Kurongwa kwemakemikari emakemikari(CMP) inzira yekutanga mukugadzirwa kwema semiconductor epamusoro. Inoita kuti atomu ive yakati sandara pamusoro pema wafer surfaces, zvichiita kuti pave nema multilayer architectures, tight device packing, uye goho rakavimbika. CMP inobatanidza makemikari nemabasa emakanika panguva imwe chete—ichishandisa rotation pad uye specialized polishing slurry—kubvisa mafirimu akawandisa uye kusarongeka kwepamusoro, zvakakosha pakugadzirisa maficha uye kugadzirisa ma integrated circuits.
Hunhu hwewafer mushure meCMP hunoenderana zvakanyanya nekudzora kwakanyatsonaka kwekugadzirwa kweslurry inopolisha uye hunhu hwayo. Slurry iyi ine zvidimbu zvinokwesha, zvakaita secerium oxide (CeO₂), zvakasungirirwa musanganiswa wemakemikari akagadzirirwa kugadzirisa kukweshana kwemuviri uye makemikari. Semuenzaniso, cerium oxide inopa kuomarara kwakanyanya uye makemikari epamusoro emafirimu akavakirwa pasilicon, zvichiita kuti ive chinhu chinosarudzwa mumashandisirwo mazhinji eCMP. Kushanda kweCMP hakungotevedzerwi chete nehunhu hwezvimedu zvinokwesha asiwo nekutarisira kwakaringana kweslurry concentration, pH, uye density.
Kuronga Kwemakemikari Emakemikari
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Nheyo dzeKupukuta Maslurries muKugadzira Semiconductor
Mapolish slurry ndiwo musimboti wemaitiro ekugadzira marongerwo emakemikoro. Iwo musanganiswa wakaoma wakagadzirwa kuti uwane kukweshana kwemakemikoro uye kugadzirisa pamusoro pemarongerwo emakemikoro. Mabasa akakosha eCMP slurry anosanganisira kubvisa zvinhu zvinobudirira, kudzora marongerwo emakemikoro, kufanana panzvimbo dzakakura dzemarongerwo emakemikoro, uye kuderedza zvikanganiso.
Mabasa uye Kuumbwa kweSlurries dzeKupukuta
Musanganiswa weCMP une zvinhu zvinorema zvakasungirirwa mu liquid matrix, zvichiwedzerwa nemakemikari anowedzera uye zvinosimbisa. Chikamu chimwe nechimwe chine basa rakasiyana:
- Zvinogumbura:Zvidimbu izvi zvitete, zvakasimba—kunyanya silica (SiO₂) kana cerium oxide (CeO₂) mukushandiswa kwe semiconductor—zvinoita chikamu chemuchina chekubvisa zvinhu. Kuwanda kwazvo uye kugoverwa kwezvidimbu kunodzora mwero wekubvisa uye kunaka kwenzvimbo. Huremu hwezvidimbu hunowanzova pakati pe1% kusvika 5% nehuremu, nedhayamita yezvidimbu iri pakati pe20 nm ne300 nm, yakanyatsotsanangurwa kudzivirira kukwenya kwakanyanya kwewafer.
- Zvinowedzerwa zveMakemikari:Mishonga iyi inoumba nharaunda yemakemikari kuti ibudirire pakuronga. MaOxidizer (semuenzaniso, hydrogen peroxide) anobatsira pakuumbwa kwezvikamu zviri nyore kubvisa. Mishonga inosanganisa kana kuti inochekerera (yakadai seammonium persulfate kana citric acid) inosunga maion esimbi, ichivandudza kubviswa uye ichidzvinyirira kuumbwa kwezvikanganiso. Mishonga inodzivisa kuchekwa kusingadiwe kwezvikamu zvewafer zviri pedyo kana pasi, zvichivandudza kusarudza.
- Zvinosimbisa muviri:Ma-surfactant nema-pH buffers anochengetedza kugadzikana kwetsvina uye kupararira kwakafanana. Ma-surfactant anodzivirira abrasive agglomeration, zvichiita kuti kubviswa kwakafanana kubviswe. Ma-pH buffers anogonesa makemikari kuita zvinoenderana uye anoderedza mukana wekuti zvidimbu zviungane kana kuti zvikanganiswe.
Kuumbwa uye huwandu hwechinhu chimwe nechimwe zvinogadzirwa zvichienderana nechinhu chakagadzirwa newafer, chimiro chemudziyo, uye danho rekuita rinosanganisirwa mukuita kwekugadzira makemikari.
Madota Akajairika: Silica (SiO₂) vs Cerium Oxide (CeO₂)
Silica (SiO₂) slurry yekupukutaZvinonyanya kuumba matanho ekugadzira oxide planarization, akadai se interlayer dielectric (ILD) uye shallow trench isolation (STI) polishing. Zvinoshandisa colloidal kana fumed silica se abrasives, kazhinji munzvimbo ine (pH ~10), uye dzimwe nguva zvinowedzerwa nemasurfactants madiki uye corrosion inhibitors kuderedza zvikanganiso zvekukwenya uye kuwedzera mwero wekubvisa. Silica particles dzinokosheswa nekuda kwehukuru hwadzo hwakafanana uye kuomarara kwakaderera, zvichipa kubviswa kwakanyatsonaka, kwakafanana kwakakodzera kune zvidimbu zvakapfava.
Madonhwe ekupukuta eCerium oxide (CeO₂)Zvinosarudzwa pakushandisa kwakaoma kunoda kusarudzwa kwakanyanya uye kunyatsojeka, zvakaita sekupukuta kwekupedzisira kwegirazi, kugadzira zvinhu zvakagadziriswa, uye mamwe ma oxide layers mumidziyo ye semiconductor. CeO₂ abrasives inoratidza reactivity yakasiyana, kunyanya ne silicon dioxide surfaces, zvichiita kuti nzira dzekubvisa makemikari nedzemuchina dzibviswe. Maitiro aya ekuita zvinhu zviviri anopa mwero wepamusoro wekugadzira zvinhu zvakagadziriswa pamazinga akaderera ekukuvara, zvichiita kuti CeO₂ slurries ive yakanaka kune magirazi, ma hard disk substrates, kana ma advanced logic device nodes.
