Ukulinganiswa kokuhamba kwamanzi kubaluleke kakhulu ekusikeni ucingo lwedayimani lwe-silicon wafer, njengoko kuqinisekisa ukuhanjiswa ngokuchanekileyo kolwelo lokusika kwindawo ejongene ne-wire-wafer—kubalulekile ekugcineni ukupholisa, ukuthambisa, kunye nokususa ubumdaka ngendlela efanelekileyo.RIdatha yokuhamba kwexesha le-eal ithintela ukuhanjiswa kolwelo okunganelanga okanye okugqithisileyo, okuya kubangela ubushushu obugqithisileyo, ukwaphuka kwentambo, iziphene zomphezulu, okanye inkunkuma. Ukulinganisa ngokuchanekileyo kunciphisa ukuguquguquka kwenkqubo, kukhusela ukutyibilika kwe-wafer kunye nokuthembeka komphezulu, kwandisa ubomi bentambo, kwaye kuphucula ukusebenza kakuhle kwezixhobo.
Isishwankathelo sokuSika iSilicon Wafer kunye nendima yokuSika ulwelo
Ukusikwa kwentambo yedayimani yindlela ebalaseleyo yokusika ii-ingots ze-silicon ze-monocrystalline kunye ne-multicrystalline zibe zii-wafers ukuze kusetyenziswe ii-semiconductor kunye ne-photovoltaic. Kule nkqubo, intambo yentsimbi—ngokuvamile i-40–70 μm ububanzi—igqunywe ngeenkozo ze-diamond abrasive. Intambo ihamba ngesantya esiphezulu, kwaye iidayimani ezifakwe ngaphakathi zicola i-silicon ngokukrazula, zinciphisa iziphene zomphezulu kwaye zikhuthaza ukufana kwe-wafer. Iintambo ezincitshisiweyo zobubanzi ezivezwe kwiminyaka yakutshanje zinciphisa ukulahleka kwe-kerf, okubhekiselele kwizinto ezichithwayo njengee-silicon particles ezincinci ngexesha lokusebenza kokukrazula. Ukulahleka kwe-kerf kuchazwa bububanzi bentambo kunye nokuphakama kweenkozo ze-abrasive eziphuma kumphezulu wentambo.
Ukusikwa kweDayimane ngeCingo
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Ukusika ulwelo kudlala indima ebalulekileyo ekusikeni intambo yedayimani. Umsebenzi wabo ophambili kukupholisa i-ingot kunye nentambo, ukuthintela ubushushu obugqithisileyo obunokonakalisa i-silicon okanye bunciphise ubomi bentambo. Zikwahlamba amasuntswana amancinci e-silicon avelisiweyo ngexesha lokusika, okunceda ukugcina ujongano olucocekileyo, ukuthintela ukuphinda kubekwe inkunkuma, kunye nokunciphisa imifantu engaphezulu kwi-wafer. Ngaphezu koko, ukusika ulwelo kuyathambisa inkqubo, kunciphisa ukungqubana phakathi kwentambo kunye ne-silicon, ngaloo ndlela kwandisa ubomi bentambo kwaye kuphucule umgangatho wokusikwa. Ulwakhiwo kunye neempawu zomzimba zokusika ulwelo lwe-wafer ye-silicon—ezifana ne-viscosity kunye noxinano—kufuneka zilawulwe ngononophelo ukuze kuphuculwe ukupholisa, ukususwa kweetship, kunye nokukhuselwa kwentambo.
Kukho iintlobo ezahlukeneyo zolwelo lokusika iiwafer, kuquka ulwelo olusekelwe emanzini olunezongezo zokuphucula ukuthambisa kunye nokuxhonywa kwamasuntswana. Ukhetho luxhomekeke kuyilo lwezixhobo, iinkcukacha zewafer, kunye nemida yokusingqongileyo. Imizekelo ibandakanya amanzi angena iion anee-surfactants okanye ii-glycols, ezenzelwe ukulinganisela ukusebenza kakuhle kokupholisa kunye nokwakheka kwentsalela ephantsi.
Ukuvela kweengcingo zedayimani ezibhityileyo kakhulu kwizityalo zanamhlanje ze-wafer kwandisa imingeni ekuhanjisweni kolwelo kunye nolawulo lwenkqubo. Njengoko ububanzi beengcingo buncipha ngaphantsi kwe-40 μm, umngcipheko wokuqhekeka kweengcingo uyanda kwaye ukunyamezela ukuguquguquka kwenkqubo kuyaqina. Ukulinganiswa kwesantya sokuhamba okuchanekileyo—okuxhaswa ziiteknoloji ezifana nokusika iimitha zokuhamba kolwelo, iinzwa zokulinganisa ukuhamba okuchanekileyo, kunye neenzwa zokuhamba kobunzima beCoriolis—kubalulekile ukugcina ukupholisa okusebenzayo kunye nokususwa kobumdaka. Iinzwa zokujonga ulwelo kunye nezisombululo zokulinganisa ukuhamba kolwelo olucutshungulwayo kwimizi-mveliso zenza ukuba abaqhubi bakwazi ukulandelela nokulungisa amazinga okuhamba ngexesha langempela, befezekisa ukuthambisa okuphezulu kunye nomgangatho womphezulu. Ukuchaneka kweemitha zokuhamba zeCoriolis kubaluleke kakhulu ekulawuleni ulwelo olunobunzima obahlukeneyo kunye nokuqina, ukuqinisekisa iimeko ezihambelanayo nangona isantya sokusika kunye noxinzelelo lweengcingo lusanda.
