Ubungakanani bokulinganisa i-viscosity echanekileyoukuzalisa ngaphantsi, i-die attachkunyeukugquma of semii-coni-duci-tori-packaging for optii-mali-precii-sion / And reityalaility.I-Underfill yenza i-compound esekelwe kwi-epoxy ehlala kwindawo ephakathi kwe-semiconductor die kunye ne-substrate yayo okanye ibhodi yesekethe eprintiweyo, iqinisa uqhagamshelo lwe-solder ngokuchasene ne-thermomechanical strains ezivela kwii-coefficients ezahlukeneyo zokwandiswa kobushushu. Uyilo lwe-flip chip lubeka icala elisebenzayo le-die ezantsi, luseka amakhonkco ombane ngqo ngokusebenzisa amaqhuma e-solder, okwenza kube lula ukuhlanganiswa okuxineneyo kwiindlela eziqhelekileyo zokubopha ucingo. I-Underfill iqinisa ukuthembeka ngokusasaza ngokulinganayo uxinzelelo oluvela kutshintsho lobushushu, ikhusela amalungu ekugugeni, kwiimpembelelo, ekushukumeni, nakwiingcoliseko ezifana nokufuma, ngaloo ndlela yandisa unyamezelo lokusebenza kumacandelo ahlukeneyo ukusuka kwizixhobo eziphathwayo ukuya kwiinkqubo zezithuthi.
Ukuqaqamba kwezincamathelisi
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Ukubaluleka kwe-Adhesive Viscosity kwi-Underfill, Die Attach, kunye ne-Encapsulation
Ubuchuleukunamathela okunamathelayoivela njengesicwangciso esisisiseko kwimigca yokuhlanganisana ye-semiconductor, ichaphazela ngokuthe ngqo ukufana kokuhamba, ukuphelela kokugubungela, kunye nokungabikho kweziphene kwiunderfill yokupakisha ye-semiconductor, i-die attach semiconductorkunyei-pcbukugquma. Eyona ifanelekileyoumlinganiselo we-glue viscosityIthintela iingxaki ezifana neepokotho zomoya, ukungangqinelani, okanye ukufunxwa okungaphelelanga okuphazamisa ukuqina koomatshini kunye nokuhanjiswa kobushushu. Ukusebenzisa izixhobo ezintsonkothileyo ezifanaImitha yokuqaqambisa iLonnmeter yeglu okanye izincamathelisiInika amandla abenzi bokwenza izinto ngoko nangoko, ivumela ukuguqulwa okuchanekileyo kwe-adhesive dynamics ukuba ihambelane neemfuno zokupakisha ezingqongqo, ekugqibeleni inyuse amazinga okuvelisa kunye nokuqina kwesixhobo.
Yintoni i-Underfill kwi-PCB?
Ukungena kwiyintoni engaphantsi kwe-pcbItyhila i-resinous epoxy okanye i-polymeric substance enikezelwa ukufihla umba ongaphantsi kwezinto ezifakelweyo, ingakumbi kumalungiselelo e-flip chip kwiibhodi zesekethe. Le nto ixhasa iibhondi ze-solder, ithomalalisa uxinzelelo lwe-mechanical, kwaye ikhusela kwiintlaselo ezikufutshane kuquka ukufuma okanye ukwahluka kobushushu. Ngokungena kwiindawo ezingenanto phakathi kwe-die kunye nesiseko, yongeza ukusasazeka kobushushu kunye nokuqina kwezakhiwo, nto leyo ebonakala iyimfuneko kwiindlela ezincinci nezisebenzayo kwi-circuitry yanamhlanje.
Inkqubo yokuzalisa i-Flip Chip Underfill
Ukuphumezainkqubo yokuzalisa i-chip phantsiibandakanya ukwabela i-epoxy elulwelo ye-viscosity ehlengahlengisiweyo ecaleni kwemida ye-inverted die emva kokunyibilikisa, isebenzise amandla e-capillary ukuze ingene kwiindawo ezincinci phakathi kwe-solder protuberances ngaphambi kokuba iqine ngonyango lobushushu. Ukulungiswa okufana nokufudumala kwe-substrate kukhawulezisa ukungena, kufuna ulawulo oluqinileyo lwe-viscosity ukuze kuthintelwe ukufakwa kwegesi kunye nokuqinisekisa iziphumo ezingenasiphako. Iindlela ezifana nokulungelelaniswa kokusasazwa kwe-linear okanye kwe-perimeter zivumelanisa ukuqhubela phambili kwe-adhesive kunye ne-enclosure contours, ukunciphisa ukungapheleli kunye nokwandisa ukunyamezela ngokuchasene nokufudumala okujikelezayo.
