1. Ukuphucula UmxholoPukubola
Yintoni i-CMP kwi-Semiconductor?
Ukupholisha ngoomatshini bekhemikhali (i-CMP), okwaziwa ngokuba yi-chemical mechanical planarization, yenye yezona zinto zinzima kwezobuchwepheshe kwaye zibaluleke kakhulu ngokwezimali kwimveliso ye-semiconductor yanamhlanje. Le nkqubo ikhethekileyo isebenza njengenkqubo edibeneyo eyimfuneko, igudisa ngononophelo iindawo ze-wafer ngokusebenzisa ukusetyenziswa ngokudibeneyo kokugrumba ngamakhemikhali kunye nokukrazula okubonakalayo okulawulwa kakhulu. Isetyenziswa kakhulu kumjikelo wokwenziwa, i-CMP ibalulekile ekulungiseleleni ii-wafer ze-semiconductor kwiileya ezilandelayo, ivumela ngokuthe ngqo ukuhlanganiswa koxinano oluphezulu olufunekayo kwiindlela zokwakha izixhobo eziphambili.
Inkqubo ye-CMP kwi-Semiconductor
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Imfuneko enzulu yokubaukupolisha ngoomatshini beekhemikhaliisekelwe kwiimfuno zomzimba ze-lithography yanamhlanje. Njengoko iisekethe ezidibeneyo zinciphisa kwaye iileya ezininzi zihlangana ngokuthe nkqo, amandla enkqubo yokususa izinto ngokulinganayo kunye nokuseka umphezulu ojikelezileyo wehlabathi aba yinto ebalulekileyo kakhulu. Intloko yokupholisha enamandla yenzelwe ukujikeleza kwii-axes ezahlukeneyo, ilungelelanisa ngononophelo i-topography engaqhelekanga kwi-wafer. Ukuze udlulisele iipateni ngempumelelo, ngakumbi ngeendlela ezisemgangathweni ezifana ne-Extreme Ultraviolet (EUV) lithography, wonke umphezulu ocutshungulwayo kufuneka uwe ngaphakathi kobunzulu obuncinci kakhulu bentsimi—umda wejometri ofuna ukuthamba kwe-Angstrom kwitekhnoloji yanamhlanje ye-sub-22 nm. Ngaphandle kwamandla okuphola e-Inkqubo ye-semiconductor ye-cmp, amanyathelo alandelayo e-photolithography aya kubangela ukusilela kokulungelelaniswa, ukuphazamiseka kwepateni, kunye nohambo olubi kakhulu lwemveliso.
Ukwamkelwa ngokubanzi kwe-CMP kuqhutywe kakhulu kukutshintsha kweshishini ukusuka kwii-conductors ze-aluminium eziqhelekileyo ukuya kwii-copper interconnects ezisebenzayo. I-Copper metallization isebenzisa inkqubo yokwenza iipateni ezongezelelweyo, indlela yeDamascene, exhomekeke ngokusisiseko kumandla akhethekileyo e-CMP okususa ngokukhetha nangokulinganayo ubhedu olugqithisileyo kwaye imise rhoqo isenzo sokususa ngqo kwindawo ephakathi kwesinyithi kunye nomaleko wokukhusela i-oxide. Oku kususwa kwezinto ezikhethiweyo kakhulu kugxininisa ibhalansi ethambileyo yeekhemikhali kunye noomatshini echaza inkqubo, ibhalansi echaphazeleka ngoko nangoko kukutshintsha okuncinci nakwindawo yokupolisha.
Imisebenzi ye-CMP kwiNkqubo ye-Semiconductor
Imfuneko eyimfuneko yokwahluka kwe-topographic okuphantsi kakhulu ayisiyonjongo engaphandle kodwa yimfuneko yokusebenza ngokuthe ngqo yokusebenza kwesixhobo esithembekileyo, ukuqinisekisa ukuhamba kombane okufanelekileyo, ukuchithwa kobushushu, kunye nokulungelelaniswa kokusebenza kwizakhiwo ezineeleya ezininzi. Umyalelo oyintloko we-CMP kukulawula i-topography, ukumisela imfuneko yokuba i-flat kuzo zonke iinyathelo ezibalulekileyo zokucubungula.
