyinkimbinkimbiukulungiswa kwepharamitha, ukubikezela iphutha, kanye nokulawula okuhlakaniphilengokusebenzisa izindlela zedatha ukuze kuqashelwe izinkinga ezifana nokuvela kwe-cavity noma i-sedimentation. Izinhlaka zokubala zihlaziya okokufaka kwangaleso sikhathi ukuze kuqalwe ukulungiswa okulindelekile, kuqinisekiswe ukuhlanganiswa okungenaphutha kanye nokusheshisa imisebenzi ngokusebenzisa imishini yobuchopho, ngesikhathi esifanayo kuncishiswe ukusaphazeka kwezinto ngo-15-20% kanye nokukhuthaza imikhuba yokuqaphela imvelo.
Ukungaguquguquki Kwekhwalithi Nokunciphisa Imfucuza
Ukuqapha okuqhubekayo kugcina ukufana kwe-batch, kuphakamisa ukusebenza kahle kwe-adhesive ezicini ezifana nokuqina kwe-adhesion kanye nokuqina kokushisa, okubalulekile ekuqineni kwe-semiconductor. Lokhu kunciphisa ukusaphaza ngokusetshenziswa okuncishisiwe kwensalela, kunciphisa ukusetshenziswa kwezinto kanye nezinyathelo zemvelo, kuyilapho ukugcinwa kokubikezela okususelwa ezindleleni kufinyeza ukunqamuka, kukhulisa ukuguquguquka kanye nokunamathela komthetho.
Qhuba imizamo yakho yokupakisha i-semiconductor ngamandla amakhulu e-viscosity. Xhumana nathi ngokushesha ukuze uthole isicelo sakho sekhotheshini ukuze ufake izixazululo ze-viscosity ze-Lonnmeter ze-vanguard kuwe.ukugcwaliswa okuzenzekelayo okuzenzakalelayo ngokunemba, i-die attach, kanye nezindlela zokufaka i-capsulation, okuqinisekisa ukuqina nobuchwepheshe obungenakuqhathaniswa.
