Kuyera huremu hwe viscosity nemazvo mukuzadza pasi, batanidza nefauyekuvharwa kwemukati of semiconductorkufambakaging for optimalchaiyosiouyend remhosvaility.Kuzadza pasi kunoumba chinhu chakagadzirwa ne epoxy chinogara munzvimbo iri pakati pe semiconductor die ne substrate yayo kana printed circuit board, ichisimbisa solder interconnections kurwisa thermomechanical strains dzinobva mu disparate coefficients dzekuwedzera kwe thermal. Flip chip architecture inoisa die active-side pasi, ichigadzira direct electrical links kuburikidza ne solder bumps, izvo zvinoita kuti denser isanganiswe pamusoro pe convention dze wire-bonding. Kuzadza pasi kunosimbisa kuvimbika nekubvisa zvakaenzana stress kubva pakuchinja kwe thermal, kudzivirira majoini kubva pakusakara, kukanganiswa, kutenderera, uye kusvibiswa kwakadai se humidity, nokudaro zvichiita kuti kushanda kurambe kuri nyore muzvikamu zvakasiyana-siyana kubva kumafoni kusvika kuma automatic systems.
Kupenya kweZvinonamira
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Kukosha kweAdhesive Viscosity muUnderfill, Die Attach, uye Encapsulation
Kugonakunamira kwe namirainobuda senzira huru mumitsetse yekubatanidza ye semiconductor, ichipesvedzera zvakananga kufanana kwekufamba, kukwana kwekuvhara, uye kusavapo kwezvikanganiso mupasi pekurongedza kwe semiconductor, semiconductor yekubatanidza dieuyepcbkuvharwa kwemukatiYakanakisisakuyerwa kwekusimba kweglueInodzivirira matambudziko akadai sepombi dzemhepo, kusawirirana, kana kuisirwa zvishoma zvinokanganisa kusimba kwemuchina uye kufambisa kupisa. Kushandisa zvishandiso zvepamusoro zvakaita seChiyero cheLonnmeter chekusimbisa ganda (viscosity meter) cheglues kana manamatiInopa vagadziri mukana wekutarisa nekukurumidza, ichibvumira shanduko chaiyo yekuchinja kwesimba rekunamatira kuti rienderane nezvinodiwa zvekurongedza zvakasimba, zvichizowedzera mwero wekubereka uye kusimba kwemidziyo.
Chii chinonzi Underfill muPCB?
KunyatsoongororaChii chiri kusakwana muPCBInoburitsa chinhu chine resinous epoxy kana polymeric chinopihwa kuti chifukidze chikamu chisina kunaka chezvinhu zvakasungirirwa, kunyanya mumagadzirirwo eflip chip pamabhodhi edunhu. Chinhu ichi chinotsigira zvisungo zve solder, chinodzikisa kushushikana kwemakanika, uye chinodzivirira kubva kune zvinorwisa zviri munzvimbo dzinosanganisira hunyoro kana kusiyana kwekupisa. Nekupinda munzvimbo dzisina chinhu pakati pe die ne base, inowedzera kupararira kwekupisa uye kusimba kwezvivakwa, zvichiratidza kuti hazvidikanwi kuti pave nemagadzirirwo akamanikana, anoshanda zvakanyanya muzvikamu zvemazuva ano.
Maitiro ekuzadza Chip pasi pechipu
KuitaMaitiro ekuzadza pasi pechipuZvinoreva kugovera epoxy inoyerera ye viscosity yakaderedzwa pamucheto we inverted die mushure mekunyungudutswa, zvichishandisa simba re capillary kuti ipinde munzvimbo diki pakati pe solder protuberances isati yasimba kuburikidza nekupisa. Kugadziriswa kwakadai sekudziya kwe substrate kunokurumidza kupenya, zvichida kutonga kwakasimba kwe viscosity kuti zvisapinda mu gasi uye kuchengetedza mhedzisiro isina matambudziko. Nzira dzakadai se linear kana perimeter dispensing configurations dzinobatanidza kufambira mberi kwe adhesive ne enclosure contours, kuderedza kusakwana uye kuwedzera kutsungirira pakupisa kwe cyclic.