Oku kukhula kwemfuno yokuchaneka kuye kwatshintsha ugxininiso lwaya ekujongeni iiparameter zolwelo oluguquguqukayo ezifana nesantya sokuhamba, uxinano, kunye ne-viscosity. Izixhobo ezifana nezo zaseLonnmeter zibonelela ngemilinganiselo ethembekileyo, yexesha langempela efunekayo ekuqinisekiseni umgangatho kunye nokwenza ngcono inkqubo kwimisebenzi yokusika ucingo lwedayimani ephucukileyo. Njengoko iteknoloji yocingo iqhubeka ihambela phambili, ukuhlanganiswa kweteknoloji yokulinganisa ukuhamba okuqinileyo kubalulekile ekugcineni i-wafer throughput, ukunciphisa ilahleko ye-kerf, kunye nokunciphisa iimfuno zokugqiba ezisezantsi kwicandelo lokuvelisa i-silicon wafer.
Imingeni yokuhanjiswa kolwelo ekusikweni kweentambo zedayimani ezichanekileyo
Kwi-diamond wire cutting ye-silicon wafers ezibhityileyo kakhulu—ingakumbi ezo zingaphantsi kwe-40 µm—ukuhambisa ubungakanani obufanelekileyo be-silicon wafer cutting fluid kwi-slicing interface kuba ngumceli mngeni omkhulu. Njengoko ubukhulu be-wire buncipha, nendawo yokuhamba kolwelo iyancipha. Ukugcina ulwelo olusikiweyo rhoqo kubalulekile ukuqinisekisa ukuthambisa, ulawulo lobushushu, kunye nokususwa kwenkunkuma kwindawo yokudibana.
Ukuhamba kolwelo okungahambelaniyo okanye okunganelanga kukhokelela ngqo ekufakweni kwe-wafer, apho i-wafer inamathela ngokungafunekiyo kwizixhobo ngenxa yokungathambisa ngokwaneleyo. Oku akuphazamisi nje kuphela inkqubo yokusika kodwa kwandisa nomngcipheko wokuphuka kwe-wafer okanye umonakalo. Uburhabaxa bomphezulu bunyuka kakhulu xa ucingo kunye ne-wafer zingafumani ukuthambisa okuqhubekayo kunye nokupholisa okuvela kulwelo lokusika i-wafer yedayimani. Iindawo ezonakeleyo kunye neziphene ezincinci ezibangelwa yiyo zinciphisa umgangatho kunye nesivuno se-wafer, nto leyo ebangela imiqobo emikhulu kumashishini e-semiconductor kunye ne-photovoltaic.
Izinto ezintathu eziphambili zichaphazela ukungena kolwelo kwisithuba sokusarha esincinci: i-wire geometry, isantya sokusika, kunye nesenzo se-capillary. I-wire geometry—ingakumbi ububanzi be-wire kunye nokusasazwa kweenkozo zedayimani—zichaphazela ngokuthe ngqo indlela ulwelo lokusika i-silicon wafer oluhamba ngayo kwaye lunamathela lula kwindawo yoqhagamshelwano. Xa usebenzisa iingcingo ezingaphantsi kwama-40 µm, indawo encinci yomphezulu ithintela ukuhamba ngokukhululekileyo kolwelo. Izantya zokusika eziphezulu zinciphisa ixesha elikhoyo lokuba ulwelo lufikelele kwaye lupholise i-interface, nto leyo ekhokelela ekutshiseni kakhulu kwindawo ethile kunye nokuthambisa okungekho semgangathweni. Isenzo se-capillary, amandla endalo olwelo okutsalwa kwiindawo ezimxinwa, simisela ngamandla ukugcinwa kolwelo. Nangona kunjalo, iibhulorho ezifanayo zolwelo eziphucula ukuthuthwa kolwelo zinokuzisa ukunamathela kwe-capillary phakathi kweengcingo ezikufutshane, okubangela uxinzelelo olungafaniyo kunye nokwanda kokuguquguquka kobukhulu be-wafer.
Ukwaziswa kweentlobo zolwelo oluphezulu lokusika i-wafer—kuquka izisombululo eziphuculweyo ze-nanoparticle—kukubonelela ngophuculo olulinganisekayo. Ulwelo oluyilwe nge-SiO₂ okanye i-SiC nanoparticles lungena kwizikhewu ezimxinwa ngempumelelo ngenxa ye-viscosity ephuculweyo kunye nokusebenzisana komphezulu. Olu lwelo luphucula ukuthambisa kwaye luthwala ubushushu ngokufanelekileyo, nto leyo ebangela ukuba umphezulu ube rhabaxa kwaye uphucule ukuthamba kwe-wafer. Uphando lubonisa ukuba ukusebenzisa ulwelo olugcwele i-nanoparticle kutshintsha intsimi yobushushu ngexesha lokusika, kunciphisa uxinzelelo olusongela ukuthembeka kwe-wafer. Oku, kudityaniswe neendlela ezifana nokungcangcazela kwe-ultrasonic ukukhulisa ukuthuthwa kwe-capillary, kuvumela ukuhanjiswa kolwelo olufana ngakumbi lwe-diamond wire cutting.
