Kev sib xyaw ua ke ntawm tshuaj lom neeg thiab tshuab(CMP) yog ib qho txheej txheem tseem ceeb hauv kev tsim khoom semiconductor siab heev. Nws muab cov atomic-level flatness hla cov wafer nto, ua rau muaj ntau txheej architectures, ntim khoom nruj dua, thiab cov txiaj ntsig txhim khu kev qha dua. CMP sib xyaw ua ke cov tshuaj lom neeg thiab cov txheej txheem ua haujlwm tib lub sijhawm - siv lub ncoo tig thiab cov tshuaj txhuam tshwj xeeb - kom tshem tawm cov yeeb yaj kiab ntau dhau thiab cov qhov chaw du, qhov tseem ceeb rau cov yam ntxwv patterning thiab kev sib phim hauv cov circuits sib xyaw.
Qhov zoo ntawm cov wafer tom qab CMP nyob ntawm kev tswj hwm zoo ntawm cov khoom sib xyaw thiab cov yam ntxwv ntawm cov slurry polishing. Cov slurry muaj cov khoom sib xyaw, xws li cerium oxide (CeO₂), uas tau muab tso rau hauv cov tshuaj sib xyaw ua ke uas tsim los ua kom zoo dua ob qho tib si kev sib txhuam thiab kev ua haujlwm ntawm cov tshuaj. Piv txwv li, cerium oxide muaj qhov nyuaj thiab cov tshuaj lom neeg zoo tshaj plaws rau cov yeeb yaj kiab silicon, ua rau nws yog cov khoom siv xaiv hauv ntau daim ntawv thov CMP. Kev ua haujlwm zoo ntawm CMP tsis yog tsuas yog txiav txim siab los ntawm cov khoom sib xyaw xwb tab sis kuj los ntawm kev tswj hwm qhov concentration ntawm slurry, pH, thiab qhov ceev.
Kev Npaj Tshuaj Lom Zem
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Cov Ntsiab Lus ntawm Kev Siv Cov Khoom Siv Polishing hauv Kev Tsim Khoom Semiconductor
Cov slurries polishing yog qhov tseem ceeb rau cov txheej txheem tshuaj lom neeg planarization. Lawv yog cov khoom sib xyaw ua ke uas tau tsim los ua kom tiav ob qho tib si kev puas tsuaj thiab kev hloov kho tshuaj lom neeg ntawm cov nplaim wafer. Lub luag haujlwm tseem ceeb ntawm CMP slurries suav nrog kev tshem tawm cov khoom siv zoo, kev tswj hwm planarity, kev sib xws ntawm cov cheeb tsam wafer loj, thiab kev txo qhov tsis zoo.
Lub Luag Haujlwm thiab Cov Khoom Siv ntawm Polishing Slurries
Ib qho CMP slurry feem ntau muaj cov khoom sib xyaw uas dai rau hauv cov kua matrix, ntxiv los ntawm cov tshuaj ntxiv thiab cov stabilizers. Txhua yam khoom ua lub luag haujlwm sib txawv:
- Cov khoom siv txhuam:Cov khoom me me, khov no—feem ntau yog silica (SiO₂) lossis cerium oxide (CeO₂) hauv cov ntawv thov semiconductor—ua lub luag haujlwm tshem tawm cov khoom siv. Lawv qhov kev sib sau ua ke thiab qhov loj ntawm cov khoom me me tswj ob qho tib si kev tshem tawm thiab qhov zoo ntawm qhov chaw. Cov ntsiab lus abrasive feem ntau yog li ntawm 1% txog 5% los ntawm qhov hnyav, nrog rau cov khoom me me ntawm 20 nm thiab 300 nm, teev tseg kom nruj kom tsis txhob khawb wafer ntau dhau.
- Cov Tshuaj Ntxiv:Cov neeg sawv cev no tsim kom muaj ib puag ncig tshuaj lom neeg rau kev ua kom zoo. Cov tshuaj oxidizers (piv txwv li, hydrogen peroxide) pab txhawb kev tsim cov txheej saum npoo uas yooj yim dua rau kev rhuav tshem. Cov neeg sawv cev sib xyaw lossis chelating (xws li ammonium persulfate lossis citric acid) khi cov hlau ions, txhim kho kev tshem tawm thiab tiv thaiv kev tsim cov qhov tsis zoo. Cov tshuaj inhibitors tau qhia los tiv thaiv kev khawb tsis xav tau ntawm cov txheej wafer sib ze lossis hauv qab, txhim kho kev xaiv.