Isicelo esithile sichaza ukukhethwa kwezinto kunye nezinto ezifanelekileyoukwakheka kodakaIinkqubo ze-CMP ziye zaphuhliswa ukuze ziphathe izinto ezahlukeneyo, kuquka i-tungsten, i-copper, i-silicon dioxide (i-SiO2)2), kunye ne-silicon nitride (SiN). Iislurry zilungiselelwe ngobuchule obuphezulu bokucwangciswa okuphezulu kunye nokukhetha izinto ezibalaseleyo kuzo zonke iintlobo zezicelo, kubandakanya i-Shallow Trench Isolation (STI) kunye ne-Interlayer Dielectrics (ILD). Umzekelo, i-high-function ceria slurry isetyenziswa ngokukodwa kwizicelo ze-ILD ngenxa yokusebenza kwayo okuphezulu ekutsaleni inyathelo, ukufana, kunye nokunciphisa amaza angalunganga. Uhlobo olukhethekileyo lwale slurry luqinisekisa ukuba ukungazinzi kwenkqubo okuvela kwiinguqu kwi-fluid dynamics ye-polishing medium kuya kwaphula ngoko nangoko iimfuno ezisisiseko zokususa izinto ezikhethiweyo.
2. Indima Ebalulekileyo Yempilo Ye-CMP Slurry
Inkqubo ye-CMP kwi-Semiconductor
Ukusebenza ngokuqhubekayo kweinkqubo ye-cmp yokupholisha ngoomatshini beekhemikhaliIxhomekeke ngokupheleleyo ekuhanjisweni rhoqo kunye nokusebenza kwe-slurry, esebenza njengendawo ebalulekileyo enceda zombini iimpembelelo zeekhemikhali ezifunekayo kunye nokukrala koomatshini. Olu lwelo luyinkimbinkimbi, oluchazwa njengokumiswa kwe-colloidal, kufuneka luqhubeke kwaye luhambise izinto zalo ezibalulekileyo, kubandakanya ii-chemical agents (ii-oxidizers, ii-accelerators, kunye ne-corrosion inhibitors) kunye nee-nano-sbrasive particles, kumphezulu we-dynamic wafer.
Ulwakhiwo lwe-slurry lwenzelwe ukukhuthaza impendulo ethile yekhemikhali: inkqubo efanelekileyo ixhomekeke ekwenzeni umaleko we-oxide ongasebenziyo, onganyibilikiyo kwizinto ezijoliswe kuzo, oze emva koko ususwe ngoomatshini ngamasuntswana arhabaxa. Le ndlela inika ukhetho olufunekayo lwe-topographic oluphezulu oluyimfuneko ukuze kucwangciswe ngempumelelo, kugxilwe isenzo sokususa kwiindawo eziphakamileyo okanye kwiindawo ezibonakala zincinci. Ngokwahlukileyo koko, ukuba impendulo yekhemikhali ivelisa imeko ye-oxide enyibilikayo, ukususwa kwezinto kuyi-isotropic, ngaloo ndlela kususa ukhetho olufunekayo lwe-topographic. Izinto ezibonakalayo ze-slurry zihlala ziquka amasuntswana arhabaxa (umz., i-silica, i-ceria) anobukhulu obuphakathi kwe-30 ukuya kwi-200 nm, axhonywe kumanqanaba aphakathi kwe-0.3 kunye ne-12 yepesenti yezinto eziqinileyo.
I-CMP Slurry Semiconductor
Ukugcina impilo yeI-semiconductor ye-slurry ye-CMPifuna ukuchazwa nokulawulwa okungapheliyo kulo lonke ixesha layo lobomi, njengoko naluphi na ukonakala ngexesha lokuphathwa okanye ukujikeleza kwegazi kunokukhokelela ekulahlekelweni okukhulu kwemali. Umgangatho we-wafer yokugqibela epholisiweyo, echazwa bubuthambile bayo obuncinci kunye namanqanaba esiphene, unxulumene ngokuthe ngqo nokuthembeka kokusasazwa kobungakanani bezinto ezincinci ze-slurry (PSD) kunye nozinzo lulonke.
Uhlobo olukhethekileyo lwezinto ezahlukeneyoIintlobo ze-slurry ze-cmpkuthetha ukuba amasuntswana anobukhulu obuncinci aqiniswa ngamandla athambileyo e-electrostatic agxothayo ngaphakathi kokumiswa. Amasuntswana adla ngokunikezelwa kwimo exineneyo kwaye afuna ukuxutywa ngokuchanekileyo kunye nokuxubana namanzi kunye ne-oxidizers kwindawo yokwenziwa. Okubalulekileyo kukuba, ukuxhomekeka kwimilinganiselo yokuxuba eguquguqukayo kunesiphene kuba izinto ezingenayo ezixineneyo zibonisa utshintsho oluqhelekileyo lobuninzi be-batch-to-batch.
