Kukonzekera kwa makina a mankhwala(CMP) ndi njira yoyambira pakupanga zinthu zapamwamba za semiconductor. Imapereka kusalala kwa atomiki pamalo a wafer, zomwe zimathandiza kuti mapangidwe azigawo zambiri, kulongedza zida zolimba, komanso kupanga zinthu zodalirika. CMP imaphatikiza zochita za mankhwala ndi makina nthawi imodzi—pogwiritsa ntchito pedi yozungulira ndi slurry yapadera yopukuta—kuti ichotse mafilimu ochulukirapo ndi zolakwika zosalala pamwamba, zomwe ndizofunikira kwambiri pakupanga mawonekedwe ndi kulumikizana m'mabwalo ophatikizika.
Ubwino wa wafer pambuyo pa CMP umadalira kwambiri kuwongolera mosamala kapangidwe ka slurry yopukutira ndi makhalidwe ake. Slurry ili ndi tinthu tomwe timayabwa, monga cerium oxide (CeO₂), tomwe timayikidwa mu cocktail ya mankhwala opangidwa kuti azitha kukweza kukanda kwa thupi komanso kuchuluka kwa zochita za mankhwala. Mwachitsanzo, cerium oxide imapereka kuuma kwabwino kwambiri komanso kapangidwe ka pamwamba pa mafilimu opangidwa ndi silicon, zomwe zimapangitsa kuti ikhale chinthu chosankhidwa kwambiri mu ntchito zambiri za CMP. Kugwira ntchito kwa CMP sikungodalira kokha momwe tinthu toyabwa timayabwa komanso momwe timayang'anira bwino kuchuluka kwa slurry, pH, ndi kuchulukana.
Kukonzekera kwa Makina a Mankhwala
*
Zoyambira za Kupukuta Ma Slurries mu Kupanga Ma Semiconductor
Ma slurry opukutira ndi ofunikira kwambiri pa ndondomeko yokonzera makina a mankhwala. Ndi zosakaniza zovuta zomwe zimapangidwa kuti zikwaniritse kusweka kwa makina komanso kusintha kwa pamwamba pa ma wafer. Ntchito zofunika kwambiri za ma CMP slurry ndi monga kuchotsa bwino zinthu, kuwongolera ma planarity, kufanana pa malo akuluakulu a ma wafer, komanso kuchepetsa zolakwika.
Ntchito ndi Mapangidwe a Ma Polishing Slurries
Chotsukira cha CMP chimakhala ndi tinthu tomwe timapachikidwa mu madzi, tomwe timawonjezeredwa ndi zowonjezera za mankhwala ndi zokhazikika. Chigawo chilichonse chimagwira ntchito yosiyana:
- Zokometsera:Tinthu tating'onoting'ono tolimba timeneti—makamaka silica (SiO₂) kapena cerium oxide (CeO₂) m'ma semiconductor application—timagwira ntchito yochotsa zinthu pogwiritsa ntchito makina. Kuchuluka kwa tinthu tating'onoting'ono ndi kugawa kwake kumayang'anira kuchuluka kwa kuchotsedwa komanso ubwino wa pamwamba. Kuchuluka kwa tinthu tating'onoting'ono nthawi zambiri kumakhala pakati pa 1% mpaka 5% polemera, ndipo tinthu tating'onoting'ono timakhala pakati pa 20 nm ndi 300 nm, tomwe timayikidwa bwino kuti tipewe kukanda kwambiri kwa wafer.
- Zowonjezera Zamankhwala:Zinthu zimenezi zimapangitsa kuti pakhale malo abwino okonzera zinthu. Ma oxide (monga hydrogen peroxide) amathandiza kupanga zigawo za pamwamba zomwe zimakhala zosavuta kuzichotsa. Zinthu zomangira kapena zochotsa zinthu (monga ammonium persulfate kapena citric acid) zimamangirira ma ayoni achitsulo, zomwe zimathandiza kuchotsa ndi kuletsa mapangidwe a zolakwika. Zinthu zoletsa izi zimayambitsidwa kuti zisawononge kudulidwa kosafunikira kwa zigawo za wafer zomwe zili pafupi kapena pansi pake, zomwe zimapangitsa kuti zisankhe bwino.
- Zokhazikika:Ma surfactants ndi ma pH buffers amasunga kukhazikika kwa matope ndi kufalikira kofanana. Ma surfactants amaletsa kusonkhana kwa abrasive, kuonetsetsa kuti kuchuluka kwa kuchotsa kumakhala kofanana. Ma pH buffers amalola kuchuluka kwa mankhwala komwe kumachitika nthawi zonse komanso amachepetsa mwayi woti tinthu tidulidwe kapena dzimbiri.
Kapangidwe ndi kuchuluka kwa gawo lililonse zimapangidwa molingana ndi zinthu za wafer, kapangidwe ka chipangizocho, ndi gawo la ndondomeko yomwe ikukhudzidwa ndi njira yokonzera mankhwala.
Ma slurries Ofala: Silika (SiO₂) vs Cerium Oxide (CeO₂)
Silika (SiO₂) polishing slurriesAmagwiritsa ntchito njira zoyendetsera oxide planarization, monga interlayer dielectric (ILD) ndi shallow trench isolation (STI) polishing. Amagwiritsa ntchito colloidal kapena fumed silica ngati abrasives, nthawi zambiri m'malo oyambira (pH ~ 10), ndipo nthawi zina amawonjezeredwa ndi ma surfactants ang'onoang'ono ndi zoletsa dzimbiri kuti achepetse zolakwika zokanda ndikuwonjezera kuchuluka kwa zochotsa. Tinthu ta silika timafunika chifukwa cha kukula kwawo kofanana komanso kuuma kochepa, zomwe zimapangitsa kuti zinthu zichotsedwe bwino komanso mofanana.
Ma slurry opukutira a Cerium oxide (CeO₂)Amasankhidwa kuti agwiritsidwe ntchito movuta omwe amafuna kusankha bwino komanso molondola, monga kupukuta komaliza kwa galasi, kukonza bwino kwa substrate, ndi zigawo zina za oxide muzipangizo za semiconductor. Ma abrasives a CeO₂ amasonyeza reactivity yapadera, makamaka ndi malo a silicon dioxide, zomwe zimathandiza njira zochotsera mankhwala ndi makina. Khalidwe la dual-action limeneli limapereka kuchuluka kwa kukonza bwino pamlingo wochepa wa zolakwika, zomwe zimapangitsa kuti CeO₂ slurries ikhale yabwino kwambiri pa magalasi, ma hard disk substrates, kapena ma logic device nodes apamwamba.
Cholinga Chogwira Ntchito cha Zoletsa, Zowonjezera, ndi Zokhazikika
- Zovala zobisala: Chitani kukwapula kwa makina. Kukula kwawo, mawonekedwe awo, ndi kuchuluka kwawo kumalamulira kuchuluka kwa kuchotsa ndi kutha kwa pamwamba. Mwachitsanzo, zopopera za silica za 50 nm zofanana zimaonetsetsa kuti zigawo za oxide zikuyenda bwino komanso mofanana.