- Cov Khoom Ruaj Kho:Cov tshuaj surfactants thiab pH buffers tswj cov slurry stability thiab kev sib kis sib npaug. Surfactants tiv thaiv kev sib sau ua ke ntawm cov abrasive, ua kom muaj kev tshem tawm zoo ib yam. pH buffers ua rau muaj kev sib xws ntawm cov tshuaj lom neeg thiab txo qhov yuav muaj cov khoom me me sib sau ua ke lossis xeb.
Cov qauv thiab kev sib xyaw ntawm txhua yam khoom yog tsim los rau cov khoom siv wafer tshwj xeeb, cov qauv ntaus ntawv, thiab cov kauj ruam txheej txheem koom nrog hauv cov txheej txheem tshuaj lom neeg planarization.
Cov Slurries Feem Ntau: Silica (SiO₂) vs Cerium Oxide (CeO₂)
Cov tshuaj txhuam hniav silica (SiO₂)tswj cov kauj ruam oxide planarization, xws li interlayer dielectric (ILD) thiab shallow trench isolation (STI) polishing. Lawv siv colloidal lossis fumed silica ua abrasives, feem ntau nyob rau hauv ib puag ncig yooj yim (pH ~ 10), thiab qee zaum ntxiv nrog cov surfactants me me thiab cov tshuaj tiv thaiv corrosion kom txo qhov khawb tsis zoo thiab ua kom zoo dua cov nqi tshem tawm. Cov khoom silica muaj nqis rau lawv qhov loj me sib xws thiab qhov nyuaj tsawg, muab cov khoom siv tshem tawm zoo, sib xws rau cov txheej mos.
Cov tshuaj txhuam hniav Cerium oxide (CeO₂)raug xaiv rau cov ntawv thov nyuaj uas xav tau kev xaiv siab thiab kev ua haujlwm raug, xws li kev txhuam cov iav substrate kawg, kev npaj cov substrate siab heev, thiab qee cov txheej oxide hauv cov khoom siv semiconductor. CeO₂ abrasives qhia txog kev ua haujlwm tshwj xeeb, tshwj xeeb tshaj yog nrog cov nplaim silicon dioxide, ua rau ob qho tib si tshuaj lom neeg thiab cov txheej txheem tshem tawm. Tus cwj pwm ob npaug no ua rau muaj kev npaj siab dua ntawm qib qis dua, ua rau CeO₂ slurries zoo dua rau iav, hard disk substrates, lossis cov khoom siv logic siab heev.
Lub Hom Phiaj Ua Haujlwm ntawm Cov Khoom Siv Abrasives, Additives, thiab Stabilizers
- Cov khoom siv txhuamUa kom tiav qhov kev txhuam tshuab. Lawv qhov loj me, cov duab, thiab kev sib xyaw ua rau muaj kev tshem tawm sai thiab qhov ua tiav ntawm qhov chaw. Piv txwv li, cov khoom siv txhuam silica 50 nm sib xws ua kom cov txheej oxide mos mos thiab sib npaug.
- Cov Tshuaj Ntxiv: Pab kom muaj kev tshem tawm xaiv los ntawm kev pab txhawb kev oxidation ntawm qhov chaw thiab kev yaj. Hauv tooj liab CMP, glycine (ua tus neeg sawv cev rau kev sib xyaw) thiab hydrogen peroxide (ua tus neeg sawv cev oxidizing) ua haujlwm ua ke, thaum BTA ua haujlwm ua tus inhibitor tiv thaiv cov yam ntxwv tooj liab.
- Cov khoom ruaj khov: Khaws cov slurry sib npaug zos dhau sijhawm. Cov surfactants tiv thaiv kev tso dej thiab kev sib sau ua ke, ua kom ntseeg tau tias cov khoom abrasive tau sib kis tas li thiab muaj rau cov txheej txheem.
Cov Khoom Tshwj Xeeb thiab Cov Xwm Txheej Siv: CeO₂ thiab SiO₂ Slurries
CeO₂ polishing slurrymuaj kev xaiv siab ntawm iav thiab silicon oxide vim nws cov tshuaj lom neeg ua haujlwm. Nws yog qhov tshwj xeeb tshaj yog rau kev npaj cov khoom tawv, brittle lossis cov khoom sib xyaw oxide uas qhov kev xaiv khoom siab yog qhov tseem ceeb. Qhov no ua rau CeO₂ slurries tus qauv hauv kev npaj cov khoom siv siab heev, kev ua tiav iav meej, thiab cov kauj ruam tshwj xeeb kev cais tawm qhov tob (STI) CMP hauv kev lag luam semiconductor.