Ukulawula inkqubo, ngelixa uhlalutyo oluthe ngqo lwe-PSD kunye ne-zeta potential (uzinzo lwe-colloidal) lubalulekile, ezi ndlela zihlala zijoliswa kuhlalutyo olungenamsebenzi nolungasebenziyo. Inyani yokusebenza kwendalo ye-HVM ifuna impendulo yexesha langempela, ekhawulezileyo. Ngenxa yoko, uxinano kunye ne-viscosity zisebenza njengezona proxies zisebenzayo nezisebenzayo zempilo ye-slurry. Uxinano lubonelela ngomlinganiselo okhawulezayo noqhubekayo woxinzelelo lwe-abrasive solids iyonke kwi-medium. Uxinano lubaluleke ngokulinganayo, lusebenza njengophawu olunovakalelo olukhulu lwemeko ye-colloidal yolwelo kunye nokunyaniseka kobushushu. Uxinano olungazinzanga luhlala lubonisa i-abrasive particle.ukuhlanganiswaokanye ukuphinda kuhlanganiswe, ingakumbi phantsi kweemeko zokucheba eziguquguqukayo. Ke ngoko, ukujonga rhoqo kunye nokulawula ezi paramitha zimbini ze-rheological kubonelela nge-feedback loop ekhawulezileyo nesebenzayo efunekayo ukuqinisekisa ukuba i-slurry igcina imeko yayo yekhemikhali kunye neyomzimba kwindawo yokuyisebenzisa.
3. Uhlalutyo Lokusilela Kweendlela: Abaqhubi Beziphene
Iimpembelelo Ezimbi Ezibangelwa Kukuxinana Kwe-CMP kunye Nokuguquguquka Kwe-Viscosity
Ukwahluka kwenkqubo kubonwa njengoyena negalelo elikhulu ekuveliseni umngcipheko kwimveliso ephezului-cmp kwimveliso ye-semiconductorIimpawu ze-slurry, ezibizwa ngokuba yi-"slurry health," zichaphazeleka kakhulu kutshintsho olubangelwa kukucheba kokumpompa, ukuguquguquka kobushushu, kunye nokungahambelani kokuxuba. Ukungaphumeleli okuvela kwinkqubo yokuhamba kwe-slurry kwahlukile kwimiba yoomatshini kuphela, kodwa zombini zibangela i-wafer scrap ebalulekileyo kwaye zihlala zifunyanwa sele kudlule ixesha elide ziinkqubo zokuphela kwenkqubo.
Ubukho bee-particles ezinkulu kakhulu okanye ii-agglomerates kwi-i-semiconductor ye-cmpIzinto ezibonakalayo zidibene nokudalwa kwemikrwelo emincinci kunye nezinye iziphene ezibulalayo kumphezulu we-wafer ocoliweyo. Ukuguquguquka kwiiparameter eziphambili ze-rheological—ukuxinana kunye noxinano—zizibonakaliso eziqhubekayo nezikhokelayo zokuba ukuthembeka kwe-slurry kuye kwaphazamiseka, okuqalisa indlela yokwakheka kwesiphene.
Ukuguquguquka kwe-Slurry Viscosity (umz., okukhokelela ekuhlanganiseni, ukutshintshwa kwe-shear)
I-Viscosity yipropati ye-thermodynamic elawula indlela esebenza ngayo i-flow kunye ne-frictional dynamics kwi-interface yokupolisha, nto leyo eyenza ukuba ibe novelwano kakhulu kuxinzelelo lwendalo kunye nolwe-mechanical.
Ukusebenza kweekhemikhali kunye nokusebenza komzimbai-semiconductor ye-viscosity eludakaInkqubo ixhomekeke kakhulu kulawulo lobushushu. Uphando luqinisekisa ukuba notshintsho oluncinci lwe-5°C kubushushu benkqubo lunokukhokelela ekunciphiseni malunga ne-10% kwi-slurry viscosity. Olu tshintsho kwi-rheology luchaphazela ngokuthe ngqo ubukhulu befilimu ye-hydrodynamic eyahlula i-wafer kwi-polishing pad. Ukuncipha kwe-viscosity kukhokelela ekuthambiseni okwaneleyo, okubangela ukungqubana okuphezulu koomatshini, unobangela oyintloko wokukrweleka okuncinci kunye nokusetyenziswa kwe-pad ngokukhawuleza.
Indlela ebalulekileyo yokuwohloka ibandakanya ukuhlanganiswa kwee-particle ezibangelwa kukucheba. Ii-slurry ezisekwe kwi-silica zigcina ukwahlukana kwee-particle ngokusebenzisa amandla athambileyo okugxotha i-electrostatic. Xa i-slurry idibana noxinzelelo oluphezulu lwe-shear—oluhlala luveliswa ziipompo ze-centrifugal ezingafanelekanga okanye ukujikeleza okubanzi kwi-distribution loop—la mandla anokoyiswa, nto leyo ekhokelela ekukhawulezisweni nasekungabuyekekiyo.ukuhlanganiswaiinxalenye ezinkulu ezirhabaxa. Ii-aggregates ezinkulu eziphumayo zisebenza njengezixhobo zokugaya izinto ezincinci, zidala ngokuthe ngqo imikrwelo emincinci eyingozi kumphezulu we-wafer. I-viscometry yexesha langempela yindlela efunekayo yokuphendula ukuze kufunyanwe ezi ziganeko, inika ubungqina obubalulekileyo "bobumnene" benkqubo yokupompa nokuhambisa ngaphambi kokuba kwenzeke ukwenziwa kweziphene ezinkulu.