- Zowonjezera Zamankhwala: Yambitsani kuchotsa mwa kusankha mwa kuthandizira kusungunuka kwa pamwamba ndi kusungunuka. Mu CMP ya mkuwa, glycine (monga chothandizira kuphatikiza) ndi hydrogen peroxide (monga chowonjezera) zimagwira ntchito mogwirizana, pomwe BTA imagwira ntchito ngati choletsa kuteteza mawonekedwe a mkuwa.
- Zokhazikika: Sungani kapangidwe ka matope mofanana pakapita nthawi. Mankhwala ophera tizilombo toyambitsa matenda amaletsa kusungunuka kwa madzi ndi kusonkhana kwa madzi, kuonetsetsa kuti tinthu tomwe timayamwa timafalikira nthawi zonse komanso kuti tipezeke pa ntchitoyi.
Katundu Wapadera ndi Zochitika Zogwiritsira Ntchito: CeO₂ ndi SiO₂ Slurries
CeO₂ polishing slurryimapereka kusankha kwakukulu pakati pa galasi ndi silicon oxide chifukwa cha momwe imagwirira ntchito ndi mankhwala. Ndi yothandiza kwambiri popanga ma substrates olimba, ofooka kapena ma oxide ophatikizika komwe kusankha kwakukulu kwa zinthu ndikofunikira. Izi zimapangitsa kuti CeO₂ slurries ikhale yokhazikika pokonzekera ma substrate apamwamba, kumaliza bwino magalasi, komanso njira zina za shallow trench isolation (STI) CMP mumakampani opanga ma semiconductor.
SiO₂ polishing slurryimapereka njira yolumikizirana bwino yochotsera zinthu pogwiritsa ntchito makina ndi mankhwala. Imagwiritsidwa ntchito kwambiri pokonza ma oxide ambiri ndi ma dielectric planarization, komwe kumafunika mphamvu zambiri komanso kufooka kochepa. Kukula kwa tinthu ta silika komwe kumayendetsedwa bwino komanso kofanana kumachepetsa kupanga ma scratch ndikutsimikizira kuti pamwamba pake pali bwino kwambiri.
Kufunika kwa Kukula kwa Tinthu ndi Kufalikira kwa Tinthu Tofanana
Kukula kwa tinthu tating'onoting'ono ndi kufanana kwa kufalikira ndizofunikira kwambiri pakugwira ntchito bwino kwa matope. Tinthu tating'onoting'ono tomwe timafanana, tomwe timapanga nanometer, timatsimikizira kuti zinthuzo zimachotsedwa mosavuta komanso kuti pamwamba pake pakhale wafer wopanda chilema. Kusakanikirana kwa tinthu tating'onoting'ono kumabweretsa kukanda kapena kupukuta kosayembekezereka, pomwe kufalikira kwakukulu kumayambitsa kulinganiza kosagwirizana komanso kuchuluka kwa chilema.
Kuwongolera bwino kuchuluka kwa matope - koyang'aniridwa ndi ukadaulo monga choyezera kuchuluka kwa matope kapena zida zoyezera kuchuluka kwa matope - kumaonetsetsa kuti katundu wonyamula nthawi zonse komanso zotsatira zake zidziwike bwino, zomwe zimakhudza mwachindunji ntchito ya chipangizocho. Kukwaniritsa kuwongolera kolondola kwa kuchuluka kwa matope ndi kufalikira kofanana ndizofunikira kwambiri pakukhazikitsa zida zama makina opangira mankhwala komanso kukonza njira.
Mwachidule, kupanga ma slurry opukutira—makamaka kusankha ndi kuwongolera mtundu wa abrasive, kukula kwa tinthu, ndi njira zokhazikika—kumadalira kudalirika ndi kugwira ntchito bwino kwa njira yokonzera makina a mankhwala mu ntchito zamafakitale a semiconductor.
Kufunika kwa Kuyeza Kuchuluka kwa Madzi mu CMP
Mu ndondomeko yokonza makina a mankhwala, kuyeza molondola ndi kuwongolera kuchuluka kwa slurry kumakhudza mwachindunji magwiridwe antchito ndi ubwino wa kupukuta kwa wafer. Kuchuluka kwa slurry—kuchuluka kwa tinthu tating'onoting'ono tomwe timakhala mkati mwa slurry yopukuta—kumagwira ntchito ngati chowongolera chapakati, kupanga kuchuluka kwa kupukuta, mtundu womaliza wa pamwamba, ndi kuchuluka kwa wafer yonse.
Ubale Pakati pa Kuchulukana kwa Madzi Oundana, Kuchuluka kwa Kupukuta, Ubwino wa Malo Ozungulira, ndi Kuchuluka kwa Madzi Oundana
Kuchuluka kwa tinthu tating'onoting'ono tomwe timaphikidwa mu CeO₂ polishing slurry kapena njira ina yophikidwa imatsimikiza momwe zinthu zimachotsedwera mwachangu pamwamba pa wafer, zomwe zimatchedwa removal rate kapena material removal rate (MRR). Kuchuluka kwa slurry density nthawi zambiri kumawonjezera kuchuluka kwa ma abrasive contacts pa unit area, zomwe zimafulumizitsa polishing rate. Mwachitsanzo, kafukufuku wolamulidwa wa 2024 adanenanso kuti kukweza kuchuluka kwa tinthu ta silica mpaka 5 wt% mu colloidal slurry kunawonjezera kuchuluka kwa ma exports a silicon wafers a 200 mm. Komabe, ubalewu si wa linear—malo ocheperako amabwerera. Pa kuchuluka kwa slurry, particle agglomeration imayambitsa plateau kapena kuchepa kwa export rate chifukwa cha kusokonezeka kwa mayendedwe azinthu komanso kuwonjezeka kwa viscosity.
Ubwino wa pamwamba umakhudzidwanso ndi kuchuluka kwa matope. Pa kuchuluka kwakukulu, zolakwika monga mikwingwirima, zinyalala zobisika, ndi mabowo zimakhala zofala kwambiri. Kafukufuku yemweyo adawona kukwera kolunjika kwa kukhwima kwa pamwamba ndi kuchuluka kwakukulu kwa kukanda pamene kuchuluka kwa matope kumawonjezeka kuposa 8-10 wt%. Mosiyana ndi zimenezi, kuchepetsa kuchuluka kwa matope kumachepetsa chiopsezo cha matope koma kungachedwetse kuchotsa ndikuwononga planarity.