Inkqubo yokuncamathisela i-Die kwi-Semiconductor
Iinkqubo yokuncamathisela i-die kwi-semiconductorIquka ukuncamathisela idayisi engafakwanga kwisithwali okanye kwifreyimu esebenzisa iibhondi eziqhubayo okanye ezikhuselayo, ezifana nee-epoxies okanye ii-fusible alloys, ukuqinisekisa ukudluliselwa kobushushu kunye nombane okusebenzayo. Eli nqanaba lesiseko, elibalulekileyo ekuqhagamshelweni okanye ekufakweni kwesheya okulandelayo, liyalela ukufakwa kweglue ngokuchanekileyo ngokuphathwa kwerobhothi ukuphepha imingxunya kunye nokugcina ukuqina konxibelelwano. Ukujongwa kwe-viscosity kubaluleke kakhulu ekuthinteleni ukugqwetheka kunye nokuqinisekisa ukunamathela okufanayo, kuqinisa ukwenziwa kobuninzi ngaphandle kokuthembeka.
Inkqubo yokuQokelela kwiSemiconductor
Ngaphakathiinkqubo yokufakwa kwe-encapsulation kwi-semiconductor, ii-resin ezikhuselayo zigquma idayisi kunye neekhonkco, zakha umqobo nxamnye nokulimala komzimba, ukungena komswakama, kunye nokuwohloka kobushushu ngeendlela ezifana nokubumba okucinezelweyo, okwandiswa rhoqo kukuphuma ukuze kukhutshwe imingxuma. Ulawulo lwe-viscosity lubaluleke kakhulu ekufumaneni ukucutheka okuncinci, iifomyula eziphakamileyo zee-particles eziphucula ukuphuma kobushushu kwaye zigcine ukuqina kokuvalwa phantsi kweemeko ezimbi.
Iziphumo Zokungalawuleki Kokuxinana
Ukuphambuka kwi-viscosity kuthintela ukungaqheleki okukhulu, kuquka i-particle sedimentation evelisa i-strata engaqhelekanga, okwandisa ukungalingani kobushushu, ukwahlulwahlulwa kwe-interfacial, kunye nokudilika kwamalungu ngokukhawuleza. Amanqanaba angahambelaniyo akhuthaza imingxuma okanye ukufakwa okungafanelekanga, okukhuthaza ukuqhekeka phakathi kobushushu kunye nokunyuka kweendleko zokulungisa. Olu tshintsho lubangela ukwanda kokugoba kwe-enclosure, okonakalisa iibhondi kwaye lukhuthaza ukukhukuliseka okuvela kumswakama, okuthi abenzi bolu buchule banciphise ngokujonga ngenyameko ukuze kugcinwe ukusebenza okuhlala ixesha elide.
Iiteknoloji zokulinganisa ukuxinana
Uvavanyo lwe-viscosity lwangoku kwii-adhesives lusebenzisa iindlela ezahlukeneyo, ii-probes ezivakalayo ezilinganisa ukuchasana kolwelo ngaphandle kokuwa koomatshini, zibonelela ngemilinganiselo engaphazanyiswayo nechanekileyo kwindawo efunekayo. Ezi zixhobo ezikwi-line, ezahluka kwi-sampling engacwangciswanga ngeekomityi okanye izixhobo ezijikelezayo, zibonelela ngokuqonda kwangoko kwiimpawu ezingezizo ezaseNewtonian ezifana ne-shear dilution okanye ukuhamba kwexesha, okuyimfuneko kwii-adhesives kwimisebenzi ye-semiconductor. Ezi ntsha ziququzelela utshintsho oluguquguqukayo, oluhambelanayo ne-automation ukunciphisa ukungangqinelani kunye nokuqinisa ukuthembeka kwenkqubo.
Indima yeViscosity kwiFlow Dynamics
Ukuqina kuguqula kakhulu ubude bokufakwa kunye nokufana kwi-underfill, apho amanqanaba anyusiweyo avela kwi-inclusions afaka i-pnea ende kodwa aqinise iimpawu zoomatshini emva kokuqina. Kwi-die attachment kunye ne-encapsulation, ilawula amandla e-bond kunye nokusebenza kakuhle kokukhusela, kunye nokunciphisa okubangelwa bubushushu okufuna amaqhinga okuhlawula ukugcina ukusasazeka okufanelekileyo ngaphandle kokunqongophala okanye ukunqongophala, ngaloo ndlela kunciphisa umngcipheko onjengokungena kakhulu okanye ukuxinana.