Utshintsho oluvelayo kwi-viscosity lukwachaphazela kakhulu ukusebenza kwe-planarization. Ekubeni i-viscosity yinto ephambili echaphazela i-coefficient of friction ngexesha lokupolisha, iprofayili ye-viscosity engalinganiyo iya kukhokelela kumazinga okususwa kwezinto angaguqukiyo. Ukwanda kwe-viscosity kwindawo ethile, ingakumbi xa amazinga aphezulu okucheba esenzeka kwiimpawu eziphakanyisiweyo ze-wafer topography, kutshintsha amandla okungqubana kwaye kuphazamisa injongo ye-planarization, ekugqibeleni kukhokelela kwiziphene ze-topographic ezifana nokucoca kunye nokukhukuliseka.
Ukuguquguquka kobuninzi beSlurry
Uxinano lwe-slurry luphawu olukhawulezayo noluthembekileyo loxinano olupheleleyo lwezinto ezirhabaxa ezixhonywe ngaphakathi kolwelo. Ukuguquguquka koxinano kubonisa ukuhanjiswa kwe-slurry engalinganiyo, enxulumene notshintsho kwizinga lokususwa kwezinto (MRR) kunye nokwakheka kweziphene.
Iindawo zokusebenza zifuna ukuqinisekiswa okunamandla kokwakheka kodaka. Ukuxhomekeka kuphela ekongezeni ubungakanani obuthile bamanzi kunye ne-oxidizer kwiibhetshi ezingenayo ezixineneyo akwanelanga, njengoko uxinano lwezinto eziluhlaza luhlala lutshintshatshintsha, nto leyo ekhokelela kwiziphumo zenkqubo ezingangqinelaniyo kwintloko yesixhobo. Ngaphezu koko, ii-abrasive particles, ingakumbi ii-ceria particles ezixineneyo eziphezulu, ziphantsi kodaka ukuba isantya sokuhamba okanye uzinzo lwe-colloidal alwanelanga. Oku kuhlala kudala i-localized density gradients kunye nokuhlanganiswa kwezinto ngaphakathi kwemigca yokuhamba, okuphazamisa kakhulu amandla okuhambisa umthwalo ohambelanayo we-abrasive.
How DubumeDukukhutshwa kwezithuthiAffi-ect Mani-ufaci-turingProcess?.
Iziphumo ezithe ngqo zoxinano olungazinzanga lwe-slurry zibonakala njengeziphene ezibalulekileyo zomzimba kumphezulu ocoliweyo:
Amanani okuSusa angalinganiyo (i-WIWNU):Utshintsho kuxinano luguqulela ngokuthe ngqo kwiinguqu kuxinano lwee-active abrasive particles ezivezwa kwi-interface yokupolisha. Uxinano olungaphantsi kunoluchazwe lubonisa uxinano oluphantsi lwe-abrasive, olubangela i-MRR enciphileyo kwaye luvelise ukungangqinelani okungamkelekanga ngaphakathi kwe-wafer (WIWNU). I-WIWNU iyawuthoba umlinganiselo wesiseko we-planarization. Ngokwahlukileyo koko, uxinano oluphezulu olubekwe kwindawo ethile lunyusa umthwalo osebenzayo wee-particle, nto leyo ekhokelela ekususweni kwezinto ezininzi. Ulawulo oluqinileyo kuxinano luqinisekisa ukuhanjiswa rhoqo kwe-abrasive, okuhambelana kakhulu namandla okungqubana azinzileyo kunye ne-MRR eqikelelweyo.
Ukungqubana Ngenxa yokwahluka kweendawo ezirhabaxa:Uxinzelelo oluphezulu lwezinto ezirhabaxa kwindawo ethile, ezidla ngokubangelwa kukuzinza okanye ukuxubana okunganelanga, kukhokelela kwimithwalo ephezulu kwindawo nganye kwisuntswana kumphezulu we-wafer. Xa iisuntswana ezirhabaxa, ingakumbi i-ceria, zinamathela kakhulu kumaleko weglasi ye-oxide, kwaye kukho uxinzelelo lomphezulu, umthwalo woomatshini unokubangela ukuba umaleko weglasi uqhekeke, nto leyo ekhokelela ekubeni ube nzulu, ubukhali.ukugxushaIziphene. Olu tshintsho lwe-abrasive lunokubangelwa kukuhluzwa okwenzekileyo, okuvumela ukuba ii-aggregates ezinkulu (iinxalenye ezingaphezulu kwe-$0.5\\mu m$) zidlule, okubangelwa kukumiswa kakubi kweenxalenye. Ukubeka iliso kuxinano kubonelela ngenkqubo yesilumkiso ebalulekileyo, encedisayo kwiikhawuntara zeenxalenye, okuvumela iinjineli zenkqubo ukuba zibone ukuqala kokuhlanganiswa kwe-abrasive kunye nokuzinzisa umthwalo we-abrasive.