Ukuhanjiswa kolwelo rhoqo kufuna ukujongwa ngokuchanekileyo nangexesha langempela kunye nokulungiswa. Ukulinganiswa kokuhamba kolwelo olucutshungulwayo kwimizi-mveliso kuba yinto ebalulekileyo, ingakumbi kwiinkqubo ezilawulwa ngokuqinileyo. Ukusebenzisa imitha yokuhamba kolwelo olucutshungulwayo—njengesensor yokulinganisa ukuhamba kobunzima beCoriolis echanekileyo kakhulu—kwenza kube lula ukulawula izinga lokuhanjiswa. Iimitha zoxinano kunye ne-viscosity zeLonnmeter, xa zidibene nezixhobo zokulinganisa izinga lokuhamba kolwelo ezichanekileyo, zinegalelo ekwenzeni ngcono ukunikezelwa kolwelo ukuze nee-wafers ezincinci zisikwe kakuhle, kwaye zinomngcipheko omncinci wokuphazamiseka.
Ukulinganiswa Kokuhamba Kolwelo kwimisebenzi Yokusika I-Wafer
Ukulinganisa izinga lokuhamba kwamanzi ngokuchanekileyo kubalulekile ekuphuculeni ukuhanjiswa kolwelo lokusika ekusikeni i-wafers ye-silicon wire diamond. Ukusebenza kolwelo lokusika i-silicon wafer kuhambelana ngqo nokuphola, ukuthambisa, kunye nokususwa kwenkunkuma kwindawo yoqhagamshelwano, okuchaphazela umgangatho womphezulu we-wafer, ilahleko ye-kerf, kunye nemveliso iyonke. Ukuhamba kwamanzi okunganelanga okanye okugqithisileyo kutshintsha ukusebenza kakuhle, kwandisa ukuguguleka kwezixhobo, kwaye kunokubangela umgangatho we-wafer ongaguqukiyo okanye iindleko eziphezulu zezixhobo. Uphando oluphambili lubonisa ukuba ukurhabaxa komphezulu (Ra) kunye nomonakalo ongaphantsi komhlaba kunokunciphisa ngokugcina izinga lokuhamba kwamanzi okusika ngaphakathi koluhlu olufanelekileyo lwe-0.15–0.25 L/min kwiimashini eziqhelekileyo zentambo enye, njengoko ukuhamba kwamanzi okunganelanga kukhokelela kwiimfanta ezincinci kunye nokuqokelelwa kwenkunkuma, ngelixa ukuhamba kwamanzi okugqithisileyo kungenisa isiphithiphithi kunye nokusetyenziswa okungeyomfuneko.
Iitekhnoloji zokusika umlinganiselo wokuhamba kolwelo
Iimitha zokuhamba kolwelo ezisikiweyo zidityaniswa kwimigca yokubonelela ngolwelo, zilinganisa umthamo wolwelo olusikiweyo lwentambo yedayimani ngexesha langempela. Ubuchwepheshe obuqhelekileyo bokulinganisa ukuhamba kolwelo buquka iintlobo zoomatshini, ze-elektroniki kunye neze-ultrasonic:
- Iimitha zokuhamba koomatshini, ezifana noyilo lweturbine kunye ne-paddlewheel, zisebenzisa izinto ezijikelezayo ezisuswa kukuhamba kolwelo. Zilula kwaye ziqinile kodwa zinokonakala ngenxa yolwelo olurhabaxa.
- Iimitha zokuhamba nge-elektroniki, ingakumbi uyilo lwe-electromagnetic, zilinganisa isantya solwelo kusetyenziswa imigaqo yokungenisa i-electromagnetic, zibonelela ngokusebenza okuthembekileyo, okusebenzayo nokugcina ukukhanya kwii-conductive fluids.
- Iimitha zokuhamba ze-ultrasonic zisebenzisa amaza esandi ahamba rhoqo athunyelwa kwaye amkelwe kumbhobho. Ngokulinganisa umahluko wexesha lokuhamba kwesandi kunye nokuchasana nokuhamba, ezi zixhobo zibonelela ngomlinganiselo ongangeneleliyo nochanekileyo ofanelekileyo kwiintlobo ezahlukeneyo zolwelo lokusika i-wafer.
Ukulinganiswa kobuninzi beCoriolis kuyabonakala kwiindawo apho kufuneka ulawulo oluchanekileyo lobunzima bolwelo, nokuba i-viscosity okanye utshintsho lobushushu lunjani. Ii-sensors zokuhamba kobunzima beCoriolis zilinganisa ngokuthe ngqo izinga lokuhamba kobunzima ngokusekelwe kwisiphumo seCoriolis, zibonelela ngokuchaneka okuphezulu kunye nokufaneleka kolwelo lokusika ucingo lwedayimani olusekelwe emanzini kunye nolwe-oyile. I-Lonnmeter yenza imitha yoxinano olungaphakathi kunye ne-viscosity, evumela ngakumbi ukujonga iipropati zolwelo ukuze kubekho ukuhambelana kunye nolawulo olufanelekileyo lwenkqubo ekusikeni i-silicon wafer.