SiO₂ cov tshuaj txhuam hniavmuab kev sib xyaw ua ke ntawm kev tshem tawm cov khoom siv kho tshuab thiab tshuaj lom neeg. Nws yog siv dav rau cov oxide loj thiab cov txheej txheem dielectric planarization, qhov twg xav tau kev xa khoom ntau thiab qhov tsis zoo tsawg kawg nkaus. Qhov sib npaug, tswj tau qhov loj me ntawm silica kuj txwv tsis pub khawb thiab ua kom zoo dua qhov zoo ntawm qhov chaw kawg.
Qhov Tseem Ceeb ntawm Qhov Loj ntawm Cov Khoom Me Me thiab Kev Sib Txawv ntawm Cov Khoom
Qhov loj ntawm cov khoom me me thiab kev sib kis sib npaug yog qhov tseem ceeb rau kev ua haujlwm ntawm cov slurry. Cov khoom me me uas sib npaug, nanometer-scale abrasive particles lav qhov kev tshem tawm cov khoom siv sib xws thiab qhov chaw wafer tsis muaj qhov tsis zoo. Kev sib sau ua ke ua rau khawb lossis tsis tuaj yeem ua kom tiav polishing, thaum qhov kev faib tawm dav dav ua rau tsis sib npaug planarization thiab nce qhov tsis zoo.
Kev tswj cov slurry concentration zoo—saib xyuas los ntawm cov thev naus laus zis xws li lub ntsuas qhov ceev slurry lossis cov cuab yeej ntsuas qhov ceev slurry ultrasonic—ua kom muaj kev thauj khoom abrasive tas li thiab cov txiaj ntsig ntawm cov txheej txheem kwv yees tau, cuam tshuam ncaj qha rau cov txiaj ntsig thiab kev ua haujlwm ntawm lub cuab yeej. Kev ua tiav kev tswj qhov ceev kom raug thiab kev sib kis sib npaug yog cov kev cai tseem ceeb rau kev teeb tsa cov khoom siv tshuaj lom neeg thiab kev ua kom zoo dua qub.
Hauv kev xaus lus, kev tsim cov slurries polishing - tshwj xeeb tshaj yog kev xaiv thiab kev tswj hwm ntawm hom abrasive, qhov loj me ntawm cov khoom me me, thiab cov txheej txheem stabilization - txhawb nqa kev ntseeg tau thiab kev ua haujlwm ntawm cov txheej txheem tshuaj lom neeg planarization hauv kev siv semiconductor kev lag luam.
Qhov Tseem Ceeb ntawm Kev Ntsuas Qhov Ceev ntawm Slurry hauv CMP
Hauv cov txheej txheem tshuaj lom neeg planarization, kev ntsuas thiab kev tswj hwm qhov ceev ntawm slurry ncaj qha cuam tshuam rau qhov ua tau zoo thiab zoo ntawm wafer polishing. Slurry density - qhov concentration ntawm cov khoom abrasive hauv polishing slurry - ua haujlwm ua lub hauv paus txheej txheem, ua rau tus nqi polishing, qhov zoo ntawm qhov chaw kawg, thiab tag nrho cov wafer yield.
Kev Sib Raug Zoo Ntawm Slurry Density, Polishing Rate, Surface Quality, thiab Wafer Yield
Qhov kev sib sau ua ke ntawm cov khoom me me hauv CeO₂ polishing slurry lossis lwm cov qauv polishing slurry txiav txim siab sai npaum li cas cov khoom raug tshem tawm ntawm qhov chaw wafer, feem ntau hu ua tus nqi tshem tawm lossis tus nqi tshem tawm cov khoom (MRR). Kev nce ntxiv ntawm cov slurry density feem ntau ua rau muaj ntau tus lej ntawm cov abrasive sib cuag ib cheeb tsam, ua kom nrawm dua polishing. Piv txwv li, kev tshawb fawb tswj hwm xyoo 2024 tau tshaj tawm tias kev nce silica particle concentration txog li 5 wt% hauv colloidal slurry ua rau cov nqi tshem tawm siab tshaj plaws rau 200 hli silicon wafers. Txawm li cas los xij, qhov kev sib raug zoo no tsis yog linear - ib qho taw tes ntawm kev txo qis rov qab muaj. Ntawm cov slurry densities siab dua, cov khoom me me agglomeration ua rau lub tiaj tiaj lossis txawm tias txo qis ntawm kev tshem tawm vim yog kev thauj mus los tsis zoo thiab viscosity nce ntxiv.