Ukwakheka kwentsalela evela kwi-Poor Particle Suspension:Xa ukumiswa kungazinzile, nto leyo ebangela ukuba kubekho i-high density gradients, izinto eziqinileyo ziya kuthanda ukuqokelelana kwi-flow architecture, nto leyo ekhokelela kumaza oxinano kunye nokuhlanganiswa kwezinto kwinkqubo yokusasazwa.17Ngaphezu koko, ngexesha lokupolisha, i-slurry kufuneka ithwale ngokufanelekileyo zombini iimveliso ze-chemical reaction kunye nenkunkuma yokuguguleka koomatshini. Ukuba i-particle suspension okanye i-fluid dynamics ayisebenzi kakuhle ngenxa yokungazinzi, ezi ntsalela azisuswa ngokufanelekileyo kumphezulu we-wafer, nto leyo ebangela ukuba i-post-CMP particle kunye ne-chemical particle iphume.intsalelaIziphene. Ukumiswa kwamasuntswana okuzinzileyo, okuqinisekiswa ngokujongwa rhoqo kwe-rheological, kuyimfuneko ekukhutshweni kwezinto ezicocekileyo neziqhubekayo.
Funda Ngakumbi ngeeMetha zoBuxinano
Iimitha zeNkqubo ezingakumbi kwi-Intanethi
4. Ubuchule bobuchwephesha be-Inline Metrology
Ii-Lonnmeter Inline Densitometers kunye neeViscometers
Ukuze kuzinziswe ngempumelelo inkqubo ye-CMP eguquguqukayo, ukulinganisa okuqhubekayo, okungangenisi ntsholongwane kweempawu zempilo ye-slurry kubalulekile.Ii-Lonnmeter Inline Densitometers kunye neeViscometersSebenzisa itekhnoloji ye-resonant sensor ephucukileyo kakhulu, inika ukusebenza okuphezulu xa kuthelekiswa nezixhobo ze-metrology zemveli, ezihlala ixesha elide. Olu buchule lwenza ukuba ukujonga uxinano olungenamthungo noluqhubekayo kudityaniswe ngokuthe ngqo kwindlela yokuhamba, nto leyo ibalulekileyo ekuhlangabezaneni nemigangatho yobunyulu obuqinileyo kunye nokuchaneka komxube we-sub-28nm process nodes zanamhlanje.
Chaza imigaqo yabo ephambili yetekhnoloji, ukuchaneka kokulinganisa, isantya sempendulo, uzinzo, ukuthembeka kwiindawo ezinzima ze-CMP, kwaye ubahlule kwiindlela zemveli ezingaxhunyiwe kwi-intanethi.
Ukuze inkqubo isebenze ngokuzenzekelayo kufuneka izinzwa ezilungiselelwe ukusebenza ngokuthembekileyo phantsi kweemeko eziguquguqukayo zokuhamba kwamanzi aphezulu, uxinzelelo oluphezulu, kunye nokuvezwa kweekhemikhali ezirhabaxa, nto leyo enika impendulo ekhawulezileyo kwiinkqubo zolawulo.
Imigaqo yeTekhnoloji ePhambili: Inzuzo yeResonator
Izixhobo zeLonnmeter zisebenzisa ubuchwepheshe obuqinileyo bokuqaqamba obuyilelwe ngokukodwa ukunciphisa ubuthathaka obukhoyo be-U-tube densitometers zemveli, ezinamathambo, ezidume ngokuba yingxaki xa zisetyenziswa kwi-inline kunye ne-abrasive colloidal suspensions.
Ukulinganiswa koxinano:Iimitha yoxinano lwe-slurryIsebenzisa into eshukumayo edityanisiweyo ngokupheleleyo, ngokuqhelekileyo i-fork assembly okanye i-co-axial resonator. Le nto ivuselelwa ngombane ukuze ijikeleze kwi-frequency yayo yendalo. Utshintsho kuxinano lolwelo olujikelezileyo lubangela utshintsho oluchanekileyo kule frequency yendalo, okuvumela ukuqinisekiswa koxinano oluthe ngqo noluthembekileyo kakhulu.