Kuchuluka kwa ma wafer, kuchuluka kwa ma wafer omwe amakwaniritsa zofunikira pambuyo popukuta, kumayendetsedwa ndi zotsatira izi pamodzi. Kuchuluka kwa zolakwika ndi kuchotsa kosagwirizana zonse zimachepetsa kuchuluka kwa zokolola, zomwe zimatsimikizira kuti pali kusiyana pakati pa kupanga ndi mtundu wa zinthu zamakono zopangidwa ndi ma semiconductor.
Zotsatira za Kusintha Kwang'ono kwa Kuchuluka kwa Madzi Ochokera M'madzi pa Njira ya CMP
Ngakhale kusiyana kochepa kuchokera ku kuchuluka kwa matope abwino kwambiri—zigawo za peresenti imodzi—kungakhudze kwambiri ntchito yotulutsa. Ngati kuchuluka kwa abrasive kupitirira cholinga, tinthu tating'onoting'ono tingathe kusonkhana, zomwe zimapangitsa kuti ma pads ndi ma conditioner disc awonongeke mwachangu, kuchuluka kwa kukanda pamwamba, komanso kutsekeka kapena kuwonongeka kwa zigawo zamadzimadzi mu zida zopangira makina a mankhwala. Kuchepa kwa kuchuluka kumatha kusiya mafilimu otsalira ndi malo osakhazikika pamwamba, zomwe zimavuta njira zotsatizana zojambulira zithunzi ndikuchepetsa zokolola.
Kusiyanasiyana kwa kuchuluka kwa slurry kumakhudzanso momwe mankhwala ndi makina amachitira pa wafer, zomwe zimakhudza kufooka ndi magwiridwe antchito a chipangizocho. Mwachitsanzo, tinthu tating'onoting'ono kapena tosabalalika mofanana m'ma slurry ochepetsedwa mphamvu zimakhudza kuchuluka kwa zochotsa m'deralo, zomwe zimapangitsa kuti pakhale microtopography yomwe ingafalikire ngati zolakwika pakupanga zinthu zambiri. Zinthu zazing'onozi zimafuna kuwongolera kwambiri kuchuluka kwa slurry ndikuwunika mwamphamvu, makamaka m'ma node apamwamba.
Kuyeza ndi Kukonza Kuchuluka kwa Slurry mu Nthawi Yeniyeni
Kuyeza nthawi yeniyeni kwa kuchuluka kwa slurry, komwe kumathandizidwa ndi kuyika mita yozungulira—monga mita yozungulira ya slurry yopangidwa ndi Lonnmeter—tsopano ndi njira yodziwika bwino mumakampani opanga ma semiconductor. Zipangizozi zimalola kuyang'anira kosalekeza magawo a slurry, kupereka mayankho nthawi yomweyo pa kusinthasintha kwa kuchuluka kwa slurry pamene slurry ikuyenda kudzera mu zida za CMP ndi machitidwe ogawa.
Ubwino waukulu wa kuyeza kuchuluka kwa slurry munthawi yeniyeni ndi awa:
- Kuzindikira nthawi yomweyo zinthu zomwe sizikufotokozedwa bwino, kupewa kufalikira kwa zolakwika kudzera munjira zokwera mtengo zotsatizana
- Kukonza njira—kumathandiza mainjiniya kusunga zenera labwino kwambiri la slurry, kukulitsa kuchuluka kwa kuchotsa pomwe kuchepetsa zolakwika
- Kuwonjezeka kwa wafer kuchokera ku wafer kupita ku wafer komanso kusinthasintha kwa lot-to-lot, zomwe zimapangitsa kuti pakhale kupanga kwakukulu.
- Ukhondo wa zida nthawi yayitali, chifukwa matope okhuthala kwambiri kapena osakhuthala mokwanira amatha kufulumizitsa kuwonongeka kwa ma polishing pads, ma mixer, ndi mapaipi ogawa.
Malo oyika zida za CMP nthawi zambiri amadutsa zitsanzo za ma loops kapena mizere yobwerezabwereza kudzera mu malo oyezera, kuonetsetsa kuti kuchuluka kwa madzi kumayimira kuyenda kwenikweni komwe kumaperekedwa ku ma wafer.
Yolondola komanso yeniyenimuyeso wa kuchuluka kwa slurryImapanga maziko a njira zolimba zowongolera kuchuluka kwa slurry, zothandizira njira zodziwika bwino komanso zatsopano zopukutira slurry, kuphatikiza slurry zovuta za Cerium oxide (CeO₂) za interlayer ndi oxide CMP yapamwamba. Kusunga gawo lofunikali kumalumikizana mwachindunji ndi kupanga, kuwongolera ndalama, ndi kudalirika kwa zida panthawi yonse ya kukonza makina a mankhwala.
Mfundo ndi Ukadaulo wa Kuyeza Kuchulukana kwa Madzi Oundana
Kuchuluka kwa slurry kumafotokoza kuchuluka kwa zinthu zolimba pa unit voliyumu mu slurry yopukuta, monga ma formula a Cerium oxide (CeO₂) omwe amagwiritsidwa ntchito mu chemical mechanical planarization (CMP). Kusintha kumeneku kumatsimikiza kuchuluka kwa zinthu zomwe zimachotsedwa, kufanana kwa zotuluka, ndi kuchuluka kwa zolakwika pa ma wafer opukutidwa. Kuyeza bwino kuchuluka kwa slurry ndikofunikira kwambiri pakuwongolera kuchuluka kwa slurry, zomwe zimakhudza mwachindunji kuchuluka kwa zokolola ndi zolakwika mu ntchito zamafakitale a semiconductor.
Mitundu yosiyanasiyana ya zoyezera kuchuluka kwa slurry imagwiritsidwa ntchito mu ntchito za CMP, iliyonse imagwiritsa ntchito mfundo zosiyanasiyana zoyezera. Njira zoyezera gravimetric zimadalira kusonkhanitsa ndikuyesa kuchuluka kwa slurry komwe kwafotokozedwa, zomwe zimapereka kulondola kwambiri koma sizigwira ntchito nthawi yeniyeni ndikuzipangitsa kuti zisagwiritsidwe ntchito mosalekeza poyika zida za CMP. Zoyezera kuchuluka kwa electromagnetic zimagwiritsa ntchito minda ya electromagnetic kuti zizindikire kuchuluka kwa zinthu kutengera kusintha kwa conductivity ndi permittivity chifukwa cha tinthu tating'onoting'ono tomwe timayimitsidwa. Zoyezera kugwedezeka, monga zoyezera kugwedezeka kwa chubu, zimayesa kuyankha kwafupipafupi kwa chubu chodzazidwa ndi slurry; kusinthasintha kwa kuchuluka kwa zinthu kumakhudza kugwedezeka kwa zinthu, zomwe zimathandiza kuyang'anira kosalekeza. Maukadaulo awa amathandizira kuyang'anira mkati koma amatha kukhala ozindikira kuipitsidwa kapena kusintha kwa mankhwala.