Funda Ngakumbi ngeeMetha zoBuxinano
Iimitha zeNkqubo ezingakumbi kwi-Intanethi
Imitha yeLonnmeter Viscosity yeeGlues okanye iiAdhesives
Iimitha ye-viscosity yeglue, eboniswe yiLonnmeter, inika isixhobo esiqinileyo sokujonga uphawu lwe-adhesive oluhlala luhleli. Isebenzisa i-oscillatory sensing, ilinganisa ukumelana okuphakathi kwe-1 ukuya kwi-1,000,000 cP kunye nokuchaneka kwe-±2% ~ 5% kunye nempendulo ekhawulezayo, ifanelekile kwizicwangciso ezingqongqo kubandakanya uxinzelelo oluphezulu okanye iindawo ezinobungozi. Iiprobes zayo eziguquguqukayo kunye nokufakwa kwayo ngokulula kwiikhombisi okanye kwiinqanawa zenza kube ngumzekelo wokugcina ukufana kwe-adhesive kwiinkqubo zokwenza i-semiconductor ezenziwe ngoomatshini, kuquka ii-epoxies, ii-hotmelts, kunye neendidi zesitatshi.
Izicelo kwiinkqubo zokuncamathelisa
I-Lonnmeter ifikelela kumacandelo amaninzi afana ne-elektroniki kunye neemoto, ijongana neglue ekukhupheni, ekubekeni, okanye ekusebenzeni nge-bonding. Kwimimandla ye-semiconductor, ihlola ii-epoxies ngexesha lokuzalisa kunye nokufakwa kwe-capsulation, iqinisekisa ukuhlanganiswa okungenamthungo kwimibhobho okanye kwi-mixers ukuze kufunyanwe idatha engapheliyo, ehambelana nokuziphatha okungengokwaseNewtonian kunye ne-extreme thermal scopes ukuya kuthi ga kwi-350°C.
Iimpawu zobuchwepheshe
Yakhiwe ngezinto eziqinileyo ezingenazintsimbi ezingenazo izinto ezisebenza nge-kinetic, iLonnmeter imelana nokungcola ngelixa idibana ngeModbus ukuze i-orchestrate izenzekeleyo. I-vibration core yayo iyashukuma kwiifrequencies ezichaziweyo ukuze ibone utshintsho lwe-viscosity kunye noxinano, ivumela utshintsho olukhawulezileyo kwiifomyula ze-HMA okanye ii-epoxy blends, ikhuthaza ukuchaneka kwiindibano eziphezulu.
Iinzuzo
Ukufaka ubungakanani be-viscosity kwiindlela zokupakisha kuvelisa inkqubela phambili enkulu kwimveliso, ukuthembeka, kunye nobulumko bezemali. Ngokujongana nokuphazamiseka kwe-viscosity ngaphambi kokwenza nantoni na, abavelisi baphucula ukusasazwa kwe-adhesive, banciphise ukungafani, kwaye bandise isivuno sokuvelisa ngokupheleleyo, ngokunciphisa ukulahla kunye nokumiswa kokusebenza.