Umlinganiselo wokubonakala kwe-viscosity:II-viscometer yoludaka esetyenziswa kwinkquboisebenzisa isenzi esiqinileyo esijikeleza ngaphakathi kolwelo. Uyilo luqinisekisa ukuba umlinganiselo we-viscosity wahlulwe kwimiphumo yokuhamba kolwelo oluninzi, nto leyo enika umlinganiselo wangaphakathi we-rheology yento.
Ukusebenza kakuhle kunye nokuqina
I-Inline resonant metrology inika imilinganiselo yokusebenza ebalulekileyo ebalulekileyo kulawulo oluqinileyo lwe-HVM:
Isantya sokuchaneka kunye nempendulo:Iinkqubo ezikwimigca zibonelela ngokuphindaphindwa okuphezulu, zihlala zifikelela kwi-0.1% yokuchaneka kwe-viscosity kunye noxinano ukuya kuthi ga kwi-0.001 g/cc. Ukuze kulawulwe inkqubo eqinileyo, oku kuphezuluukuchaneka—ukukwazi ukulinganisa ixabiso elifanayo rhoqo kunye nokuchonga ngokuthembekileyo ukuphambuka okuncinci—kudla ngokuba luncedo ngakumbi kunokuchaneka okupheleleyo okungaphantsi. Okubaluleke kakhulu, isignaliixesha lokuphendulakuba ezi sensors zikhawuleza kakhulu, zihlala malunga nemizuzwana emi-5. Le mpendulo iphantse yenzeke ngoko nangoko ivumela ukubonwa kwempazamo kwangoko kunye nokulungiswa okuzenzakalelayo kwe-closed-loop, imfuneko ephambili yokuthintela uhambo.
Uzinzo kunye nokuthembeka kwiindawo ezinzima:Ii-slurry ze-CMP zinamandla ngokwemvelo. Izixhobo zanamhlanje ezikwimigca eyakhelwe ukuqina, kusetyenziswa izixhobo ezithile kunye noqwalaselo lokufakelwa ngqo kwiipayipi. Ezi sensor zenzelwe ukusebenza kuluhlu olubanzi loxinzelelo (umz., ukuya kuthi ga kwi-6.4 MPa) kunye namaqondo obushushu (ukuya kuthi ga kwi-350 ℃). Uyilo olungelulo lwe-U-tube lunciphisa iindawo ezifileyo kunye neengozi zokuvaleka ezinxulumene nemidiya erhabaxa, okwandisa ixesha lokusebenza kwe-sensor kunye nokuthembeka kokusebenza.
Ukwahluka kwiindlela zendabuko ezingaxhunyiwe kwi-intanethi
Umahluko osebenzayo phakathi kweenkqubo ezizenzekelayo ezikwi-intanethi kunye neendlela ezisebenza ngesandla ezingaxhunyiwe kwi-intanethi zichaza umsantsa phakathi kolawulo lwe-reactive defect kunye nokwenza ngcono inkqubo yokusebenza ngokukhawuleza.
| Ikhrayitheriya yokubeka iliso | I-Offline (Isampuli yeLab/U-Tube Densitometer) | I-Inline (iLonnmeter Densitometer/iViscometer) | Impembelelo yeNkqubo |
| Isantya sokulinganisa | Ilibazisekile (Iiyure) | Ixesha elilungile, Iyaqhubeka (Ixesha lokuphendula lidla ngokuba yimizuzwana emi-5) | Ivumela ulawulo lwenkqubo yokuthintela, oluvaliweyo. |
| Ukungaguquguquki/Ukuchaneka kwedatha | Iphantsi (Iyachaphazeleka yimpazamo eyenziwa ngesandla, ukonakala kwesampuli) | Phezulu (Okuzenzakalelayo, ukuphindaphindeka/ukuchaneka okuphezulu) | Imida yokulawula inkqubo eqinileyo kunye nokunciphisa iziphumo ezingezizo ezilungileyo. |
| Ukuhambelana okurhabaxa | Umngcipheko ophezulu wokuvaleka (Uyilo oluncinci lwembobo ye-U-tube) | Umngcipheko ophantsi wokuxinana (Uyilo lwe-resonator oluqinileyo nolungasebenzisi i-U-tube) | Ukusebenza kwe-sensor ixesha eliphezulu kunye nokuthembeka kwimidiya erhabaxa. |
| Ukwazi Ukufumanisa Impazamo | I-Reactive (ifumanisa uhambo olwenzeke kwiiyure ezidlulileyo) | Isebenza ngokuqhubekekayo (ijonga utshintsho olutshintshayo, ibona uhambo oluya kwenzeka kwangethuba) | Ithintela i-wafer scrap eyingozi kwaye ikhuphe uhambo. |
Itheyibhile 3: Uhlalutyo lokuthelekisa: I-Inline vs. Traditional Slurry Metrology
Uhlalutyo lwendabuko olungaxhunyiwe kwi-intanethi lufuna inkqubo yokukhupha isampuli kunye nokuthutha, nto leyo engenisa ukubambezeleka kwexesha okubalulekileyo kwi-metrology loop. Olu libaziseko, olunokuhlala iiyure ezininzi, luqinisekisa ukuba xa uhambo lufunyenwe ekugqibeleni, inani elikhulu lee-wafers sele lichaphazelekile. Ngaphezu koko, ukuphathwa ngesandla kwazisa ukuguquguquka kunye nomngcipheko wokonakala kwesampuli, ngakumbi ngenxa yokutshintsha kobushushu emva kokuthathwa kwesampuli, okunokuphazamisa ukufundwa kwe-viscosity.