Ma ultrasound slurry density mita akuyimira kupita patsogolo kwaukadaulo kofunikira pakuwunika kuchuluka kwa zinthu munthawi yeniyeni pakukonza kwa mankhwala ndi makina. Zipangizozi zimatulutsa mafunde a ultrasound kudzera mu slurry ndikuyesa nthawi yowuluka kapena liwiro la kufalikira kwa mawu. Liwiro la mawu mu sing'anga limadalira kuchuluka kwake ndi kuchuluka kwa zinthu zolimba, zomwe zimapangitsa kuti pakhale kutsimikiza kolondola kwa zinthu za slurry. Makina a ultrasonic ndi oyenera kwambiri malo okhala ndi mphamvu komanso amphamvu a CMP, chifukwa salowerera ndipo amachepetsa kuipitsidwa kwa sensor poyerekeza ndi ma direct contact mita. Lonnmeter imapanga inline ultrasonic slurry density mita zomwe zimapangidwa kuti zigwirizane ndi mizere ya CMP yamakampani a semiconductor.
Ubwino wa ultrasound slurry density meter ndi monga:
- Kuyeza kosalowerera: Masensa nthawi zambiri amaikidwa kunja kapena mkati mwa maselo oyenda modutsa, kuchepetsa kusokonezeka kwa matope ndikupewa kusweka kwa malo ozindikira.
- Kutha kugwira ntchito nthawi yeniyeni: Kutulutsa kosalekeza kumathandiza kusintha njira mwachangu, kuonetsetsa kuti kuchuluka kwa slurry kumakhala mkati mwa magawo ofunikira kuti pakhale kupukutira kwa wafer koyenera.
- Kulondola kwambiri komanso kulimba: Ma scanner a Ultrasonic amapereka kuwerenga kokhazikika komanso kobwerezabwereza, osakhudzidwa ndi kusintha kwa kapangidwe ka slurry kapena kuchuluka kwa tinthu tating'onoting'ono pamakina owonjezera.
- Kuphatikiza ndi zida za CMP: Kapangidwe kawo kamathandizira kuyika malo mu mizere yozungulira yozungulira kapena manifold otumizira, kupangitsa kuti kuwongolera njira kukhale kosavuta popanda nthawi yayitali yogwira ntchito.
Kafukufuku waposachedwa wa semiconductor wopanga zinthu wasonyeza kuchepa kwa chilema mpaka 30% pamene kuyang'anira kuchuluka kwa ma ultrasonic komwe kumachitika pamzere kumawonjezera kuyika kwa zida zopangira makina opangira ma slurry a Cerium oxide (CeO₂). Kuyankha kodziyimira pawokha kuchokera ku masensa a ultrasonic kumalola kuwongolera kwambiri ma slurry formulations, zomwe zimapangitsa kuti makulidwe akhale ofanana komanso kuti zinthu zisamatayike kwambiri. Ma Ultrasonic density mita, akaphatikizidwa ndi ma protocol olimba a calibration, amakhalabe ndi magwiridwe antchito odalirika poyang'anizana ndi kusintha kwa kapangidwe ka slurry, komwe kumachitika kawirikawiri mu ntchito zapamwamba za CMP.
Mwachidule, kuyeza kuchuluka kwa slurry nthawi yeniyeni—makamaka pogwiritsa ntchito ukadaulo wa ultrasonic—kwakhala kofunikira kwambiri pa njira zolondola zowongolera kuchuluka kwa slurry mu CMP. Kupita patsogolo kumeneku kumathandizira mwachindunji zokolola, magwiridwe antchito, komanso mtundu wa wafer mumakampani opanga ma semiconductor.
Kuyika ndi Kuphatikiza mu CMP Systems
Kuyeza bwino kuchuluka kwa matope ndikofunikira kwambiri poyang'anira kuchuluka kwa matope mu njira yokonzera mankhwala. Kusankha malo abwino okhazikitsira matope kumakhudza mwachindunji kulondola, kukhazikika kwa njira, komanso mtundu wa wafer.
Zinthu Zofunika Kwambiri Posankha Malo Oyikira
Mu makonzedwe a CMP, mita yoyezera kuchuluka kwa madzi iyenera kuyikidwa kuti iwunikire matope enieni omwe amagwiritsidwa ntchito popukuta wafer. Malo oyambira oyikamo ndi awa:
- Tanki Yobwezeretsanso Mphamvu:Kuyika mita pamalo otulukira madzi kumapereka chidziwitso cha momwe madzi alili pansi pa madzi musanagawidwe. Komabe, malo awa sangasinthe zomwe zimachitika pambuyo pake, monga kupangika kwa thovu kapena kutentha kwa m'deralo.
- Mizere Yotumizira:Kuyika mayunitsi osakaniza pambuyo posakaniza komanso musanalowe mu ma manifold ogawa kumatsimikizira kuti muyeso wa kuchuluka kwa madzi ukuwonetsa kapangidwe komaliza ka madziwo, kuphatikizapo madzi oyeretsera a Cerium oxide (CeO₂) ndi zina zowonjezera. Malo awa amalola kuzindikira mwachangu kusintha kwa kuchuluka kwa madziwo asanakonzedwe ma wafers.
- Kuwunika Malo Ogwiritsira Ntchito:Malo abwino kwambiri ndi pamwamba pa valavu kapena chida chogwiritsira ntchito. Izi zimagwira kuchuluka kwa matope nthawi yeniyeni ndikudziwitsa ogwiritsa ntchito za kusintha kwa machitidwe komwe kungachitike chifukwa cha kutentha kwa mzere, kulekanitsa, kapena kupanga mabulobu ang'onoang'ono.
Posankha malo oyikapo, zinthu zina monga kayendetsedwe ka madzi, momwe mapaipi amayendera, komanso kuyandikira kwa mapampu kapena ma valve ziyenera kuganiziridwa:
- Chiyanjokuyimika moyimirirandi kuyenda mmwamba kuti muchepetse kusonkhana kwa thovu la mpweya ndi matope pa chinthu chozindikira.
- Sungani mapaipi angapo pakati pa mita ndi magwero akuluakulu a kugwedezeka (mapampu, ma valve) kuti mupewe zolakwika pakuwerenga chifukwa cha kusokonezeka kwa kayendedwe ka madzi.
- Gwiritsani ntchitokukonza kayendedwe ka madzi(zowongolera kapena zigawo zotonthoza) kuti muyesere muyeso wa kuchulukana kwa zinthu m'malo okhazikika a laminar.
Mavuto Ofala ndi Njira Zabwino Kwambiri Zolumikizirana ndi Masensa Odalirika
Machitidwe a CMP slurry amabweretsa mavuto angapo ophatikizana:
- Kulowetsa Mpweya ndi Ma Bubbles:Ma ultrasound slurry density mita amatha kusokoneza density ngati pali ma microbubbles. Pewani kuyika masensa pafupi ndi malo omwe mpweya umalowa kapena kusintha kwadzidzidzi kwa kayendedwe ka madzi, komwe kumachitika nthawi zambiri pafupi ndi malo otulutsira madzi kapena matanki osakaniza.