Chinangwa Chekushanda KwemaAbrasives, Additives, uye Stabilizers
- Mabhurasiti: Shandisa michina yekukwesha. Saizi yavo, chimiro, uye huwandu hwayo zvinosarudza mwero wekubvisa uye kupera kwenzvimbo. Semuenzaniso, machira esilika e50 nm akafanana anoita kuti zvidimbu zveoxide zvinyatsogadzirwa zvakanaka uye zvakaenzana.
- Zvinowedzerwa zveMakemikari: Bvumira kubviswa kwechinhu chimwe chete nekubatsira kuoxidation uye kunyungudika kwepanyika. MuCMP yemhangura, glycine (sechinhu chinosanganisa) uye hydrogen peroxide (sechinhu chinooxidizer) zvinoshanda pamwe chete, nepo BTA inoshanda semudziviriri anodzivirira zvinhu zvemhangura.
- Zvinosimbisa: Chengeta slurry structure yakafanana nekufamba kwenguva. Zvinoita kuti slurry isanyanya kusanganiswa netsvina, zvichiita kuti zvidimbu zvinoputika zvirambe zvichipararira uye zviripo panguva yekushanda kwayo.
Hunhu Hwakasarudzika uye Maitiro Ekushandisa: CeO₂ uye SiO₂ Slurries
CeO₂ slurry yekupukutainopa mukana wekusarudza pakati pegirazi nesilicon oxide nekuda kwekushanda kwayo nemakemikoro. Inonyanya kushanda pakuronga ma substrate akaoma, anopfava kana kuti macomposite oxide stacks uko kusarudza kwakawanda kwezvinhu kwakakosha. Izvi zvinoita kuti CeO₂ slurries ive yakajairika mukugadzirira substrate yepamusoro, kupedzisa magirazi akajeka, uye matanho eCMP e shallow trench isolation (STI) muindasitiri ye semiconductor.
SiO₂ slurry yekupukutainopa musanganiswa wakaenzana wekubvisa michina nemakemikari. Inoshandiswa zvakanyanya pakugadzira oxide yakawanda uye dielectric planarization, uko kupinza kwakanyanya uye kusakwana kushoma zvinodiwa. Saizi ye silica yakafanana, inodzorwa, inoderedzawo kugadzirwa kwemavanga uye inoita kuti pamusoro payo pave nemhando yepamusoro.
Kukosha kwehukuru hwezvikamu uye kufanana kwekupararira
Saizi yezvikamu uye kufanana kwekupararira kwacho zvakakosha pakushanda zvakanaka kwetsvina. Zvikamu zvakafanana, zvinokwenya saizi ye nanometer zvinovimbisa mwero wekubvisa zvinhu nguva dzose uye pamusoro pewafer pasina chikanganiso. Kuungana kunotungamira mukukwenya kana kukwenya kusingatarisirwi, nepo kugoverwa kwakafara kuchikonzera kusarongeka kwakafanana uye kuwanda kwezvikanganiso.
Kudzora kuzara kwetsvina kunoshanda—kunotariswa nehunyanzvi hwakadai semuchina wekuyeresa kuzara kwetsvina kana michina yekuyera kuzara kwetsvina ye ultrasonic—kunoita kuti zvinhu zvirambe zvichifamba zvakanaka uye kuti zvinhu zvifambe zvakanaka, zvichikanganisa zvakananga goho uye mashandiro emudziyo. Kuwana kudzora kuzara kwakaringana uye kupararira kwakafanana ndizvo zvinodiwa zvikuru pakuiswa kwemidziyo yemakemikari uye kugadzirisa mashandiro emuchina.
Muchidimbu, kugadzirwa kwe polishing slurry—kunyanya kusarudzwa nekudzora mhando ye abrasive, saizi ye particles, uye nzira dze stabilization—kunotsigira kuvimbika uye kushanda zvakanaka kwe chemical mechanical planarization process mukushandiswa kwe semiconductor industry.
Kukosha kweKuyerwa kweKuwanda kweSlurry muCMP
Mukuita kwemakemikari ekuronga, kuyera kwakarurama uye kudzora huwandu hweslurry zvinokanganisa zvakananga kushanda zvakanaka uye kunaka kwekupukuta kwewafer. Slurry density—huwandu hwezvimedu zvinogumbura mukati meslurry yekupukuta—inoshanda sechikamu chepakati chemaitiro, ichiumba mwero wekupukuta, mhando yekupedzisira yenzvimbo, uye goho rese rewafer.
Hukama huripo pakati peSlurry Density, Polishing Rate, Surface Quality, uye Wafer Yield
Kuwanda kwezvimedu zvinoputika mukati meCeO₂ polishing slurry kana imwe nzira yekupukuta slurry inosarudza kuti zvinhu zvinobviswa nekukurumidza sei kubva pamusoro pewafer, inowanzonzi removal rate kana material removal rate (MRR). Kuwedzera kweslurry density kunowanzo wedzera huwandu hweabrasive contacts pa unit area, zvichikurumidzisa polishing rate. Semuenzaniso, ongororo yakaitwa muna 2024 yakashuma kuti kuwedzera silica particle concentration kusvika 5 wt% mu colloidal slurry kwakakwidziridza removal rates ye200 mm silicon wafers. Zvisinei, hukama uhwu hausi hwe linear - pane poindi yekudzikira kwekudzoka. Pa slurry densities yakakwira, particle agglomeration inokonzera plateau kana kutodzikira kweremoval rate nekuda kwekusafambiswa zvakanaka kwehuwandu uye kuwedzera viscosity.
Hunhu hwepamusoro hunoenderanawo nekuwanda kwetsvina. Kana paine huwandu hwakakwira, zvikanganiso zvakaita sekukwenya, marara akaiswa mukati, uye makomba zvinova zvakajairika. Chidzidzo chimwe chete ichi chakaona kuwedzera kwakanangana kwekukwenya kwepamusoro uye kuwanda kwekukwenya kwakanyanya kana huwandu hwetsvina huchiwedzera pamusoro pe8–10 wt%. Kusiyana neizvi, kudzikisa kuwanda kunoderedza njodzi yekukuvadzwa asi kunogona kunonoka kubviswa uye kukanganisa planarity.