I-Inline metrology iyawususa lo mgca wokulibaziseka obuthathaka, inika umsinga oqhubekayo wedatha ngqo ukusuka kumgca wokusasazwa. Esi santya sibalulekile ekufumaneni iimpazamo; xa zidityaniswe noyilo oluqinileyo nolungavaliyo oluyimfuneko kwizinto ezirhabaxa, ibonelela ngedatha ethembekileyo yokuzinzisa yonke inkqubo yokusasazwa. Ngelixa ubunzima be-CMP bufuna ukujonga iiparameter ezininzi (ezifana ne-refractive index okanye i-pH), uxinano kunye ne-viscosity zibonelela ngempendulo ethe ngqo, yexesha langempela malunga nokuzinza okusisiseko kokumiswa kwe-abrasive, okuhlala kungenamvakalelo kutshintsho kwiiparameter ezifana ne-pH okanye i-Oxidation-Reduction Potential (ORP) ngenxa yokufakwa kweekhemikhali.
5. Imiqathango yezoqoqosho neyezokusebenza
Iingenelo zokubeka iliso kwi-Real-Time Density kunye ne-Viscosity
Kuyo nayiphi na intambo yokwenziwa ephucukileyo aphoI-CMP kwinkqubo ye-semiconductorxa isetyenziswa, impumelelo ilinganiswa ngokuphuculwa kwesivuno okuqhubekayo, uzinzo oluphezulu lwenkqubo, kunye nolawulo oluqinileyo lweendleko. Ukubeka iliso kwi-rheological ngexesha langempela kubonelela ngeziseko zophuhliso lwedatha ezibalulekileyo ezifunekayo ukufezekisa ezi mfuno zorhwebo.
Iphucula Uzinzo lweNkqubo
Ukubeka iliso elibukhali ngokuqhubekayo, nangokuchaneka okuphezulu kuqinisekisa ukuba iiparameter ezibalulekileyo ze-slurry ezinikezelwa kwindawo yokusetyenziswa (POU) zihlala ngaphakathi kwemida yokulawula eqinileyo, nokuba kukho ingxolo yenkqubo ephezulu. Umzekelo, ngenxa yokwahluka koxinano olukhoyo kwiibhetshi ze-slurry eluhlaza ezingenayo, ukulandela nje iresiphi akwanelanga. Ngokubeka iliso kuxinano kwi-blender tank ngexesha langempela, inkqubo yolawulo inokulungisa ngokuguquguqukayo ii-dilution ratios, ukuqinisekisa ukuba uxinzelelo oluchanekileyo lwethagethi lugcinwa kuyo yonke inkqubo yokuxuba. Oku kunciphisa kakhulu ukwahluka kwenkqubo okuvela kwizixhobo ezikrwada ezingahambelaniyo, okukhokelela ekusebenzeni kokupholisha okuqikelelweyo kakhulu kwaye kunciphisa kakhulu ukuphindaphindeka kunye nobukhulu bohambo lwenkqubo olubizayo.
Ukwandisa Isivuno
Ukujongana ngqo nokusilela koomatshini kunye neekhemikhali okubangelwa ziimeko zokungaguquguquki kodaka yeyona ndlela inefuthe kakhulu yokuphuculaimveliso ye-cmp semiconductoramazinga emveliso. Iinkqubo zokubeka esweni eziqikelelayo, ezisebenza ngexesha langempela zikhusela imveliso enexabiso eliphezulu. IiFabs ezisebenzise ezi nkqubo zibonise impumelelo enkulu, kuquka neengxelo zokunciphisa ukuya kuthi ga kwi-25% kokuphuncuka kweziphene. Olu buchule bokuthintela butshintsha indlela yokusebenza ekubeni isabela kwiziphene ezingenakuphepheka iye ekuthinteleni ukwakheka kwazo, ngaloo ndlela ikhusela izigidi zeedola zeewafers kwimikrwelo emincinci kunye nomnye umonakalo obangelwa ziindidi zesuntswana ezingazinzanga. Ukukwazi ukujonga utshintsho olutshintshayo, njengokuhla kwe-viscosity ngequbuliso okubonisa uxinzelelo lobushushu okanye ukushefa, kwenza ukuba kungenelele ngaphambi kokuba ezi zinto zisasaze iziphene kwiiwafers ezininzi.