Maitiro Ekubatanidza Die muSemiconductor
Iyomaitiro ekubatanidza kufa mu semiconductorIzvi zvinosanganisira kunamira die isina kuvharwa pamudziyo unotakura kana furemu uchishandisa ma conductive kana insulating bonds, akadai se epoxies kana fusible alloys, kuti ive nechokwadi chekuti kupisa uye current transfer zvinobudirira. Chikamu ichi chekutanga, chakakosha pakubatanidza kana sheathing inotevera, chinoda kuiswa kwakarurama kwe name kuburikidza nekubata marobhoti kudzivirira maburi uye kuchengetedza hukama hwakanaka. Kutarisa viscosity kwakakosha kudzivirira kukanganisa uye kuona kuti kunamira kwakafanana, zvichisimbisa kugadzirwa kwehukuru pasina kuvimbika.
Maitiro ekuvhara muSemiconductor
Mukati memaitiro ekuvhara mu semiconductor, maresini anodzivirira anofukidza die nekubatanidza, achiisa chipingamupinyi kubva pakukuvadzwa kwemuviri, kupinda kwehunyoro, uye kuora kwekupisa kuburikidza nenzira dzakadai sekuumbwa kwakamanikidzwa, kunowanzowedzerwa nekubuda kuti kubudise maburi. Kudzora kusimba kwesimba kwakakosha kuti pave nekudzikama kushoma, mafomura akakwirira ezvimedu zvinovandudza kubuda kwekupisa uye kuchengetedza kugara zvakanaka kwenzvimbo dzakavharirwa mumamiriro ezvinhu asina kunaka.
Migumisiro Yekusviba Kusingadzoreki
Kutsauka mu viscosity kunokonzera kusarongeka kukuru, kunosanganisira zvidimbu zve sedimentation zvichiburitsa zvidimbu zvisina kurongeka, zvichiwedzera kusawirirana kwekupisa, kupatsanurwa kwepakati pechiso, uye kukurumidza kuora kwemajoini. Kusarongeka kunokonzera maburi kana kushomeka kwemvura, zvichikonzera kuputika pakati pekupisa uye kuwedzera mari yekugadzirisa. Kusiyana kwakadaro kunowedzera kuwedzera kukombama kwenzvimbo, kuchikanganisa ma bond uye kuchikonzera kukurwa kwemvura kubva muhunyoro, izvo zvinoita kuti vagadziri vakangwara vasashandise nekutarisa kwakasimba kuti varambe vachishanda zvakanaka.
Matekinoroji ekuyera viscosity
Kuongororwa kwe viscosity yemazuva ano muma adhesives kunoshandisa nzira dzakasiyana-siyana, kunyanya ma vibrational probes anoyera kupikisa kwemvura pasina kudonha kwemagetsi, zvichipa zviyero zvakanyatsojeka munzvimbo dzinoda kuyerera. Izvi zvishandiso zviri mukati, zvakasiyana kubva pakuongororwa kwesporadic kuburikidza nemakapu kana zvishandiso zvinotenderera, zvinopa ruzivo rwekukurumidza nezvehunhu husiri hweNewtonian senge shear dilution kana kuyerera kunoenderana nenguva, hunokosha kune adhesives muma semiconductor workflows. Zvishandiso zvakadaro zvinorerutsira shanduko dzinoshanduka, zvichienderana ne automation kuderedza kusawirirana uye kusimbisa kuvimbika kwemaitiro.