Iiparameters zoBuchule bokuLinganisa kunye nokubekwa kweSensor
Ukulinganisa ngokuchanekileyo ukuhamba kolwelo ekusikeni kwe-wafer kufuna ingqalelo kwiiparameter ezininzi ezibalulekileyo:
- Izinga lokuhamba (L/min): Umlinganiselo oyintloko wokuphucula inkqubo kunye nokuqinisekisa umgangatho.
- Ubuninzi kunye nokuxinana: Zombini zichaphazela kakhulu ukusebenza kokupholisa, ukuthuthwa okurhabaxa, kunye nokususwa kobumdaka.
- Ubushushu: Buchaphazela ukuxinana kunye nokuziphatha kolwelo kwindawo esikiweyo.
Ukubekwa kwesensor kubaluleke kakhulu. Izinzwa zokulinganisa ukuhamba kwamanzi kufuneka zibekwe ngqo kumgca wokuhambisa ulwelo kufutshane nendawo yokusika kangangoko kunokwenzeka ukunciphisa ukungangqinelani okubangelwa kukumelana nemibhobho, ukuvuza, okanye ukufuma ngaphambi kokuba kungene ujongano lokusika. Ukulinganiswa kwe-inline ngexesha langempela kuqinisekisa ukuba ixabiso lokuhamba kwamanzi elixeliweyo lihambelana nobonelelo lokwenyani kwindawo yokusika ucingo lwedayimani.
Umsebenzi wokulinganisa ukuhamba kwamanzi ekugcineni iindawo ezilungelelanisiweyo zokusika
Izinzwa zokulinganisa ukuhamba kwamanzi zibalulekile ekujongeni ngexesha langempela kunye nolawulo oluhambelanayo lokuhanjiswa kolwelo kwi-industrial silicon wafer cutting. Ukugcina izinga lokuhamba elifanelekileyo kuqinisekisa ukutshatyalaliswa kobushushu okwaneleyo, ukususwa kobumdaka okuqhubekayo, kunye nokuthambisa okufanayo kwi-diamond wire. Ngaphandle koku, uzinzo lwenkqubo luyehla, ubomi be-wire buyancipha, kwaye isivuno siyahlupheka ngenxa yomngcipheko ophezulu weziphene zomphezulu okanye ukulahleka okukhulu kwe-kerf.
Ngokudibanisa umlinganiselo wesantya sokuhamba ngokuchaneka okuphezulu kunye nezinye iiparameter zempendulo (umz., isantya sentambo, isantya sokutya), abavelisi banokunyanzelisa ulawulo oluhambelanayo lomda wenkqubo, bedibanisa ngokuthe ngqo uhlengahlengiso lwesantya sokuhamba kunye nokusebenza okubonakalayo kokusika. Ngenxa yoko, naluphi na uphambuko kwi-envelope yokuhamba ecwangcisiweyo lubangela isenzo sokulungisa ngokukhawuleza, ukukhusela umgangatho wenkqubo kunye nokusebenza kakuhle kwezixhobo.
Ngamafutshane, umlinganiselo wokuhamba kolwelo lokusika oluvela kwimizi-mveliso—oxhomekeke kwiisensa zokulinganisa ukuhamba okuqinileyo kunye nedatha yexesha langempela—usebenza njengesiseko semveliso ye-silicon wafer enenzuzo ephezulu nengabizi kakhulu kwixesha lokusika ucingo lwedayimani.
Umlinganiselo wokuhamba kobunzima beCoriolis: Imigaqo kunye nokusetyenziswa
Ukulinganiswa kobuninzi beCoriolis kusekelwe ekufumaneni amandla asetyenziswa lulwelo oluhamba kwiityhubhu ezingcangcazelayo. Njengoko ulwelo luhamba—njengolwelo lokusika intambo yedayimani okanye ulwelo olukhethekileyo lokusika i-silicon wafer—iityhubhu zifumana utshintsho oluncinci nolulinganisekayo lwesigaba. Olu tshintsho luhambelana nesantya sokuhamba kobunzima, lubonelela ngokulinganisa ngokuthe ngqo, ngexesha langempela kobunzima bolwelo lokusika oluhanjiswayo. Umgaqo ofanayo uvumela ukulinganiswa ngaxeshanye kobuninzi bolwelo, ukuxhasa ukuchaneka okuphezulu kuzo zonke iintlobo zolwelo olutshintshayo, ukwakheka, kunye namaqondo obushushu—imfuneko ebalulekileyo ekuvelisweni kwe-silicon wafer kunye nokusetyenziswa kwezicelo zokusika intambo yedayimani.
Iingenelo zale ndlela kwiintlobo zolwelo lokusika i-wafer, ingakumbi xa kusetyenziswa ulwelo lokusika ucingo lwedayimani olusebenza kakuhle, zinkulu kakhulu. Ukulinganiswa kokuhamba kweCoriolis akuxhomekekanga kwi-viscosity yolwelo kunye notshintsho lokwakheka, kuhlala kuchanekile kakhulu phakathi kobukho bee-particles ezirhabaxa, ii-nano-additives, okanye imixube eyahlukeneyo edla ngokufumaneka kwi-cutting fluids ze-silicon wafers. Olu kuqina luyenza ibe ngcono kuneendlela zendabuko zokuhamba kwe-volumetric, ezinokuchaphazeleka ngamaqamza, ii-particles ezixhonyiweyo, kunye neempawu zomzimba ezitshintshayo zolwelo lokusika oluphambili.