Kugohodzwa kwewafer, huwandu hwewafers hunosangana nemaitiro ekugadzirisa mushure mekuporishwa, hunodzorwa nemhedzisiro iyi yakabatana. Mwero wepamusoro wezvikanganiso uye kubviswa kusina kufanana zvese zvinoderedza goho, zvichisimbisa kuenzana kwakanaka pakati pekushandiswa uye mhando mukugadzirwa kwema semiconductor emazuva ano.
Mhedzisiro yeKusiyana Kwekuwanda Kwetsvina Mukati Medu paCMP Process
Kunyangwe kutsauka kudiki kubva pakuwanda kwetsvina—zvikamu zvepamusero—kunogona kukanganisa zvakanyanya kubuda kwechinhu. Kana huwandu hwetsvina hukadonha pamusoro pechinangwa, kuungana kwezvikamu kunogona kuitika, zvichikonzera kupera nekukurumidza pamapedhi nemadhisiki ekudzikamisa, mwero wepamusoro wekukwenya, uye mukana wekuvharika kana kuparara kwezvikamu zvemvura mumidziyo yemakemikari. Kuwanda kwehuwandu kunogona kusiya mafirimu akasara uye nzvimbo dzisina kurongeka dzepamusoro, izvo zvinoedza matanho anotevera ephotolithography uye zvinoderedza goho.
Kusiyana kwehuwandu hweslurry kunokanganisawo maitiro emakemikari nemechanical pawafer, zvichikonzera kusashanda zvakanaka kwechinhu chacho. Semuenzaniso, zvidimbu zvidiki kana zvisina kupararira zvakafanana mumaslurry akasanganiswa zvinokanganisa mwero wekubvisa kwenzvimbo, zvichigadzira microtopography inogona kupararira sezvikanganiso mukugadzirwa kwehuwandu hwakawanda. Izvi zvidiki zvinoda kudzora kwakasimba kweslurry concentration uye kutarisa kwakasimba, kunyanya muma nodes epamusoro.
Kuyerwa uye Kugadziriswa kweKuwanda kweSlurry Munguva Yechokwadi
Kuyerwa kwehuwandu hweslurry panguva chaiyo, kunogoneswa nekushandiswa kwemamita e inline density—akadai semamita e ultrasonic slurry density akagadzirwa neLonnmeter—ikozvino ndiyo yakajairika mumashandisirwo epamusoro-soro e semiconductor industry. Zvishandiso izvi zvinobvumira kutarisa nguva dzose ma parameter eslurry, zvichipa mhinduro pakarepo pakuchinja-chinja kwehuwandu sezvo slurry ichifamba kuburikidza nema CMP toolsets nema distribution systems.
Mabhenefiti akakosha ekuyera huwandu hweslurry panguva chaiyo anosanganisira:
- Kuonekwa nekukurumidza kwemamiriro ezvinhu asina kutsanangurwa, kudzivirira kupararira kwezvikanganiso kuburikidza nemaitiro anodhura ekutevera
- Kugadzirisa maitiro—kunobvumira mainjiniya kuchengetedza hwindo rehuwandu hwetsvina, zvichiwedzera mwero wekubvisa uku zvichideredza zvikanganiso
- Kuvandudzwa kwewafer-to-wafer uye kuenderana kwehuwandu, zvichireva kuti kugadzirwa kwese kwacho kwakakwira.
- Hutano hwemidziyo kwenguva refu, sezvo matope akawandisa kana asina kuzara zvakakwana anogona kukurumidzisa kupera kwemapolishi, mamixers, uye mapombi ekuparadzira.
Kuiswa kwemidziyo yeCMP kunowanzo fambisa zvishwe zvemuenzaniso kana mitsara yekudzokorora mafambiro emvura kuburikidza nenzvimbo yekuyera, zvichiita kuti kuverenga kwehuwandu hwemvura kunomiririra kuyerera chaiko kunoendeswa kumawafers.
Yakarurama uye chaiyo-nguvakuyerwa kwehuwandu hweslurryInoumba musimboti wenzira dzakasimba dzekudzora huwandu hweslurry, ichitsigira nzira dzakagadzirwa uye itsva dzekupukuta slurry, kusanganisira slurry dzinonetsa dzeCerium oxide (CeO₂) dze advanced interlayer ne oxide CMP. Kuchengetedza parameter iyi yakakosha kunobatanidza zvakananga nekubudirira, kudzora mitengo, uye kuvimbika kwemidziyo mukati memaitiro ese ekugadzira makemikari.
Nheyo neTekinoroji dzeKuyera Kuwanda kweSlurry
Kuwanda kweslurry kunotsanangura huwandu hwezvinhu zvakasimba payuniti imwe neimwe mu slurry inopolisha, senge Cerium oxide (CeO₂) formulations inoshandiswa mu chemical mechanical planarization (CMP). Iyi variable inosarudza mwero wekubvisa zvinhu, kufanana kwezvinobuda, uye mazinga ezvikanganiso pawafers dzakapolished. Kuyerwa kweslurry density kunoshanda kwakakosha pakudzora slurry concentration yepamusoro, zvichikanganisa zvakananga goho uye zvikanganiso mukushandiswa kwe semiconductor industry.
Mita dzakasiyana-siyana dze slurry density dzinoshandiswa mumabasa eCMP, imwe neimwe ichishandisa misimboti yakasiyana yekuyera. Nzira dzegravimetric dzinotsamira pakuunganidza nekuyera vhoriyamu yakatsanangurwa ye slurry, zvichipa kururama kwakanyanya asi zvisina kugona kwenguva chaiyo uye zvichiita kuti dzisashande nguva dzose mukuisa michina yeCMP. Mita dze electromagnetic density dzinoshandisa minda ye electromagnetic kuti dziverenge density zvichibva pakuchinja kwe conductivity uye permittivity nekuda kwe suspended abrasive particles. Vibrational metres, dzakadai se vibrating tube densitometers, dzinoyera frequency response ye tube yakazadzwa ne slurry; kusiyana kwe density kunokanganisa vibration frequency, zvichiita kuti kurambe kuchiongororwa. Aya matekinoroji anotsigira inline monitoring asi anogona kunzwa fouling kana chemical variations.