Basa reViscosity muFlow Dynamics
Kusviba kunokanganisa zvakanyanya nguva yekuiswa uye kufanana muunderfill, uko huwandu hwakawedzerwa kubva kuzvikamu zvidiki zvinopinda mukati mevhu hunowedzera kupenya kwevhu asi hunosimbisa hunhu hwemakanika mushure mekuoma. Mukubatanidza nekubatanidza, zvinoreva simba rekubatana uye kushanda zvakanaka kwekudzivirira, nekudzikiswa kwekupisa kunoda nzira dzekubhadhara kuti dzirambe dzakapararira zvakanaka pasina kushomeka kwakanyanya, nokudaro zvichideredza njodzi dzakadai sekupararira zvakanyanya kana kuungana.
Dzidza NezveMamwe Mamita Ehuremu
Mamwe Mamita Emaitiro Epamhepo
Meter yeLonnmeter Viscosity yeGlues kana Adhesives
Iyomita yekuyeresa viscosity yeglue, yakaratidzwa neLonnmeter, inopa mudziyo unoshanda zvakasimba wekutarisa hunhu hweglue nguva dzose. Ichishandisa oscillatory sensing, inoyera resistance inosvika 1 kusvika 1,000,000 cP ine ±2% ~ 5% chaiyo uye mhinduro dzinokurumidza, yakakodzera mamiriro akaomarara anosanganisira kumanikidzwa kwakakwira kana nzvimbo dzine njodzi. Ma probe ayo anochinjika uye nyore kupinda muma conduits kana midziyo inoita kuti ive muenzaniso wekuchengetedza kufanana kweglue muma mechanized sequences ekugadzira semiconductor, anosanganisira epoxies, hotmelts, uye starch variants.
Zvishandiso muAdhesive Process
Lonnmeter inoshanda muzvikamu zvakasiyana-siyana zvakaita semagetsi nemotokari, ichitarisira guruu mukugovera, kuisa layering, kana kushanda kwekubatanidza. Munzvimbo dze semiconductor, inoongorora ma epoxies panguva yekuzadza pasi nekuvhara, ichiona kuti inobatanidzwa zvakanaka mumapaipi kana ma mixers kuti iwane data risingaperi, rinochinjika kune maitiro asiri eNewtonian uye ma scope ekupisa akanyanya kusvika 350°C.
Zvinhu zveTekinoroji
Yakavakwa nesimbi dzakasimba dzisina zvinhu zvinofamba-famba, Lonnmeter inotsungirira kusvibiswa uku ichibatana kuburikidza neModbus kuti iite otomatiki. Huremu hwayo hunotenderera pama frequency akatsanangurwa kuti ione kuchinja kwe viscosity uye density, zvichiita kuti pave nekuchinja kwe HMA formulations kana epoxy blends, zvichikurudzira kunyatsojeka muma assemblies ane njodzi huru.
Mabhenefiti
Kuisa huwandu hwe viscosity muzvirongwa zvekurongedza kunoita kuti pave nekufambira mberi kukuru mukubudirira, kuvimbika, uye kungwara mune zvemari. Nekugadzirisa matambudziko e viscosity, vagadziri vanonatsa kuiswa kwe namatidza, vanoderedza zvisizvo, uye vanowedzera goho rekugadzira zvinhu, nekudzikira kwemarara uye kumira kwekushanda.