Yehlisa Ukuphinda Usebenze
Imvelisophinda usebenzeizinga, elichazwa njengepesenti yemveliso eyenziweyo efuna ukuhlaziywa kwakhona ngenxa yeempazamo okanye iziphene, yi-KPI ebalulekileyo elinganisa ukungasebenzi kakuhle kwemveliso iyonke. Amanani aphezulu okuhlaziya adla umsebenzi oxabisekileyo, izinto ezilahlwayo, kwaye azisa ukulibaziseka okukhulu. Ngenxa yokuba iziphene ezifana nokucoca, ukususwa okungafanelanga, kunye nokukrwela ziziphumo ezithe ngqo zokungazinzi kwe-rheological, ukuzinzisa ukuhamba koludaka ngoxinano oluqhubekayo kunye nolawulo lwe-viscosity kunciphisa kakhulu ukuqaliswa kwezi mpazamo zibalulekileyo. Ngokuqinisekisa uzinzo lwenkqubo, ukuxhaphaka kweziphene ezifuna ukulungiswa okanye ukuphinda zipolishwe kuyancitshiswa, okubangela ukuphucula ukusebenza kunye nokusebenza kakuhle kweqela liphela.
Ukuphucula iindleko zokusebenza
Ii-slurry ze-CMP zimele ixabiso elikhulu elinokusetyenziswa kwimeko yokwenziwa. Xa ukungaqiniseki kwenkqubo kulawula ukusetyenziswa kwemida yokhuseleko ebanzi, egcinayo ekuxubeni nasekusetyenzisweni, isiphumo kukusetyenziswa okungasebenzi kakuhle kunye neendleko eziphezulu zokusebenza. Ukubeka iliso ngexesha langempela kuvumela ulawulo lwe-slurry olungenamthungo noluchanekileyo. Umzekelo, ulawulo oluqhubekayo luvumela umlinganiselo ochanekileyo wokuxuba, ukunciphisa ukusetyenziswa kwamanzi axutyiweyo kunye nokuqinisekisa ukuba ixabiso elibizayoukwakheka kodaka lwe-cmpisetyenziswa ngokugqibeleleyo, inciphisa inkunkuma yezinto kunye neendleko zokusebenza. Ngaphezu koko, ukuxilongwa kwe-rheological ngexesha langempela kunokubonelela ngezibonakaliso zesilumkiso kwangethuba zeengxaki zezixhobo—ezifana nokuguguleka kwephedi okanye ukungasebenzi kakuhle kwepompo—okuvumela ukugcinwa okusekelwe kwimeko ngaphambi kokuba ukungasebenzi kakuhle kubangele uhambo olunzima kunye nexesha lokungasebenzi emva koko.
Ukuveliswa kwemveliso ephezulu okuqhubekayo kufuna ukususwa kokuguquguquka kuzo zonke iinkqubo ezibalulekileyo zeyunithi. Itekhnoloji ye-resonant yeLonnmeter ibonelela ngokuqina, isantya, kunye nokuchaneka okufunekayo ukuze kususwe umngcipheko kwiziseko zokuhanjiswa kodaka. Ngokudibanisa idatha yoxinano lwexesha langempela kunye ne-viscosity, iinjineli zeenkqubo zixhotyiswe ngobukrelekrele obuqhubekayo, obunokusebenza, ukuqinisekisa ukusebenza okuqikelelweyo kokupholisha kunye nokukhusela isivuno se-wafer ngokuchasene nokungazinzi kwe-colloidal.
Ukuqalisa utshintsho ukusuka kulawulo lwe-reactive yield ukuya kulawulo lwenkqubo esebenzayo:
Yenza nkuluIxesha lokuphumla kunyeNciphisaUkuphinda usebenze:KhuphelaIinkcukacha zethu zobugcisa kunyeQalisai-RFQ Namhlanje.
Simema iinjineli eziphezulu zeenkqubo kunye nemveliso ukubangenisai-RFQ eneenkcukacha. Iingcali zethu zobugcisa ziza kuphuhlisa imephu yendlela echanekileyo yokusetyenziswa, idibanise itekhnoloji yeLonnmeter echanekileyo kwisiseko sakho sokusasazwa kwe-slurry ukuze kulinganiswe ukwehla okucwangcisiweyo koxinano lweziphene kunye nokusetyenziswa kwe-slurry.QhagamshelanaIqela lethu le-Process Automation ngokukhuselekileinzuzo yakho yesivuno.Fumanisaukuchaneka okubalulekileyo okufunekayo ukuze uzinzise inyathelo lakho elibaluleke kakhulu lokucwangciswa kwesicwangciso.