Mita dze ultrasonic slurry density dzinomiririra kufambira mberi kukuru kwetekinoroji pakuongorora huwandu hwezvinhu panguva chaiyo mukuronga kwemakemikari nemechanical. Zvishandiso izvi zvinoburitsa mafungu e ultrasonic kuburikidza neslurry uye zvinoyera nguva yekubhururuka kana kumhanya kwekupararira kweruzha. Kumhanya kweruzha muchinhu kunoenderana nehuwandu hwaro uye kuwanda kwezvinhu zvakasimba, zvichibvumira kunyatsoona hunhu hweslurry. Muchina we ultrasonic wakakodzera zvikuru munzvimbo dzinopisa uye dzine makemikari anowanzo shandiswa neCMP, sezvo usingapindi uye unoderedza kusvibiswa kwe sensor kana tichienzanisa nemamita ekubata zvakananga. Lonnmeter inogadzira inline ultrasonic slurry density metres yakagadzirirwa mitsetse yeCMP ye semiconductor industry.
Mabhenefiti e ultrasonic slurry density metres anosanganisira:
- Kuyera kusingapindiri: MaSensor anowanzoiswa kunze kana mukati memasero ekuyerera kwemhepo, zvichideredza kukanganiswa kwetsvina uye kudzivirira kukweshana kwenzvimbo dzinonzwa.
- Kugona kushanda panguva chaiyo: Kubuda nguva dzose kunogonesa kugadzirisa maitiro nekukasika, zvichiita kuti huwandu hwetsvina hugare mukati mezviyero zvakatsanangurwa kuti huve hwakanaka pakupukuta wafer.
- Kunyatsorongeka uye kusimba: Ma Ultrasonic scanners anopa kuverenga kwakasimba uye kunodzokororwa, asingakanganiswi nekuchinja-chinja kwemakemikari e slurry kana kuti tumarara twudiki panguva yekuisa kwenguva refu.
- Kubatanidzwa nemidziyo yeCMP: Dhizaini yavo inotsigira kuiswa kwekuisa mumitsara inotenderera inotenderera kana manifold ekutumira, zvichiita kuti maitiro ekugadzirisa awedzere nyore pasina nguva yakareba yekuzorora.
Zvidzidzo zvechangobva kuitwa mukugadzira semiconductor zvinoratidza kudzikira kwekusakwana kwe30% kana kuongorora kwe ultrasonic density kwakanyatsoenderana nekuisa michina ye chemical mechanical planarization yeCerium oxide (CeO₂) polishing slurry processes. Mhinduro dzinobva ku ultrasonic sensors dzinobvumira kudzora kwakasimba pamusoro pe polishing slurry formulations, zvichikonzera kuvandudzika kwekukora uye kuderera kwemarara ezvinhu. Ultrasonic density mita, kana ikabatanidzwa nemaitiro e calibration akasimba, inochengetedza mashandiro akavimbika pasinei ne slurry composition shifts, izvo zvinowanzoitwa mumabasa epamusoro eCMP.
Muchidimbu, kuyerwa kwehuwandu hwema "slurry density" panguva chaiyo—kunyanya kushandisa tekinoroji ye ultrasonic—kwave chinhu chikuru munzira chaiyo dzekudzora huwandu hwema "slurry density" muCMP. Kufambira mberi uku kunovandudza goho, kushanda zvakanaka kwemaitiro, uye mhando ye "wafer" muindasitiri ye semiconductor.
Kuiswa uye Kubatanidzwa muCMP Systems
Kuyera huwandu hweslurry hwakakodzera kwakakosha pakudzora huwandu hweslurry mukuita kwemakemikari ekuronga. Kusarudza nzvimbo dzinoshanda dzekuisa slurry density metres zvakananga kunokanganisa kururama, kugadzikana kwemaitiro, uye kunaka kwewafer.
Zvinhu Zvakakosha Pakusarudza Nzvimbo Dzekuisa
Mukugadzirisa CMP, mita dze density dzinofanirwa kuiswa kuti dzitarise slurry chaiyo inoshandiswa pakupukuta wafer. Nzvimbo huru dzekuisa dzinosanganisira:
- Tangi reKudzokorodza Kutenderera Kwemhepo:Kuisa mita panzvimbo yekubuditsa mvura kunoita kuti pave neruzivo rwemamiriro ezvinhu emvura iri pasi pemvura isati yapararira. Zvisinei, nzvimbo iyi inogona kusachinja zvinhu zvichiitika mberi, zvakaita sekuumbwa kwemabubbles kana kuti kupisa kwenzvimbo.
- Mitsetse Yekutumira:Kuisa mayuniti mushure mekusanganisa uye usati wapinda mu distribution manifolds kunoita kuti chiyero che density chiratidze fomura yekupedzisira ye slurry, kusanganisira Cerium oxide (CeO₂) polishing slurry nezvimwe zvinowedzera. Nzvimbo iyi inobvumira kuona nekukurumidza kuchinja kwe slurry concentration nguva pfupi ma wafers asati agadziriswa.
- Kutarisa Pakushandisa:Nzvimbo yakanakisisa iri kumusoro kwevharuvhu kana chishandiso chekushandisa. Izvi zvinobata huwandu hwetsvina panguva chaiyo uye zvinozivisa vanoishandisa nezvekutsauka mumamiriro ezvinhu ekushanda kunogona kuitika kubva pakupisa kwetambo, kupatsanurwa, kana kugadzirwa kwemabubbles madiki.
Pakusarudza nzvimbo dzekuisa, zvimwe zvinhu zvakaita sehurongwa hwekuyerera kwemvura, kurongeka kwepombi, uye kuva pedyo nemapombi kana mavharuvhu zvinofanirwa kutariswa:
- Favorkugadzika kwakamiranekuyerera kunokwira kuderedza kuungana kwemapundu emhepo uye madhaka pachinhu chinonzwa.
- Chengetedza dhayamita dzakasiyana-siyana dzemapaipi pakati pemita nenzvimbo huru dzinokonzera nyonganyonga (mapombi, mavharuvhu) kudzivirira zvikanganiso zvekuverenga nekuda kwekukanganiswa kwekuyerera kwemvura.
- Shandisakugadzirisa kuyerera kwemvura(zvinotwasanudza kana zvikamu zvinodzikamisa) zvekuongorora kuyerwa kwehuwandu munzvimbo yakadzikama.