- Kutulutsa dothi:Mu mizere yopingasa, masensa amatha kukumana ndi zinthu zolimba zokhazikika, makamaka ndi CeO₂ polishing slurry. Kuyika molunjika kapena kuyiyika pamwamba pa malo okhazikika kumalimbikitsidwa kuti pakhale kuwongolera kolondola kwa slurry.
- Kuchotsa Zosensa:Ma CMP slurry ali ndi zinthu zowononga komanso mankhwala zomwe zingayambitse kuipitsidwa kapena kuphimba kwa sensa. Zida za Lonnmeter zomwe zili mkati mwake zimapangidwa kuti zichepetse izi, koma kuyang'anitsitsa ndi kuyeretsa nthawi zonse kumakhala kofunikira kuti zikhale zodalirika.
- Kugwedezeka kwa Makina:Kuyika pafupi ndi zida zogwirira ntchito kungayambitse phokoso mkati mwa sensa, zomwe zimapangitsa kuti muyeso ukhale wochepa. Sankhani malo oyikapo omwe ali ndi kugwedezeka kochepa.
Kuti mupeze zotsatira zabwino kwambiri zogwirizanitsa:
- Gwiritsani ntchito magawo oyenda a laminar poyika.
- Onetsetsani kuti mzere wolunjika uli wolunjika ngati n'kotheka.
- Perekani mwayi wosavuta wokonza ndi kuwerengera nthawi ndi nthawi.
- Tengani masensa kuti asagwedezeke ndi kusokonezeka kwa kayendedwe ka madzi.
CMP
*
Njira Zowongolera Kukhazikika kwa Madzi Oundana
Kuwongolera bwino kuchuluka kwa matope mu njira yokonzera makina a mankhwala ndikofunikira kuti pakhale kuchuluka koyenera kochotsa zinthu, kuchepetsa zolakwika pamwamba pa wafer, ndikuwonetsetsa kuti ma wafer a semiconductor ndi ofanana. Njira ndi ukadaulo zingapo zimagwiritsidwa ntchito kuti zikwaniritse izi molondola, kuthandizira magwiridwe antchito osavuta komanso kupanga bwino zida.
Njira ndi Zida Zosungira Kuchuluka kwa Madzi Ochokera M'madzi
Kulamulira kuchuluka kwa matope kumayamba ndi kuyang'anira nthawi yeniyeni tinthu tating'onoting'ono tomwe timakhala ndi mitundu ya mankhwala mu matope opukuta. Pa matope opukuta a Cerium oxide (CeO₂) ndi njira zina za CMP, njira zolunjika monga kuyeza kuchuluka kwa matope mkati ndizofunikira kwambiri. Ma ultrasound slurry density mita, monga omwe amapangidwa ndi Lonnmeter, amapereka miyeso yopitilira ya matope oundana, omwe amagwirizana kwambiri ndi kuchuluka konse kolimba komanso kufanana.
Njira zina zowonjezera zimaphatikizapo kusanthula kwa turbidity—kumene masensa owonera amazindikira kufalikira kuchokera ku tinthu tating'onoting'ono tomwe timapachikidwa—ndi njira zowonera monga UV-Vis kapena Near-Infrared (NIR) spectroscopy kuti ayese ma reactants ofunikira mumtsinje wa slurry. Kuyeza kumeneku kumapanga msana wa machitidwe owongolera njira za CMP, zomwe zimathandiza kusintha kwamoyo kuti kusunge mawindo owunikira ndikuchepetsa kusiyana kwa batch-to-batch.
Masensa amagetsi amagwiritsidwa ntchito popanga ma ayoni achitsulo okhala ndi ma ayoni ambiri, kupereka chidziwitso chofulumira cha kuyankha pa kuchuluka kwa ma ayoni enaake ndikuthandizira kukonza bwino ntchito zamafakitale apamwamba a semiconductor.
Ma Feedback Loops ndi Automation for Closed-Loop Control
Zipangizo zamakono zopangira ma chemical-mechanical planarization zimagwiritsa ntchito njira zowongolera zotsekedwa zomwe zimalumikiza inline metrology ndi njira zodziperekera zokha. Deta yochokera ku slurry density meter ndi masensa ena ofanana imaperekedwa mwachindunji kwa ma programmable logic controllers (PLCs) kapena ma distributed control systems (DCS). Makinawa amadziyendetsa okha ma valve kuti awonjezere madzi odzola, kuyika slurry muyeso wokhazikika, komanso ngakhale kulowetsa stabilizer, kuonetsetsa kuti njirayi ikupitirirabe mkati mwa zofunikira nthawi zonse.
Kapangidwe ka mayankho aka kamalola kukonza kosalekeza kwa zolakwika zilizonse zomwe zapezeka ndi masensa a nthawi yeniyeni, kupewa kusungunuka kwambiri, kusunga kuchuluka kwa abrasive, ndikuchepetsa kugwiritsa ntchito mankhwala ochulukirapo. Mwachitsanzo, mu chida cha CMP chapamwamba cha ma wafer node apamwamba, mita ya inline ultrasonic slurry density imazindikira kuchepa kwa kuchuluka kwa abrasive ndipo nthawi yomweyo imasonyeza dongosolo la dosing kuti liwonjezere kulowetsedwa kwa slurry, mpaka kuchulukako kubwerere pamalo ake. Mosiyana ndi zimenezi, ngati kuchuluka koyezedwako kupitirira zomwe zafotokozedwa, njira yowongolera imayambitsa kuwonjezera madzi odzola kuti abwezeretse kuchuluka koyenera.
Udindo wa Kuyeza Kuchulukana kwa Madzi Posintha Kuchuluka kwa Zodzoladzola ndi Madzi Owonjezera Madzi
Kuyeza kuchuluka kwa madzi ndi njira yofunika kwambiri yowongolera kuchuluka kwa madzi. Kuchuluka kwa madzi komwe kumaperekedwa ndi zida monga Lonnmeter's inline density meters kumapereka chidziwitso chapadera pa magawo awiri ofunikira ogwirira ntchito: kuchuluka kwa madzi opangidwa ndi madzi ndi kuchuluka kwa madzi opangidwa ndi ...
Mwa kupeza mita yoyezera kuchuluka kwa madzi pamalo oyenera—monga momwe CMP isanalowetsedwere kapena pambuyo pa chosakanizira cha malo ogwiritsira ntchito—chidziwitso cha nthawi yeniyeni chimalola makina odziyimira okha kusintha kuchuluka kwa madzi opangidwa, motero kuchepetsa kuchuluka kwa madzi opangidwawo malinga ndi zomwe mukufuna. Nthawi yomweyo, makinawa amatha kusintha kuchuluka kwa madzi opangidwa kuti asunge kuchuluka kwa mankhwala ochulukirapo komanso ochulukirapo, poganizira momwe zida zimagwiritsidwira ntchito, kukalamba, komanso kutayika komwe kumachitika chifukwa cha njira.