Ukusikwa kwe-wafer ye-semiconductor kuxhomekeke ngakumbi kubuchwepheshe be-fluid flow sensor obuphambili ukuqinisekisa ukujonga okuthembekileyo kolwelo lokusika kwii-wafer ze-silicon. Ii-Lonnmeter inline mass flow sensors, ezisebenzisa i-Coriolis effect, zisetyenziswa ngqo kwimigca yenkqubo. Oku kwenza ukuba ukuhanjiswa ngokuchanekileyo kunye nokujonga ulwelo lokusika i-nano-fluid kunye ne-diamond wire ngexesha lokusika ii-wafer. Iimpawu zokuwohloka kolwelo, ukungangqinelani komxube, okanye utshintsho loxinano zifunyanwa ngokukhawuleza, okuvumela ukungenelela kolawulo ngokukhawuleza ukugcina isivuno senkqubo kunye nomgangatho womphezulu.
Ukuthelekisa ii-sensors zokuhamba kobuninzi beCoriolis nezinye ii-sensors zokujonga ulwelo lokusika—ezifana neenkqubo zokuhamba kobushushu, i-electromagnetic, okanye i-ultrasonic—kubonisa amandla aliqela. Ii-sensors zokuhamba kobunzima beCoriolis zigqwesile ekulinganiseni ukuhamba kobuninzi ngokuchanekileyo kwaye zibonelela ngokufundwa okusekwe kubunzima okungachaphazeleki kukuguquguquka kwe-viscosity okanye iimpawu zemagnethi. Iimitha ze-electromagnetic kunye ne-ultrasonic ziyasokola ngemixube yokusika ulwelo equlethe ii-nanoparticles, iipokotho zomoya, okanye utshintsho loxinano lwemizuzu, okuhlala kukhokelela ekulinganisweni kwesantya sokuhamba esingathembekanga kunye nokwanda kwesantya sokugcinwa.
Ukuchaneka kwemitha yokuhamba kweCoriolis kugcinwa phantsi kokutshintsha kwezinto ezisetyenziswa kulwelo, njengoko iinkqubo zokucubungula isignali kunye nokulungisa ubushushu zihluza ngokufanelekileyo ingxolo kunye nokwahluka kokusingqongileyo. Abaqhubi banokusebenzisa idatha yexesha langempela ukuze baphucule ukupholisa, ukuthambisa, kunye nokususwa kweenxalenye, besabela kwiimpawu ezahlukeneyo zeentlobo ezahlukeneyo zolwelo lokusika i-wafer kunye nemixube ye-nanofluid.
Ukulungelelaniswa komlinganiselo wokuhamba kobunzima beCoriolis ukuya kwi-sawing ye-wire ebhityileyo kakhulu kunye nolwelo lokusika olune-nanoparticles kuphawula utshintsho ekubekweni esweni kwemizi-mveliso. Ii-sensors zilinganisa ngokuthembekileyo ukuhamba kobunzima bokwenyani kunye noxinano, nokuba umxholo wamasuntswana okanye ukungafani kolwelo, okuvumela ulawulo oluvaliweyo kunye nolawulo oluzenzekelayo lolwelo olulungiselelwe ukusika i-wafer. Eli nqanaba lokulinganisa ukuhamba okuchanekileyo okuphezulu liphambili ekugcineni uzinzo lwenkqubo, ukunciphisa ukulahleka kwezinto, kunye nokuqinisekisa ukuthembeka komphezulu ngexesha lokwenziwa kwe-silicon wafer kunye neenkqubo zokusika i-diamond wire.
Ukudibanisa idatha yokulinganisa ukuhamba komoya kulawulo lwenkqubo
Ukulinganisa ukuhamba kwamanzi ngexesha langempela kusetyenziswa izinzwa zokuhamba kobunzima beCoriolis kutshintshe ulawulo lokusika ulwelo ngexesha lokusika i-wafers ze-silicon wire wire. Iimitha zoxinano oluphakathi kunye ne-viscosity, ezifana nezo zenziwe yiLonnmeter, zivumela ukujonga ngokukhawuleza iimpawu zolwelo kunye nesantya sokuhamba kwamanzi, zixhasa ngokuthe ngqo ulawulo oluchanekileyo lwenkqubo.
Ukugcina amazinga okuhamba afanelekileyo kubalulekile ekupholiseni, ekucoceni, nasekuthambiseni ucingo lwedayimani kunye nee-silicon wafers ngempumelelo. Iimitha zokuhamba kobunzima beCoriolis ziyaphumelela kule ndawo ngokubonelela ngempendulo echanekileyo, yexesha langempela malunga nokuhamba kobunzima kunye neempawu zolwelo. Ngale datha, iinkqubo ezizenzekelayo zinokulungisa isantya sepompo, iindawo zevalvu, okanye ziphinde zisebenzise amazinga okubuyisela ukuze zinikeze ngokuchanekileyo umthamo ofunekayo kunye nokwakheka kolwelo lokusika i-wafer. Umzekelo, ngexesha lemijikelo yokusika ngokukhawuleza, idatha yesenzwa inokubangela ukuhanjiswa kolwelo okwandisiweyo ukuze kususwe ukungcola okuphuculweyo kunye nokuphola, ngelixa imijikelo ecothayo inokufuna ukuhamba okuncitshisiweyo ukuze kuthintelwe inkunkuma.