Matambudziko Akajairika uye Maitiro Akanakisisa Ekubatanidza Masensa Akavimbika
Masisitimu eCMP slurry anokonzera matambudziko akati wandei ekubatanidza:
- Kupinda Mumhepo uye Mabhurumu:Ma ultrasound slurry density meter anogona kukanganisa kuverenga density kana paine ma microbubbles. Dzivisa kuisa masensa pedyo nenzvimbo dzinopinda mhepo kana kuchinja kwemvura kamwe kamwe, izvo zvinowanzoitika pedyo nemapombi anobuda kana matangi ekusanganisa.
- Kucherwa kwevhu:Mumitsetse yakatwasuka, masensa anogona kusangana nezvinhu zvakasimba zvinogadzika, kunyanya neCeO₂ polishing slurry. Kuisa vertical mounting kana kuisa pamusoro penzvimbo dzinogona kugadzika zvinokurudzirwa kuchengetedza kudzora kwakarurama kweslurry density.
- Kusvibisa Sensor:Matombo eCMP ane zvinhu zvinogumbura uye makemikari zvinogona kukonzera kusvibiswa kana kuputirwa kwesensa. Zvishandiso zveLonnmeter zvakagadzirirwa kuderedza izvi, asi kuongororwa nguva dzose nekucheneswa kunoramba kuri kwakakosha kuti zvive zvakavimbika.
- Kudengenyeka kweMichina:Kuiswa pedyo nemidziyo inoshanda kunogona kukonzera ruzha mukati mesensa, zvichideredza kunyatsojeka kwekuyera. Sarudza nzvimbo dzekuisa dzisina kukanganiswa zvakanyanya.
Kuti uwane mhedzisiro yakanaka yekubatanidza:
- Shandisa zvikamu zve laminar flow pakuisa.
- Iva nechokwadi chekuti mativi akamira zvakanaka pese pazvinogoneka.
- Ita kuti zvive nyore kuwana nguva nenguva pakugadzirisa nekugadzirisa zvinhu.
- Bvisa masensa kubva pakukanganiswa kwekudengenyeka uye kuyerera kwemvura.
CMP
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Maitiro Ekudzora Kuwanda Kwemvura Yakasviba
Kudzora kuzara kwetsvina mukugadzirwa kwemakemikari kwakakosha kuchengetedza mwero wekubvisa zvinhu nguva dzose, kuderedza zvikanganiso pamusoro pewafer, uye kuona kuti wafers dze semiconductor dzinoshanda zvakafanana. Nzira dzakasiyana siyana uye matekinoroji anoshandiswa kuita izvi nemazvo, zvichitsigira mashandiro akareruka uye kugona kwemidziyo yakawanda.
Matekiniki uye Zvishandiso zvekuchengetedza Kuwanda Kwakanaka kweSlurry
Kudzora kuwanda kwetsvina kunotanga nekutarisa panguva chaiyo kwezvikamu zvinogumbura uye mhando dzemakemikari mutsvina inopukutika. Kune slurry inopukutika yeCerium oxide (CeO₂) nedzimwe nzira dzeCMP, nzira dzakananga dzakadai sekuyera inline slurry density dzakakosha. Ultrasonic slurry density mita, dzakadai sedzakagadzirwa neLonnmeter, dzinopa zviyero zvinoenderera mberi zveslurry density, izvo zvinoenderana zvakanyanya nehuwandu hwakasimba uye kufanana.
Matekiniki ekuwedzera anosanganisira kuongorora turbidity—apo masensa ekuona kupararira kubva muzvikamu zvinonyungudika zvinonyungudika—uye nzira dzespectroscopic dzakadai seUV-Vis kana Near-Infrared (NIR) spectroscopy kuti dziverenge ma key reactants mu slurry stream. Kuyera uku kunoumba musimboti weCMP process control systems, zvichiita kuti zvigadziriswe zviripo kuti pave ne target concentration windows uye kuderedza kusiyana kwe batch-to-batch.
MaSensor emagetsi anoshandiswa mumafomula ane maion esimbi akawanda, achipa ruzivo rwekukurumidza pamusoro pehuwandu hweionic hwakati uye achitsigira kugadziriswa kwakawanda mumashandisirwo epamusoro eindasitiri ye semiconductor.
Maitiro Ekugadzirisa Mhinduro uye Otomatiki Yekudzora Kuvhara-Kutenderera
Kuisa michina yemazuva ano yemakemikari nemechanical planarization kuri kuwedzera kushandisa masisitimu ekudzora akabatana ne inline metrology ne automated dispensing systems. Data kubva kuma slurry density meters nema sensors anoenderana anopihwa zvakananga kune programmable logic controllers (PLCs) kana distributed control systems (DCS). Masisitimu aya anoisa otomatiki mavharuvhu ekuwedzera mvura ye make-up, concentrated slurry dosing, uye kunyange stabilizer injection, zvichiita kuti maitiro acho arambe ari mukati menguva dzose.
Magadzirirwo aya emhinduro anobvumira kugadziriswa nguva dzose kwechero kutsauka kwakaonekwa nemasensa enguva chaiyo, kudzivirira kuwanda kwemvura, kuchengetedza huwandu hwakanyanya hweabrasive, uye kuderedza kushandiswa kwemakemikari akawandisa. Semuenzaniso, muchishandiso cheCMP che high-throughput che advanced wafer nodes, inline ultrasonic slurry density meter ichaona kudonha kwehuwandu hweabrasive uye pakarepo inoratidza system yedosing kuti iwedzere kuiswa kweslurry, kusvika huwandu hwadzo hwadzokera panzvimbo yahwo. Kusiyana neizvi, kana huwandu hwakayerwa hukadarika zvakatsanangurwa, control logic inotanga kuwedzera mvura ye make-up kuti idzorere huwandu hwakakodzera.
Basa reKuyera Huremu muKugadzirisa Kuwanda kweMakeup Water neSlurry
Kuyera huwandu hwemvura inoyerera ndiyo nzira huru yekudzora huwandu hwemvura. Kuwanda kwemvura inoyerera kubva mumidziyo yakaita seLonnmeter's inline density metres kunoratidza zvakananga zvinhu zviviri zvakakosha pakushanda: huwandu hwemvura inoyerera uye huwandu hwemvura inoyerera kubva mumvura inoyerera.