| Inzuzo | Inkcazo | Impembelelo kwiinkqubo |
| Ukubeka esweni ngexesha langempela | Ukulandelela rhoqo ukuphambuka kwe-viscosity | Ithintela imingxunya, iphucula ulawulo lokuhamba kwamanzi kwiindawo ezingaphantsi komhlaba |
| Udibaniso lwe-PLC/DCS | Ukujikeleziswa kwedatha ngoomatshini ukuze kuhambelane ngokuguquguqukayo | Inciphisa ukungena ngesandla, iphucula ubuchule bokusebenzisa izixhobo |
| Uqikelelo olugqibeleleyo lweziphene | Ukuxela kwangaphambili iinkxalabo ezifana nemingxunya ngokusebenzisa ukujongwa kweendlela | Inciphisa ukulungiswa, yongeza isivuno kwi-encapsulation |
| Ukuzenzekelayo okuKhawulezayo okuSebenzayo | Uhlengahlengiso lwe-algorithm ukuze kuphunyezwe kakuhle | Iqinisekisa ukuthembeka, ixhasa ukugcinwa okulindelweyo |
| Ukuhambelana koMgangatho | Iimpawu zebhetshi ezifanayo zokunamathela okuphezulu | Iphucula ukuthembeka kokupakisha kwe-semiconductor |
| Ukunciphisa iNkunkuma | Intsalela encitshisiweyo ngolawulo oluchanekileyo | Inciphisa iindleko kunye nempembelelo kwindalo kuzo zonke iinkqubo |
Umlinganiselo weViscosity weXesha langempela
Ukulinganiswa kwe-viscosity ngexesha langempelaIvumela ukuchongwa ngokukhawuleza kotshintsho lwepropathi, ivumela utshintsho olukhawulezileyo ukuze kulondolozwe ukuhamba okufanelekileyo kunye neempawu zokungenisa. Olu buchule lunciphisa iziphene ezifana nemingxuma okanye i-effervescences, luqinisekisa ukusasazwa okufanayo kwiindawo ezingaphantsi kwempahla kunye ne-encapsulation, lugqibe ekubeni impahla ifane kakuhle kwaye ichithe inkcitho kwiindawo ezinabileyo, okunokunciphisa ukulahlwa kwempahla ngekota kwiindawo ezicociweyo.
Ukuhlanganiswa kwiNkqubo ye-PLC/DCS
Akukho mzamoukuhlanganiswa kwenkqubo ye-PLC/DCSikhawulezisa ulawulo lwe-viscosity oluzenzekelayo ngokudlulisa imilinganiselo ngokusebenzisa ii-analog okanye ii-digital conduits ezifana neModbus. Olu nxibelelwano luvumelanisa ukusebenza kwe-adhesive kunye nezinto eziguquguqukayo zokwenza, oku kukhuthaza iimpendulo ezifike ngexesha ezandisa imveliso yokusebenza kwaye zinciphise ukuphazamiseka kwiindlela zokuzalisa, ukufakelwa kweentsimbi, kunye neendlela zokufaka ii-encapsulation.
Uhlengahlengiso lweParamitha, Uqikelelo olupheleleyo lweZiphene, kunye noLawulo oluHlakaniphileyo
Iingubo zokwalathisa ezikumgangatho ophezuluuhlengahlengiso lweparameter, uqikelelo lweziphene, kunye nolawulo olukrelekrelengokusebenzisa iindlela zedatha ukuze kuqikelelwe izinto ezixhalabisayo ezifana nokwakheka kwe-cavity okanye i-sedimentation. Izikhokelo zekhompyutha zihlalutya izinto ezifakwayo ngexesha elifanayo ukuze kuqaliswe ukulungiswa kwangaphambili, kuqinisekiswe ukuhlanganiswa okugqibeleleyo kunye nokukhawuleziswa kwemisebenzi ngokusebenzisa uomatshini be-cerebral, ngaxeshanye kuncitshiswa ukugqithiswa kwezinto nge-15-20% kwaye kukhuthazwa iindlela eziqondayo ngendalo.
Ukungaguquguquki koMgangatho kunye nokuNcitshiswa kweNkunkuma
Ukubeka esweni rhoqo kugcina ukufana kwebhetshi, kuphakamisa ukusebenza kakuhle kwe-adhesive kwiimpawu ezifana nokuqina kwe-adhesion kunye nokuqina kobushushu, okubalulekileyo ekuqineni kwe-semiconductor. Oku kunciphisa inkunkuma ngokunciphisa ukusetyenziswa kwe-extra, ukunciphisa ukusetyenziswa kwezinto kunye neempawu zendalo, ngelixa ukugcinwa kwangaphambili okuvela kwiindlela ezisetyenzisiweyo kufinyeza ukuyeka, kwandisa ukuguquguquka kunye nokunamathela kwimithetho.
Qhuba imizamo yakho yokupakisha i-semiconductor ngobuchule obuphezulu be-viscosity. Siqhagamshelane nawe ngoko nangoko ukuze ufumane isicelo sakho sekowuteshini ukuze ufake izisombululo ze-viscosity eziphambili zeLonnmeter kwi-intanethi yakho.ukuzalisa ngaphantsi okuchanekileyo okuzenzakalelayo, i-die attach, kunye neendlela zokufaka i-encapsulation, eziqinisekisa ukuqina kunye nobuchule obungenakuthelekiswa nanto.