Ingxelo evela kwizinzwa zokulinganisa ukuhamba kwamanzi ikwabalulekile ekuphenduleni kwiimeko zolwelo ezitshintshayo. Njengoko i-viscosity yolwelo okanye ubuninzi butshintsha—ngenxa yotshintsho lobushushu okanye ungcoliseko—iimitha ezingaphakathi zeLonnmeter zibona olu tshintsho ngoko nangoko, zivumela iinkqubo zolawulo ukuba zibuyisele ngokulungelelanisa amazinga okuhamba kwamanzi okanye ukuqalisa ukuhluza ulwelo. Le ndlela i-granular, eqhutywa yidatha iqinisekisa ukuba ulwelo luhlala ngaphakathi kweenkcukacha eziqinileyo ukuze kusebenze kakuhle ukusika.
Kwiindawo ezinomthamo omkhulu, ukukwazi ukujonga nokulawula ukuhamba kolwelo ngexesha langempela kuxhasa ukutyeba okulinganayo kwaye kunciphisa ukwenzeka kweziphene ezibizayo, njengoko kubonisiwe kwimigca yokuvelisa ephambili e-Asia naseYurophu. Ulawulo oluphambili lolwelo lukwaxhasa ukugcinwa kwangaphambili, okwandisa ubomi bentambo yedayimani.
Imisebenzi yemizi-mveliso ixhamla kakhulu kwiinkqubo zolwelo olunqunyulwayo olulawulwa ukuhamba kwamanzi. Ulawulo lolwelo olusebenzayo lunciphisa iindleko zokusetyenziswa kunye nokulahla ngokuqinisekisa ukuba kusetyenziswa ulwelo olwaneleyo kwi-wafer nganye, okuxhasa uzinzo kunye nokuthotyelwa kwemithetho. Ukunciphisa inkunkuma yolwelo—okubangelwa yimpendulo eqhubekayo kunye nohlengahlengiso olusekelwe kwidatha yesensor—kuguqulela ekunciphiseni iindleko zokusebenza kunye nokunciphisa umngcipheko wokusingqongileyo.
Ngamafutshane, ukuhlanganiswa kwedatha yokulinganisa ukuhamba kwexesha langempela, enikwe amandla zizisombululo zeLonnmeter ezikwimigca engezantsi, akusiyo nje isiseko sokuqinisekisa umgangatho we-wafer kodwa ikwayinzuzo yokusebenza kwenkqubo yokusika ucingo lwedayimani. Ibonelela ngophuculo olulinganisekayo ekugqityweni komphezulu, ukuthembeka koomatshini, isivuno semveliso, kunye nokusebenza kakuhle kweendleko.
Ukuqonda kovavanyo kunye neSikhokelo seShishini
Izifundo zovavanyo zakutshanje zitshintshe iindlela ezilungileyo zokuhambisa ulwelo lokusika ii-wafers ze-silicon wire wire. Uphando lubonisa ukuba ukuhanjiswa kolwelo olulawulwa ngokuchanekileyo, ingakumbi kusetyenziswa iindlela eziphambili, kuhambelana ngokuthe ngqo nokufunxwa kwe-wafer okuphantsi kunye nomgangatho ongcono womphezulu.
Ukusetyenziswa kwe-ultrasonic capillary effect ekuhanjisweni kolwelo kuye kwavela njengento etshintsha umdlalo. Amaza e-ultrasonic aqhuba ulwelo olusikiweyo lungene nzulu kwii-kerfs ezincinci kakhulu—ingakumbi kwiindawo ezingaphantsi kwe-50 μm—apho iindlela zokubonelela zemveli zihlala zingaphumeleli. Oku kungena okuphuculweyo kunciphisa kakhulu ukufunxwa kwamasuntswana arhabaxa kunye nenkunkuma kumphezulu we-wafer. Uvavanyo olubonakalayo lubonisa ukuba ii-wafers eziphantsi kobonelelo lolwelo oluncediswa yi-ultrasonic zibonisa iziphene ezimbalwa zomphezulu, ngaloo ndlela isivuno esiphezulu kunye nokuthembeka kwiinkqubo ezisezantsi.
Ukulungiswa kweeparameter kubalulekile ekuphuculeni iingenelo zokuphucula i-ultrasonic kunye netekhnoloji ye-nano-fluid ekunciphiseni ukuhanjiswa kolwelo. Iiparameter eziphambili ziquka:
- Umgama wepleyiti: Umsantsa ophakathi kwendawo yokugcina ulwelo kunye nendawo yokusika kufuneka uncitshiswe ukuze ulwelo lunyuke kakuhle.
- Indawo ye-ultrasonic transducer kunye nokuhambelana kokuseta: I-geometry echazwe ngokucacileyo iqinisekisa ukuhanjiswa kwamaza okufanayo kunye nesenzo se-capillary.