Nekutsvaga ma density metres panzvimbo dzakakosha—sekunge usati waisa CMP tool input kana mushure mekusanganisa point-of-use—real-time data inogonesa otomatiki systems kugadzirisa make-up water addition rate, nokudaro ichideredza slurry kusvika pazvinodiwa. Panguva imwe chete, system inogona kugadzirisa feed rate ye concentrated slurry kuti irambe iine abrasive uye chemical concentrations nemazvo, zvichitarisa mashandisirwo emidziyo, kukwegura, uye kurasikirwa kunokonzerwa neprocess.
Semuenzaniso, panguva yekurongwa kwenguva refu kwe3D NAND structures, continuous density monitoring inoona slurry aggregation kana settlement trends, zvichikonzera kuwedzera otomatiki kwemvura ye makeup kana agitation, sezvinodiwa kuti process igare yakasimba. Iyi control loop inodzorwa zvakanyanya ndiyo hwaro hwekuchengetedza wafer-to-wafer uye mukati mewafer zvakafanana zvinangwa, kunyanya sezvo saizi yemudziyo nemahwindo eprocess akamanikana.
Muchidimbu, nzira dzekudzora huwandu hweslurry muCMP dzinovimba nemusanganiswa wezviyero zvepamusoro-soro uye mhinduro dze automated closed-loop. Mamita eslurry density, kunyanya mayuniti e ultrasonic senge anobva kuLonnmeter, anoita basa guru mukupa data repamusoro-soro, panguva yakakodzera rinodiwa kuti maitiro agadziriswe zvakasimba mumatanho akakosha ekugadzira semiconductor. Zvishandiso izvi nenzira dzinoderedza kusiyana, zvinotsigira kugara kwenguva refu nekugadzirisa kushandiswa kwemakemikari, uye zvinogonesa kunyatsojeka kunodiwa kune matekinoroji emazuva ano e node.
Gwaro Rekusarudza Meter Yekuyera Density yeIndasitiri yeSemiconductor
Kusarudza slurry density meter ye chemical mechanical planarization (CMP) muindasitiri ye semiconductor kunoda kunyatsotarisirwa kune zvakasiyana-siyana zvehunyanzvi. Zvinodiwa zvikuru pakushanda uye mashandisirwo azvo zvinosanganisira kunzwisisa, kururama, kuenderana ne aggressive slurry chemistry, uye nyore kubatanidzwa mukati meCMP slurry delivery systems uye kuiswa kwemidziyo.
Zvinodiwa zveKunzwisisa uye Kururama
Kudzora maitiro eCMP kunoenderana nekuchinja kudiki mukugadzirwa kweslurry. Density meter inofanira kuona shanduko diki dze0.001 g/cm³ kana kupfuura. Iyi level yekunzwisisa kwakakosha pakuona kunyange shanduko diki mu abrasive content—senge dziri muCeO₂ polishing slurry kana silica-based slurry—nekuti izvi zvinokanganisa mwero wekubvisa zvinhu, wafer planarity, uye defectivity. Range ye accuracy inogamuchirwa ye semiconductor slurry density metres i±0.001–0.002 g/cm³.
Kuenderana neAggressive Slurries
Madota anoshandiswa muCMP anogona kunge aine ma nanoparticles abrasive akadai secerium oxide (CeO₂), alumina, kana silica, akasungirirwa mumakemikari anoshanda. Density meter inofanira kutsungirira nguva refu yekukuvadzwa mumuviri uye nharaunda dzinoparadza pasina kubuda mu calibration kana kusvibiswa. Zvinhu zvinoshandiswa muzvikamu zvakanyorova zvinofanira kunge zvisina simba kune ese ma slurry chemistry anowanzoshandiswa.
Nyore yekubatanidza
Miyero yekudzikisa huremu hwemuchina weCMP inofanira kukodzera zviri nyore mumidziyo yeCMP iripo.
- Kuderedza vhoriyamu yemvura uye kuderera kwesimba remhepo kuti isakanganise kutakura kwemvura.
- Rutsigiro rwekubatanidza maitiro emaindasitiri kuti zviiswe nekukurumidza uye zvigadziriswe.
- Kuenderana kwezvinobuda (semuenzaniso, zviratidzo zveanalog/digital) zvekubatanidza panguva chaiyo nemasisitimu ekudzora slurry concentration, asi pasina kupa masisitimu iwayo pachawo.
Kuenzanisa Zvinhu zveLeading Sensor Technologies
Kudzora huwandu hwema "polishing slurry" kunonyanya kuitwa kuburikidza nema "sensor classes" maviri: "densitometry-based" uye "refractometry-based" metres. Imwe neimwe ine simba rakakodzera mashandisirwo eindasitiri ye "semiconductor".
Mamita Akavakirwa paDensitometry (semuenzaniso, Ultrasonic Slurry Density Meter)
- Inoshandisa kumhanya kwekupararira kweruzha kuburikidza neslurry, zvakananga zvichienderana nehuwandu hwenzwi.
- Inopa kuenzana kwakanyanya mukuyera huwandu hwezvinhu zvakapwanyika uye mhando dzakasiyana dzezvinhu zvinopwanyika.
- Yakakodzera slurry dzinopisa zvakanyanya, kusanganisira CeO₂ uye silica formulations, sezvo zvinhu zvinonzwa zvinogona kugadzirwa zvakaparadzana nemakemikari.
- Kunzwa kwakajairika uye kururama kunosangana nezvinodiwa pasi pe0.001 g/cm³.
- Kuiswa kwacho kunowanzo enderana nemutsetse, zvichibvumira kuyerwa kwenguva chaiyo panguva yekushanda kwemidziyo yekuronga michina yemakemikari.
Mamita akavakirwa paRefractometry
- Inoyera refractive index kuti ione huwandu hweslurry density.
- Inoshanda pakuona shanduko dzisinganzwisisike mukugadzirwa kwetsvina nekuda kwekunzwa kwakanyanya kwekuchinja kwehuwandu; inokwanisa kugadzirisa shanduko dzezvikamu zvehukuru pasi pe0.1%.