Mwachitsanzo, panthawi yowonjezereka yokonzekera mapangidwe a 3D NAND, kuyang'anira kosalekeza kwa kuchuluka kwa madzi kumazindikira kusonkhana kwa matope kapena kusintha kwa kayendedwe ka madzi, zomwe zimapangitsa kuti madzi odzola kapena kugwedezeka kuchuluke, monga momwe zimafunikira kuti njira ikhale yokhazikika. Kuzungulira kolamulira kumeneku ndikofunikira kwambiri pakusunga zolinga zolimba za wafer-to-wafer ndi mkati mwa wafer, makamaka pamene kukula kwa chipangizo ndi mawindo a njira zimachepa.
Mwachidule, njira zowongolera kuchuluka kwa slurry mu CMP zimadalira kuphatikiza kwa miyeso yapamwamba yolumikizidwa ndi mayankho otsekedwa okha. Ma slurry density meter, makamaka ma ultrasonic units monga ochokera ku Lonnmeter, amachita gawo lalikulu popereka deta yapamwamba komanso yanthawi yake yofunikira pakuwongolera njira molimbika mu njira zofunika kwambiri zopangira semiconductor. Zida ndi njirazi zimachepetsa kusinthasintha, zimathandizira kukhazikika mwa kukonza bwino kugwiritsa ntchito mankhwala, ndikupangitsa kuti kulondola kofunikira paukadaulo wamakono wa node.
Buku Lotsogolera Kusankha Mita Yoyezera Kuchuluka kwa Madzi a ...
Kusankha mita yoyezera kuchuluka kwa slurry ya chemical mechanical planarization (CMP) mumakampani opanga ma semiconductor kumafuna chisamaliro chapadera pa zofunikira zosiyanasiyana zaukadaulo. Zofunikira pakugwirira ntchito ndi kugwiritsa ntchito zimaphatikizapo kukhudzidwa, kulondola, kuyanjana ndi mankhwala a aggressive slurry chemistry, komanso kusakanikirana kosavuta mkati mwa makina operekera slurry a CMP ndi kukhazikitsa zida.
Zofunikira pa Kuzindikira ndi Kulondola
Kuwongolera njira ya CMP kumadalira kusintha pang'ono kwa kapangidwe ka slurry. Chiyeso cha kuchuluka kwa madzi chiyenera kuzindikira kusintha kochepa kwa 0.001 g/cm³ kapena kupitirira apo. Mlingo uwu wa kukhudzidwa ndi wofunikira pozindikira ngakhale kusintha pang'ono kwambiri kwa zinthu zokwawa—monga zomwe zimapezeka mu CeO₂ polishing slurry kapena slurry zochokera ku silica—chifukwa izi zimakhudza kuchuluka kwa zinthu zochotsedwa, kulinganika kwa wafer, ndi zolakwika. Mtundu wovomerezeka wolondola wa semiconductor slurry density meters ndi ±0.001–0.002 g/cm³.
Kugwirizana ndi Aggressive Slurries
Ma slurry omwe amagwiritsidwa ntchito mu CMP akhoza kukhala ndi tinthu tating'onoting'ono tomwe timakhala ngati cerium oxide (CeO₂), alumina, kapena silica, tomwe timayikidwa m'malo ogwiritsira ntchito mankhwala. Choyezera kuchuluka kwa madzi chiyenera kupirira kukhudzidwa kwa nthawi yayitali ndi kuvulala kwakuthupi komanso malo owononga popanda kutuluka mu calibration kapena kuvutika ndi kuipitsidwa. Zipangizo zomwe zimagwiritsidwa ntchito m'zigawo zonyowa ziyenera kukhala zopanda madzi ku mankhwala onse ogwiritsidwa ntchito nthawi zambiri.
Kusavuta Kuphatikizana
Miyeso ya slurry density metering iyenera kugwirizana bwino ndi zida za CMP zomwe zilipo.
- Kuchepetsa mphamvu ya mpweya komanso kutsika kwa mphamvu ya mpweya kuti musakhudze kufalikira kwa madzi.
- Chithandizo cha maulumikizidwe okhazikika a mafakitale kuti akhazikitsidwe mwachangu komanso mosamala.
- Kugwirizana kwa zotuluka (monga, zizindikiro za analog/dijito) kuti zigwirizane nthawi yeniyeni ndi machitidwe owongolera kuchuluka kwa slurry, koma popanda kupereka machitidwe amenewo okha.
Kuyerekeza kwa Maukadaulo Otsogola a Sensor
Kulamulira kuchulukana kwa slurries zopukutira kumayendetsedwa makamaka kudzera m'magulu awiri a masensa: mita zochokera ku densitometry ndi mita zochokera ku refractometry. Chilichonse chimabweretsa mphamvu zogwirizana ndi ntchito zamakampani a semiconductor.
Ma Meter Ochokera ku Densitometry (monga, Ultrasonic Slurry Density Meter)
- Amagwiritsa ntchito liwiro la kufalikira kwa mawu kudzera mu slurry, lomwe limagwirizana mwachindunji ndi kuchulukana.
- Amapereka mzere wolunjika kwambiri mu muyeso wa kuchulukana pamitundu yosiyanasiyana ya slurry ndi mitundu yonyamulika.
- Yoyenera kwambiri pa slurry zopukutira mwamphamvu, kuphatikizapo CeO₂ ndi silika formulations, chifukwa zinthu zowunikira zimatha kupangidwa kuti zisachoke ku mankhwala.
- Kuzindikira ndi kulondola kwanthawi zonse kumakwaniritsa zofunikira za sub-0.001 g/cm³.
- Kuyika nthawi zambiri kumakhala mkati mwa mzere, zomwe zimapangitsa kuti kuyeza nthawi zonse nthawi yeniyeni panthawi yogwiritsira ntchito zida zopangira makina.
Mamita Ochokera ku Refractometry
- Imayesa chizindikiro cha refractive kuti izindikire kuchuluka kwa slurry.
- Yothandiza pozindikira kusintha kochepa kwa kapangidwe ka slurry chifukwa cha kukhudzidwa kwambiri ndi kusintha kwa kuchuluka kwa madzi; imatha kuthetsa kusintha kwa <0.1% kwa unyinji wa madzi.
- Komabe, refractive index imakhudzidwa ndi zinthu zachilengedwe monga kutentha, zomwe zimafuna kuti pakhale kulinganiza bwino komanso kubwezera kutentha.
- Zingakhale ndi zotsatira zochepa pa mankhwala, makamaka m'malo ouma kwambiri kapena osawoneka bwino.