- Ubushushu bolwelo: Ubushushu obulawulwayo buyandisa ukuhamba kolwelo kunye nokusebenza kakuhle kwee-capillary.
- Ubude kunye nokuphindaphinda kokusetyenziswa kwe-ultrasound: Ixesha elifanelekileyo lithintela ukugqithisa kakhulu ngelixa liphucula ukungena kwamanzi.
- Ukukhetha uhlobo lolwelo: Ulwelo olusisiseko olwahlukeneyo kunye nezongezo zisabela ngokukodwa ekuvuseleleni kwe-ultrasonic.
Itekhnoloji ye-Nanofluid iveza enye inkqubela phambili enkulu. Ulwelo lokusika oluxutywe nee-nanoparticles ezifana ne-SiO2 kunye ne-SiC lubonisa ukuphuculwa kokuqhuba kobushushu kunye nokuthambisa. Olu tshintsho lukhokelela ekupholiseni okusebenzayo ngakumbi, ukususwa kobumdaka okuphuculweyo, kunye nokuncipha koburhabaxa bomphezulu we-wafer. Idatha ibonisa ukuba iifomyula ze-nano-particle ezixutyiweyo zibonelela ngophuculo oluhambelanayo, zinciphisa ngakumbi i-warpage kwaye zivelise imo ye-wafer engcono kune-single-type okanye i-conventional cutting fluids.
Abavelisi abafuna ukuphucula ukusebenza kakuhle kolwelo lwabo lokusika banokusebenzisa ezi zikhokelo zokusebenza zilandelayo:
- Sebenzisa iimitha zoxinano oluphakathi kunye neemitha ze-viscosity (ezifana nezo zivela eLonnmeter) ukujonga nokulawula ukuhambelana kolwelo, ukuqinisekisa ukuba iipropati zokuhamba kwamanzi zihlala zilungele uncedo lwe-ultrasonic kunye ne-nano-assist.
- Jonga kwaye ulungise amazinga okuhamba kolwelo olusikiweyo usebenzisa i-sensor yokulinganisa ukuhamba kolwelo oluchanekileyo kakhulu. Ukulinganiswa kokuhamba kolwelo olusikiweyo ngobuninzi beCoriolis kuluncedo ngokukodwa ekulinganisweni kokuhamba kolwelo olusikiweyo kwimizi-mveliso, okubonelela ngokuchaneka ngexesha langempela kokubini uxinano kunye nomthamo.
- Lungisa rhoqo iisensa zokulinganisa ukuhamba kwamanzi ukuze ugcine ukufundwa okuthembekileyo, okubalulekileyo ekucutshungulweni kwe-wafer rhoqo.
- Khetha iintlobo zolwelo lokusika i-wafer kunye noxinzelelo lwe-nanoparticle oluhambelana nobukhulu be-wafer ethile, iimpawu zentambo yedayimani, kunye nendawo yokusebenza.
Izifundo zokuthelekisa ziqinisekisa ukuba utshintsho lweparameter ye-single-factor—njengokunyusa isantya se-wire okanye ukulungisa isantya sokutya—luhambelana notshintsho ekugugulekeni kwe-wire, uburhabaxa bomphezulu, kunye notshintsho lobukhulu obupheleleyo (TTV). Ukugcina ukuchaneka kokuhamba kwamanzi kunye nokunikezelwa kolwelo ngokukhawuleza nangokuphendulayo kubalulekile ekunciphiseni iziphene kunye nokwandisa ubomi be-wire.
Imibuzo ebuzwa qho
Ulwelo lokusika i-silicon wafer luyiphucula njani indlela esika ngayo i-diamond wire wire?
Ulwelo lokusika i-silicon wafer lusebenza njengesithambisi kunye nesipholileyo ekusikeni i-diamond wire. Umsebenzi walo oyintloko kukunciphisa ukungqubana kunye nokususa ubushushu obuveliswa kwindawo yokuhlangana kwe-wire-wafer. Ukungqubana okuphantsi kunye namaqondo obushushu kunciphisa ukuqhekeka okuncinci kunye nokukrweleka komphezulu, okunokukhokelela ekonakaleni kwe-wafer kunye nokunciphisa isivuno iyonke. Ulwelo lukwathwala inkunkuma kwindawo yokusika, lugcina i-diamond wire kunye nomphezulu we-wafer ucocekile. Oku kususwa rhoqo kwamasuntswana kubangela ukuba iindawo ze-wafer zibe bushelelezi kwaye zixhasa ukwenziwa rhoqo, okusemgangathweni ophezulu. Umzekelo, ulwelo oluphuculweyo lwe-nano-cutting olune-SiO₂ kunye ne-SiC nanoparticles lunokungena nzulu kwi-kerf, lunciphise uburhabaxa bomphezulu kunye ne-wafer warpage, luphucule ngakumbi imveliso ye-wafer yokusetyenziswa kwe-semiconductor.
Yintoni imitha yokuhamba kolwelo lokusika, kwaye kutheni ibalulekile ekusekweni kwe-wafer?