- Zvisinei, refractive index inonyatsoenderana nezvinhu zvakaita setembiricha, zvichiita kuti pave nekuongororwa kwakanyatsojeka uye kudzoserwa kwetembiricha.
- Zvingave zvisingakwanisike kushandisa makemikari, kunyanya kana paine zvinhu zvinopisa zvakanyanya kana zvisingaonekwe zvakanaka.
Kuyera Saizi yeZvidimbu seMubatsiri
- Kuverengwa kwehuwandu hwezvinhu kunogona kukanganiswa nekuchinja kwekugoverwa kwehukuru hwezvinhu kana kuungana kwezvikamu.
- Kubatanidzwa nekuongorora saizi yezvikamu (semuenzaniso, kupararira kwechiedza chinoshanduka kana maikorosikopu emaelektroni) kunokurudzirwa neindasitiri, zvichiita kuti kuchinja kwehuwandu hwezvinhu hakungokonzerwa nekuungana kwezvikamu chete.
Zvaunofanira Kufunga Nezve Lonnmeter Inline Density Meters
- Lonnmeter inonyanya kugadzira mita dze inline density uye viscosity, isina kupa software inotsigira kana kuti system integrations.
- Mamita eLonnmeter anogona kutsanangurwa kuti agone kutsungirira slurry dzeCMP dzinokwesha, dzinoshanda nemakemikari uye dzakagadzirirwa kuiswa zvakananga mumichina yekugadzira semiconductor, zvichienderana nezvinodiwa zvekuyerwa kwehuwandu hweslurry panguva chaiyo.
Paunenge uchiongorora sarudzo, tarisa pane zvinodiwa pakushandisa: iva nechokwadi chekuti density meter inowana kunzwisisika uye kururama kunodiwa, yakavakwa nezvinhu zvinoenderana ne slurry chemistry yako, inoramba ichishanda nguva dzose, uye inobatanidzwa zvakanaka mu polishing slurry delivery lines muCMP process. Kune indasitiri ye semiconductor, kuyera kwakaringana slurry density kunotsigira kufanana kwewafer, goho, uye kugadzirwa kwayo.
Mhedzisiro yeKudzora Kuwanda kweSlurry Zvinobudirira paMhedzisiro yeCMP
Kudzora huwandu hweslurry density kwakakosha mukuita kwemakemikari ekuronga. Kana huwandu hweslurry hukaramba hwakafanana, huwandu hwezvimedu zvinogumbura huripo panguva yekupukuta hunoramba hwakagadzikana. Izvi zvinokanganisa zvakananga mwero wekubvisa zvinhu (MRR) uye kunaka kwewafer.
Kuderedzwa kweMatambudziko eWafer Pamusoro uye WIWNU Yakavandudzwa
Kuchengetedza huwandu hwakakwana hweslurry kwakaratidzwa kuderedza zvikanganiso pamusoro pewafer zvakaita se microscratches, dishing, erosion, uye kusvibiswa kwezvikamu. Tsvagiridzo ya2024 inoratidza kuti huwandu hwe density hwakadzorwa, hunowanzova pakati pe1 wt% kusvika 5 wt% ye colloidal silica-based formulations, hunopa chiyero chakanakisa pakati pekushanda zvakanaka kwekubvisa uye kuderedza zvikanganiso. Kuwanda kwakanyanya kunowedzera abrasive collides, zvichikonzera kuwedzera kaviri kusvika katatu kwe defect counts pa square centimeter, sezvakasimbiswa ne atomic force microscopy uye ellipsometry analysis. Tight density control inovandudzawo within-wafer non-uniformity (WIWNU), ichiva nechokwadi chekuti zvinhu zvinobviswa zvakaenzana pawafer, izvo zvakakosha kune advanced node semiconductor devices. Kuwanda kwakasimba kunobatsira kudzivirira process excursions dzinogona kukanganisa firimu thickness targets kana flatness.
Kuwedzerwa kweSlurry Hupenyu Hwese uye Kuderedzwa kweMari Inoshandiswa
Matekiniki ekudzora huwandu hwetsvina—kusanganisira kutarisa panguva chaiyo uchishandisa ultrasonic slurry density metres—anowedzera hupenyu hunobatsira hweCMP polishing slurry. Nekudzivirira kuwanda kwedosi kana kuwanda kwakanyanya, michina yemakemikari inoronga michina inowana kushandiswa kwakanaka kwezvinhu zvinoshandiswa. Nzira iyi inoderedza kuwanda kwekutsiva slurry uye inobvumira nzira dzekudzokorodza, zvichideredza mari yese. Semuenzaniso, muCeO₂ polishing slurry applications, kuchengetedza density nekungwarira kunobvumira kugadziriswazve kwemabatch etsvina uye kunoderedza huwandu hwemarara pasina kukanganisa mashandiro. Kudzora density zvinobudirira kunogonesa mainjiniya ekugadzirisa kuti vadzore uye vashandisezve slurry yekupukuta iri mukati memiganhu yekushanda inogamuchirika, zvichiwedzera kuchengetedza mari.
Kudzokororwa Kwakawedzerwa uye Kudzora Maitiro Ekugadzira Node Yepamusoro
Mashandisirwo emazuva ano eindasitiri ye semiconductor anoda kudzokororwa kwakanyanya mudanho rekugadzira makemikari nemechanical. Mukugadzira ma node epamusoro, kunyangwe kuchinja kudiki muhuwandu hweslurry kunogona kukonzera shanduko isingagamuchirwi mumhedzisiro yewafer. Kuzvigadzira otomatiki uye kubatanidzwa kwe inline ultrasonic slurry density metres—senge dzakagadzirwa neLonnmeter—zvinorerutsa mhinduro inoramba iripo, chaiyo panguva chaiyo yekudzora maitiro. Zvishandiso izvi zvinopa zviyero zvakarurama munzvimbo dzakaoma dzemakemikari dzinojairika dzeCMP, zvichitsigira masisitimu akavharika anopindura nekukurumidza kutsauka. Kuyerwa kwehuwandu hwakavimbika kunoreva kufanana kukuru kubva kuwafer kuenda kuwafer uye kutonga kwakasimba pamusoro peMRR, izvo zvakakosha pakugadzirwa kwe sub-7nm semiconductor. Kuisa michina kwakakodzera—kuiswa kwakakodzera mumutsara wekuendesa slurry—uye kugadzirisa nguva dzose kwakakosha kuona kuti mamita anoshanda zvakavimbika uye anopa data rakakosha kuti maitiro agare zvakanaka.