Kuyerekeza Kukula kwa Tinthu monga Chowonjezera
- Kuwerengera kwa kuchuluka kwa tinthu tating'onoting'ono kumatha kusokonekera chifukwa cha kusintha kwa kugawa kwa tinthu tating'onoting'ono kapena kusonkhana kwa tinthu tating'onoting'ono.
- Kugwirizana ndi kusanthula kwa kukula kwa tinthu tating'onoting'ono nthawi ndi nthawi (monga kufalikira kwa kuwala kwamphamvu kapena maikulosikopu ya ma elekitironi) kumalimbikitsidwa ndi njira zabwino kwambiri zamakampani, kuonetsetsa kuti kusintha kwa kuchuluka kwa tinthu sikungochitika chifukwa cha kusonkhana kwa tinthu tating'onoting'ono kokha.
Zofunika Kuganizira pa Mamita Okhala ndi Density a Lonnmeter Inline
- Lonnmeter imagwira ntchito popanga zoyezera kuchuluka kwa zinthu ndi kukhuthala kwa zinthu, popanda kupereka mapulogalamu othandizira kapena kuphatikiza makina.
- Mamita a Lonnmeter amatha kusankhidwa kuti azitha kupirira slurry ya CMP yolimba komanso yogwira ntchito ndi mankhwala ndipo amapangidwira kuyika mwachindunji mu zida zogwirira ntchito za semiconductor, zomwe zimagwirizana ndi zosowa za muyeso wa slurry density nthawi yeniyeni.
Mukayang'ana njira zina, yang'anani kwambiri pa mfundo zazikulu zogwiritsira ntchito: onetsetsani kuti mita yoyezera kuchuluka kwa madzi ikukwaniritsa kukhudzika ndi kulondola kofunikira, yapangidwa kuchokera ku zipangizo zogwirizana ndi kapangidwe kake ka madzi, imapirira kugwira ntchito kosalekeza, ndipo imagwirizana bwino ndi mizere yoperekera madzi oyeretsera mu ndondomeko ya CMP. Kwa makampani opanga ma semiconductor, kuyeza kolondola kwa madzi oyeretsera madzi kumadalira kufanana kwa wafer, kuchuluka, ndi kuchuluka kwa madzi oyeretsera.
Zotsatira za Kulamulira Kuchulukana kwa Madzi Ochokera M'madzi ...
Kuwongolera bwino kuchuluka kwa slurry ndikofunikira kwambiri pakupanga makina opangira mankhwala. Ngati kuchuluka kwa slurry kumakhala kofanana, kuchuluka kwa tinthu tating'onoting'ono tomwe timapezeka panthawi yopukutira kumakhalabe kokhazikika. Izi zimakhudza mwachindunji kuchuluka kwa zinthu zomwe zimachotsedwa (MRR) ndi mtundu wa pamwamba pa wafer.
Kuchepetsa Ziphuphu Zapamwamba za Wafer ndi WIWNU Yokonzedwa
Kusunga kuchuluka kwa matope abwino kwambiri kwatsimikiziridwa kuti kumachepetsa zolakwika pamwamba pa wafer monga kukwawa pang'ono, kuyika mbale, kukokoloka, ndi kuipitsidwa kwa tinthu tating'onoting'ono. Kafukufuku wochokera mu 2024 akuwonetsa kuti kuchuluka kwa kachulukidwe kolamulidwa, komwe nthawi zambiri kumakhala pakati pa 1 wt% mpaka 5 wt% ya mapangidwe opangidwa ndi silica a colloidal, kumapereka mgwirizano wabwino pakati pa kuchotsa bwino komanso kuchepetsa zolakwika. Kuchuluka kwambiri kumawonjezera kugundana kwa abrasive, zomwe zimapangitsa kuti chiwerengero cha zolakwika chiwonjezeke kawiri kapena katatu pa sentimita imodzi, monga momwe zatsimikiziridwa ndi atomic force microscopy ndi ellipsometry analysiss. Kuwongolera kachulukidwe kabwino kumathandizanso kuti mkati mwa wafer non-uniformity (WIWNU), kuonetsetsa kuti zinthuzo zachotsedwa mofanana kudutsa wafer, zomwe ndizofunikira pazida zapamwamba za node semiconductor. Kuchulukana kokhazikika kumathandiza kupewa maulendo omwe angawononge zolinga za makulidwe a filimu kapena flatness.
Kukulitsa Moyo wa Slurry ndi Kuchepetsa Mtengo wa Zogwiritsidwa Ntchito
Njira zowongolera kuchuluka kwa matope—kuphatikizapo kuyang'anira nthawi yeniyeni pogwiritsa ntchito ma ultrasound slurry density meters—zimawonjezera nthawi yothandiza ya CMP polishing slurry. Mwa kupewa kuchuluka kwa mankhwala kapena kusungunuka kwambiri, zida zopangira makina opangira mankhwala zimapangitsa kuti zinthu zogwiritsidwa ntchito zizigwiritsidwa ntchito bwino. Njira imeneyi imachepetsa kuchuluka kwa matope omwe amasinthidwa ndi njira zobwezeretsanso, kumachepetsa ndalama zonse. Mwachitsanzo, mu CeO₂ polishing slurry applications, kukonza mosamala kuchuluka kwa matope kumathandiza kukonzanso magulu a matope ndikuchepetsa kuchuluka kwa zinyalala popanda kuwononga magwiridwe antchito. Kuwongolera bwino kuchuluka kwa matope kumathandiza mainjiniya kuti abwezeretse ndikugwiritsanso ntchito matope opukuta omwe ali mkati mwa malire ovomerezeka a magwiridwe antchito, zomwe zimapangitsa kuti ndalama zisungidwe.
Kubwerezabwereza Kowonjezereka ndi Kulamulira Njira Zopangira Ma Node Otsogola
Kugwiritsa ntchito makampani amakono a semiconductor kumafuna kubwerezabwereza kwakukulu mu gawo la kukonza mankhwala ndi makina. Pakupanga ma node apamwamba, ngakhale kusinthasintha pang'ono kwa kuchuluka kwa slurry kungayambitse kusinthasintha kosavomerezeka kwa zotsatira za wafer. Kudzipangira nokha ndi kuphatikiza kwa inline ultrasonic slurry density meters—monga zomwe zimapangidwa ndi Lonnmeter—kumapangitsa kuti nthawi zonse pakhale mayankho okhazikika komanso enieni kuti azitha kuwongolera njira. Zipangizozi zimapereka miyeso yolondola m'malo ovuta a mankhwala omwe ali ngati CMP, kuthandizira machitidwe otsekedwa omwe amayankha nthawi yomweyo kutembenuka. Kuyeza kodalirika kwa kuchuluka kumatanthauza kufanana kwakukulu kuchokera ku wafer kupita ku wafer ndi kuwongolera kolimba pa MRR, komwe ndikofunikira kwambiri pakupanga ma semiconductor a sub-7nm. Kukhazikitsa zida moyenera—kuyika bwino mzere wotumizira slurry—ndi kukonza nthawi zonse ndikofunikira kuti zitsimikizire kuti ma mita amagwira ntchito moyenera ndikupereka deta yofunika kwambiri kuti njira ikhale yokhazikika.