| Kubatsirwa | Tsananguro | Mhedzisiro paMaitiro |
| Kutarisa Munguva Chaiyo | Kutevera nguva dzose kwekutsauka kwe viscosity | Inodzivisa maburi, inonatsa simba rekuyerera kwemvura mupasi pevhu |
| Kubatanidzwa kwePLC/DCS | Kutenderera kwedata nemashini kuti riwirirane zvakasiyana-siyana | Inoderedza kupindira kwemaoko, inowedzera hunyanzvi mukubatanidza zvinhu |
| Kufanotaura Kwezvikanganiso | Kufungidzira zvinhu zvakaita semaburi kuburikidza nekuongorora mafambiro ezvinhu | Inogadzirisa zvinhu, inowedzera goho mu encapsulation |
| Kuzvigadzira Otomatiki Kwakangwara | Kugadziriswa kweAlgorithm kuti iite zvakanaka | Inovimbisa kuvimbika, inotsigira kuchengetedzwa kwakarongeka |
| Kuenderana Kwemhando | Hunhu hwakafanana hweboka remabheti hunoita kuti unamatire zviri nani | Inovandudza kuvimbika kwe semiconductor packaging |
| Kuderedza Marara | Kuderedza kuwanda kwehuwandu kuburikidza nekudzora kwakarurama | Inoderedza mitengo uye kukanganisa nharaunda mumabasa ese |
Kuyerwa kweViscosity Yenguva Yechokwadi
Kuyerwa kwe viscosity panguva chaiyoInobvumira kukurumidza kuziva shanduko dzepfuma, ichibvumidza shanduko dzinokurumidza kuchengetedza kuyerera kwakanaka uye hunhu hwekupinza. Unyanzvi uhwu hunoderedza zvikanganiso zvakaita semakomba kana maburi, huchivimbisa kuiswa kwakafanana muzvinhu zvisina kuzara uye zvakavharirwa, zvichiguma nekuenzana kwezvinhu zvakanaka uye kuderedzwa kwekupambadzwa munzvimbo dzakakura, zvichigona kuderedza kurambwa nekota muzvikamu zvakagadziriswa.
Kubatanidzwa kune PLC/DCS System
Hazvina kuomakubatanidzwa kune PLC/DCS systeminokurumidza kugadzirisa otomatiki viscosity kuburikidza nekutumira zviyero kuburikidza nemakombiyuta eanalog kana edhijitari akadai seModbus. Kubatana uku kunosanganisa glue conduct nezvigadzirwa zvekugadzira, zvichikonzera mhinduro dzenguva pfupi dzinowedzera kugona kwekushanda uye dzinoderedza kukanganiswa kwenzira dze underfill, die attach, uye encapsulation.
Kugadziriswa kweParameter, Kufanotaura Zvikanganiso, uye Kudzora Kwakangwara
Mabhande ekutarisira epamusoro-sorokugadzirisa maparamendi, kufanotaura zvikanganiso, uye kutonga kwakangwaranekushandisa nzira dzedata kuti vaone zvinhu zvakaita sekutanga kwenzvimbo dzakavharika kana kuti kudonha kwevhu. Maitiro emakombiyuta anoongorora zvinhu zviripo panguva imwe chete kuti atange kugadzirisa zvinhu, achivimbisa kuti zvinhu zvichagadziriswa zvakanaka uye achikurumidzisa mashandiro kuburikidza nekushandisa michina yeuropi, panguva imwe chete achideredza kuwanda kwezvinhu ne15-20% uye achikurudzira tsika dzinochengetedza nharaunda.
Kugara Kwakanaka Uye Kuderedza Marara
Kugara uchitarisa kunoita kuti zvinhu zvienderane, zvichiwedzera kushanda kwechinhu chinonamira muzvinhu zvakaita sekusimba kwechinhu chinonamira uye simba rekupisa, izvo zvakakosha pakugara kwenguva refu kwechinhu chinonamira. Izvi zvinoderedza marara kuburikidza nekushandiswa kushoma kwechinhu chinonamira, kuderedza kushandiswa kwezvinhu uye mafambiro ezvakatipoteredza, nepo kuchengetedza zvinhu kubva mumaitiro ekufanotaura kuchipfupisa kumiswa kwechinhu, kuwedzera kugona kwechinhu kukura uye kutevedzera mitemo.
Fambisa mabasa ako ekurongedza ma semiconductor neunyanzvi hwakanyanya hwekunakisa. Tibate nekukurumidza kuti uwane chikumbiro chako chemutengo wekuwedzera ma viscosity eLonnmeter pamberi pako.kunyatsozadza pasi pevhu nenzira chaiyo, die attach, uye maitiro ekuvhara mapfupa, zvichiratidza kusimba uye hunyanzvi husina muganho.