Kuchengetedza huwandu hwakakwana hwetsvina kwakakosha pakuwedzera goho rezvigadzirwa, kuderedza kusakwana, uye kuve nechokwadi chekuti kugadzirwa kweCMP kunochengetedza mari.
Mibvunzo Inowanzo bvunzwa (Mibvunzo Inowanzo bvunzwa)
Chii chinoshanda pa slurry density meter mu chemical mechanical planarization process?
Chiyero che slurry density chinoshanda basa rakakosha mu chemical mechanical planarization process nekuramba uchiyera density uye concentration ye polishing slurry. Basa rayo guru nderekupa data renguva chaiyo pamusoro pekusagadzikana uye chemical balance mu slurry, ichiva nechokwadi chekuti zvese zviri mukati memiganhu chaiyo ye wafer planarization yakanaka. Kudzora uku kwenguva chaiyo kunodzivirira zvikanganiso zvakaita sekukwenya kana kubviswa kwezvinhu zvisina kuenzana, zvinowanzoitwa ne over- kana under-diluted slurry mixes. Kusagadzikana kwe slurry density kunobatsira kuchengetedza reproducibility mukati me production run, kunoderedza kuchinja kwe wafer-to-wafer, uye kunotsigira process optimization nekukonzera zviito zvekugadzirisa kana kutsauka kwaonekwa. Mukugadzira semiconductor yepamusoro uye mashandisirwo akavimbika, kutarisa nguva dzose kunoderedzawo marara uye kunotsigira matanho akaomarara ekusimbisa mhando.
Sei CeO₂ polishing slurry ichisarudzwa kune mamwe matanho ekuronga muindasitiri yesemiconductor?
Cerium oxide (CeO₂) polishing slurry inosarudzwa pamatanho chaiwo e semiconductor planarization nekuda kwekusarudza kwayo kwakanyanya uye chemical affinity, kunyanya kumafirimu egirazi ne oxide. Zvidimbu zvayo zvakafanana zvinokanganisa zvinoita kuti planarization yemhando yepamusoro ine mwero wakaderera wekukanganisa uye kukwenya kushoma pamusoro. Hunhu hwemakemikari eCeO₂ hunoita kuti mwero wekubvisa ugare wakasimba uye unodzokororwa, izvo zvakakosha kumashandisirwo epamusoro akadai se photonics uye high-density integrated circuits. Pamusoro pezvo, CeO₂ slurry inodzivirira agglomeration, ichichengetedza suspension yakafanana kunyangwe panguva yekushanda kwenguva refu kweCMP.
Chiyero che ultrasonic slurry density chinoshanda sei kana tichienzanisa nedzimwe mhando dzekuyera?
Chiyero che ultrasonic slurry density chinoshanda nekutumira mafungu eruzha kuburikidza neslurry uye kuyera kumhanya uye kudzikira kwemafungu aya. Slurry density inokanganisa zvakananga kuti mafungu anofamba nekukurumidza sei uye kuti simba rawo rinoderera sei. Iyi nzira yekuyera haina kupindira uye inopa data re slurry concentration panguva chaiyo pasina kuda kuparadzanisa kana kukanganisa mafambiro emaitiro. Nzira dze ultrasonic dzinoratidza kusanzwisisika kushoma kune zvinhu zvakaita se flow velocity kana saizi ye particle kana zvichienzaniswa ne mechanical (float-based) kana gravimetric density measurement systems. Mu chemical mechanical planarization, izvi zvinoshanduka kuita zviyero zvakavimbika, zvakasimba kunyangwe mu slurry ine flow yakawanda, ine particles.
Mamita ekuyera slurry density anowanzo shandiswa kupi muCMP system?
Nzvimbo dzakanakisisa dzekuisa slurry density meter muzvishandiso zvemakemikari zvekugadzira planarization zvinosanganisira:
- Tangi rekudzokorora kutenderera kwemvura: kuchengetedza nguva dzose huwandu hwemvura musati magovaniswa.
- Usati wasvika panzvimbo yekupolisha usati washandisa: kuve nechokwadi chekuti slurry yakapihwa inosangana nezvinodiwa nehuwandu hwesimbi.
- Mushure mekusanganisa matope: kuve nechokwadi chekuti mabhechi matsva akagadzirwa anotevedzera zvinodiwa usati wapinda muchikamu chekugadzirisa.
Nzvimbo idzi dzinobvumira kukurumidza kuona nekugadzirisa chero kutsauka muhuwandu hwetsvina, kudzivirira kunaka kwewafer kwakakanganisika uye kukanganisa kwemaitiro. Kuiswa kwayo kunotungamirwa nekuchinja kwetsvina, maitiro akajairika ekusanganisa, uye kudiwa kwemhinduro nekukurumidza pedyo ne planarization pad.
Kudzora kwakanyatsojeka kwehuwandu hwemvura mu slurry kunovandudza sei mashandiro eCMP?
Kudzora huwandu hweslurry nemazvo kunovandudza maitiro ekugadzira makemikari nekuona kuti huwandu hwekubvisa hwakaenzana, kuderedza kusiyana kwekudzivirira pepa, uye kuderedza kuwanda kwezvikanganiso zvepadenga. Kuwanda kweslurry kwakagadzikana kunowedzera hupenyu hwese hwekupukuta pad newafer nekudzivirira kushandiswa zvakanyanya kana kusashandiswa zvakakwana. Kunoderedzawo mitengo yekugadzira nekugadzirisa kushandiswa kweslurry, kuderedza kugadziriswazve, uye kutsigira goho repamusoro remidziyo ye semiconductor. Kunyanya mukugadzira kwepamusoro uye kugadzirwa kwemidziyo ye quantum, kutonga kwakasimba kweslurry kunotsigira kugadzikana kunozvidzokorora, kushanda kwemagetsi nguva dzose, uye kudzikira kwekubuda kwemvura mumagadzirirwo emidziyo.
Nguva yekutumira: Zvita-09-2025