Imitha yokuhamba kolwelo olusikiweyo ilinganisa ubungakanani obuchanekileyo bolwelo oluthunyelwa kwindawo yokusarha. Ukugcina ukuhamba okuchanekileyo kubalulekile ukuze kuthanjiswe ngokufanelekileyo, kususwe ubushushu, kwaye kususwe ubumdaka. Ukuba ukuhamba kuphantsi kakhulu, ucingo luyatshisa kakhulu okanye luqokelele ubumdaka, nto leyo ebangela imikrwelo kunye nokuqhekeka. Ukuhamba okugqithisileyo kunokuchitha ulwelo kwaye kudale ukungalingani koxinzelelo, okuchaphazela ukutyibilika kwe-wafer kunye nobomi besixhobo. Ukusika iimitha zokuhamba kolwelo, ezifana neemitha zoxinano olungaphakathi kunye neemitha ze-viscosity ezenziwe yiLonnmeter, kunceda abaqhubi ukuba bajonge kwaye balungise unikezelo ngexesha langempela. Oku kuqinisekisa ukuba inkqubo ihlala ngaphakathi kweeparamitha ezifanelekileyo, ikhulisa isivuno se-wafer kwaye inciphise ukuguguleka kwesixhobo.
Ukulinganiswa kobuninzi beCoriolis kunceda njani ukulawula ulwelo lokusika i-silicon wafer?
Ukulinganiswa kokuhamba kobunzima beCoriolis kubaluleke kakhulu ekulinganisweni kokuhamba ngokuchanekileyo okuphezulu kwimveliso ye-silicon wafer. Ngokungafaniyo neemitha zokuhamba zemveli, ii-sensors zeCoriolis zilinganisa ngokuthe ngqo ukuhamba kobunzima nokuba ulwelo lungakanani na, uxinano, okanye utshintsho lobushushu. Olu phawu lwenza kube lula ukujonga ngokuchanekileyo iintlobo ezahlukeneyo zolwelo lokusika i-wafer, kuquka nezo zine-nanoparticles. Isiphumo kukuhanjiswa rhoqo kolwelo lokusika ngesantya esichanekileyo, kugcina ukuthambisa okuzinzileyo kunye nokupholisa nangona inkqubo itshintshatshintsha. Ezi zibonelelo zinegalelo ngokuthe ngqo kumgangatho ophezulu we-wafer kwizicelo zokusika ucingo lwedayimani ezifuna amandla, apho ulawulo oluchanekileyo lunciphisa iziphene kwaye luphucule imveliso.
Zeziphi izinto ezichaphazela ukulinganiswa kwesantya sokuhamba kwamanzi kwizicelo zesarha yentsimbi yedayimani?
Ukulinganiswa kwesantya sokuhamba ngokuchanekileyo kuxhomekeke kwiinguqu ezahlukeneyo ezidibeneyo. Ukukhethwa kwesensor kubalulekile; umzekelo, iisensor zokuhamba kobunzima beCoriolis zibonelela ngedatha ethembekileyo nokuba zizinto ezixineneyo okanye ezigcwele amasuntswana. Ukwakheka kolwelo—njengokubakho kwamasuntswana amancinci—kunokutshintsha i-viscosity kunye noxinano kwaye kuchaphazele iimfuno zokulinganiswa kwesensor. Ububanzi bentambo kunye nesantya sokusika kukwachaphazela nokuba lungakanani ulwelo olufunekayo ukuze kuphole ngempumelelo kunye nokususwa kobumdaka. Ukulungiswa kwenkqubo nganye ethile kubalulekile ukuqinisekisa ukuba isensor ifunda amaxabiso okwenyani, ukuqinisekisa ukuba kusetyenziswa ubungakanani obufanelekileyo bolwelo lokusika kwibhetshi nganye.
Ngaba ii-nano-fluids kunye neendlela ze-ultrasonic zinokuphucula ukungena kolwelo ngexesha lokusika i-silicon wafer?
Uphando lubonisa ukuba ii-nano-fluids, ingakumbi ezo zine-SiO₂ kunye ne-SiC nanoparticles, zonyusa ukusebenza kakuhle kokuhanjiswa kolwelo kwi-interface ebalulekileyo ye-wire-wafer. Ezi nxalenye zinceda ulwelo lufikelele kwizithuba ezincinci, ziqinisekisa ukupholisa kunye nokuthambisa okungcono. Ukongeza, iindlela ze-ultrasonic capillary effect zonyusa ngakumbi ukuhamba kolwelo kunye nokungena kwalo, ingakumbi ekusikeni kwentambo okuncinci kakhulu. Oku kuthetha ukuba kufuneka ulwelo oluncinci lokusika ukuze kufezekiswe ukusebenza kakuhle, kwaye iziphumo ziquka ukunciphisa ukufunxwa kolwelo, ukuphuculwa kwendlela yokwenza umphezulu, kunye namazinga aphantsi okusilela. Ezi nkqubela zixhasa intshukumo eya kwii-wafers ezincinci, ezinkulu kumashishini e-semiconductor kunye ne-photovoltaic, kunye nezinzwa zokujonga ulwelo ezisikayo eziqinisekisa ukuba inkqubo ihlala ilawulwa kwaye ihambelana kuyo yonke imijikelo yemveliso.
Ixesha leposi: Disemba-25-2025