Kusunga kuchulukana kokwanira kwa slurry ndikofunikira kwambiri pakukulitsa phindu la zinthu, kuchepetsa zolakwika, ndikuwonetsetsa kuti kupanga zinthu zotsika mtengo mu njira za CMP kukuyenda bwino.
Mafunso Ofunsidwa Kawirikawiri (Mafunso Ofunsidwa Kawirikawiri)
Kodi ntchito ya slurry density meter mu chemical mechanical planarization process ndi yotani?
Chiyeso cha kuchuluka kwa slurry chimagwira ntchito yofunika kwambiri pakupanga mapangidwe a mankhwala mwa kuyeza nthawi zonse kuchuluka ndi kuchuluka kwa slurry yopukuta. Ntchito yake yayikulu ndikupereka deta yeniyeni pamlingo wokulirapo ndi wa mankhwala mu slurry, kuonetsetsa kuti zonse zili mkati mwa malire oyenera a slurry planarization yoyenera. Kuwongolera kumeneku nthawi yeniyeni kumaletsa zolakwika monga kukanda kapena kuchotsa zinthu zosafanana, zomwe zimachitika nthawi zambiri ndi zosakaniza za slurry zosasungunuka kwambiri kapena zosasungunuka bwino. Kuchuluka kwa slurry kosalekeza kumathandiza kusunga kubwerezabwereza pakupanga, kuchepetsa kusinthasintha kwa wafer kupita ku wafer, ndikuthandizira kukonza njira poyambitsa zochita zowongolera ngati zolakwika zapezeka. Mu kupanga kwapamwamba kwa semiconductor ndi ntchito zodalirika kwambiri, kuyang'anira kosalekeza kumachepetsanso zinyalala ndikuthandizira njira zolimba zotsimikizira khalidwe.
Nchifukwa chiyani CeO₂ polishing slurry imakondedwa pa njira zina zokonzera mapulani mumakampani opanga ma semiconductor?
Kupukuta kwa Cerium oxide (CeO₂) kumasankhidwa pa njira zinazake zokonzera ma semiconductor chifukwa cha kusankha kwake kwapadera komanso kugwirizana kwa mankhwala, makamaka mafilimu agalasi ndi oxide. Tinthu take tomwe timakhala tofanana timapangitsa kuti ma planarization akhale abwino kwambiri komanso opanda vuto komanso kukanda pang'ono pamwamba. Makhalidwe a CeO₂ amalola kuti ma dranarization okhazikika komanso obwerezabwereza achotsedwe, zomwe ndizofunikira kwambiri pa ntchito zapamwamba monga photonics ndi ma circuits ophatikizika kwambiri. Kuphatikiza apo, CeO₂ slurry imalimbana ndi kusakanikirana, kusunga kuyimitsidwa kosalekeza ngakhale panthawi yayitali ya CMP.
Kodi choyezera kuchuluka kwa slurry chomwe chimagwiritsidwa ntchito ndi ultrasound chimagwira ntchito bwanji poyerekeza ndi mitundu ina yoyezera?
Choyezera kuchuluka kwa madzi a slurry chimagwira ntchito potumiza mafunde a phokoso kudzera mu slurry ndikuyesa liwiro ndi kuchepa kwa mafunde awa. Kuchuluka kwa madzi a slurry kumakhudza mwachindunji momwe mafunde amayendera mwachangu komanso momwe mphamvu zawo zimachepera. Njira yoyezera iyi siyosokoneza ndipo imapereka deta yeniyeni ya madzi a slurry popanda kufunikira kupatula kapena kusokoneza kayendedwe ka njira. Njira za ultrasonic zimawonetsa kusazindikira pang'ono ku zinthu monga liwiro la madzi kapena kukula kwa tinthu poyerekeza ndi makina (ochokera ku float) kapena machitidwe oyezera kuchuluka kwa madzi a gravimetric. Mu chemical mechanical planarization, izi zimasandulika muyeso wodalirika, wolimba ngakhale mu slurry wolemera kwambiri.
Kodi mita zoyezera kuchuluka kwa madzi ziyenera kuyikidwa kuti mu dongosolo la CMP?
Malo abwino kwambiri oikira mita yoyezera kuchuluka kwa slurry mu zida zopangira makina a mankhwala ndi awa:
- Thanki yobwezeretsanso madzi: kuyang'anira nthawi zonse kuchuluka kwa madzi oundana musanagawire madzi.
- Musanatumize ku polishing pad pamalo ogwirira ntchito: kuonetsetsa kuti slurry yomwe yaperekedwa ikukwaniritsa zofunikira za kuchuluka kwa dothi.
- Pambuyo posakaniza matope: kuonetsetsa kuti magulu atsopano okonzedwa akutsatira njira zofunika musanalowe mu njira yopangira.
Malo ofunikira awa amalola kuzindikira mwachangu ndi kukonza kusintha kulikonse kwa kuchuluka kwa matope, kupewa kusokonekera kwa khalidwe la wafer ndi kusokonezeka kwa njira. Kuyika kwake kumayendetsedwa ndi kayendedwe ka matope, kachitidwe ka kusakaniza ka nthawi zonse, komanso kufunikira kwa mayankho nthawi yomweyo pafupi ndi planarization pad.
Kodi kuwongolera molondola kuchuluka kwa slurry kumathandizira bwanji magwiridwe antchito a CMP?
Kuwongolera bwino kuchuluka kwa slurry kumawongolera njira yokonzera mankhwala mwa kuonetsetsa kuti kuchuluka kwa kuchotsa kuli kofanana, kuchepetsa kusiyana kwa kukana kwa pepala, ndikuchepetsa kuchuluka kwa zolakwika pamwamba. Kuchulukana kokhazikika kwa slurry kumawonjezera moyo wa pad yopukuta ndi wafer mwa kupewa kugwiritsa ntchito mopitirira muyeso kapena kusagwiritsidwa ntchito mokwanira. Kumachepetsanso ndalama zogwirira ntchito mwa kukonza bwino kugwiritsa ntchito slurry, kuchepetsa kukonzanso, komanso kuthandizira zokolola zambiri za zida za semiconductor. Makamaka popanga zida zapamwamba komanso kupanga zida za quantum, kuwongolera kokhwima kwa slurry kumathandizira kusalala kobwerezabwereza, magwiridwe antchito amagetsi nthawi zonse, komanso kuchepa kwa kutuluka kwa madzi m'mapangidwe a zida.
Nthawi yotumizira: Disembala-09-2025