Qhov zoo ntawm qhov chaw kuj tseem cuam tshuam rau qhov ceev ntawm cov slurry. Thaum muaj ntau qhov ntau, qhov tsis zoo xws li khawb, cov khib nyiab uas nkag mus rau hauv, thiab cov qhov av yuav tshwm sim ntau dua. Tib txoj kev tshawb fawb no tau pom tias qhov roughness ntawm qhov chaw thiab qhov ceev ntawm cov khawb thaum nce qhov ceev ntawm cov slurry siab tshaj 8-10 wt%. Ntawm qhov tod tes, qhov ceev qis dua yuav txo qhov kev pheej hmoo ntawm qhov tsis zoo tab sis tuaj yeem ua rau qeeb tshem tawm thiab ua rau lub planarity tsis zoo.
Cov wafer yield, qhov sib piv ntawm cov wafers ua tau raws li cov txheej txheem specs tom qab polishing, yog tswj los ntawm cov teebmeem ua ke no. Cov nqi defect siab dua thiab kev tshem tawm tsis sib xws ob qho tib si txo cov yield, qhia txog qhov sib npaug ntawm throughput thiab zoo hauv kev tsim khoom semiconductor niaj hnub no.
Kev Cuam Tshuam ntawm Cov Kev Hloov Pauv Me Me ntawm Slurry rau ntawm Cov Txheej Txheem CMP
Txawm tias qhov sib txawv me me ntawm qhov ceev ntawm cov slurry zoo tshaj plaws - feem pua ntawm ib feem pua - tuaj yeem cuam tshuam rau cov txheej txheem tsim tawm. Yog tias qhov concentration ntawm abrasive drifts saum toj no lub hom phiaj, cov khoom me me yuav tshwm sim, ua rau hnav sai sai ntawm cov ntaub qhwv thiab cov discs kho kom zoo, qhov nrawm dua ntawm qhov chaw khawb, thiab ua rau txhaws lossis lwj ntawm cov khoom siv fluidic hauv cov khoom siv tshuaj lom neeg planarization. Qhov tsis txaus ntawm qhov ceev tuaj yeem tawm cov zaj duab xis seem thiab cov duab tsis sib xws, uas ua rau cov kauj ruam photolithography tom qab thiab txo cov txiaj ntsig.
Kev hloov pauv ntawm qhov ceev ntawm cov slurry kuj cuam tshuam rau cov tshuaj lom neeg-mechanical reactions ntawm lub wafer, nrog rau cov teebmeem downstream ntawm qhov tsis zoo thiab kev ua haujlwm ntawm lub cuab yeej. Piv txwv li, cov khoom me me lossis cov khoom tawg tsis sib xws hauv cov slurries diluted cuam tshuam rau cov nqi tshem tawm hauv zos, tsim cov microtopography uas tuaj yeem nthuav dav ua cov txheej txheem yuam kev hauv kev tsim khoom ntau. Cov subtleties no xav tau kev tswj hwm cov slurry concentration nruj thiab kev saib xyuas zoo, tshwj xeeb tshaj yog nyob rau hauv cov nodes siab heev.
Kev Ntsuas Qhov Ceev ntawm Slurry thiab Kev Txhim Kho Lub Sijhawm Tiag Tiag
Kev ntsuas qhov ceev ntawm cov slurry tiag tiag, ua tau los ntawm kev siv cov inline density meters—xws li cov ultrasonic slurry density meters uas tsim los ntawm Lonnmeter—tam sim no yog tus qauv hauv kev siv semiconductor kev lag luam. Cov cuab yeej no tso cai rau kev saib xyuas tas mus li ntawm cov slurry parameters, muab cov lus teb tam sim ntawd ntawm qhov hloov pauv ntawm qhov ceev thaum cov slurry txav mus los ntawm CMP cov cuab yeej thiab cov kab ke faib khoom.
Cov txiaj ntsig tseem ceeb ntawm kev ntsuas qhov ceev ntawm cov slurry hauv lub sijhawm tiag tiag suav nrog:
- Tshawb pom cov xwm txheej tsis raws li qhov tau teev tseg tam sim ntawd, tiv thaiv kev kis tus kab mob los ntawm cov txheej txheem kim heev
- Kev ua kom zoo dua ntawm cov txheej txheem - ua rau cov engineers tswj tau qhov ceev ntawm cov slurry zoo tshaj plaws, ua kom qhov nrawm tshem tawm siab tshaj plaws thaum txo qhov tsis zoo.
- Txhim kho wafer-rau-wafer thiab ntau-rau-ntau sib xws, txhais tau tias tag nrho cov khoom tsim tau zoo dua
- Kev noj qab haus huv ntawm cov khoom siv ntev, vim tias cov slurries uas muaj ntau dhau lossis tsis muaj ntau tuaj yeem ua rau cov ntaub polishing pads, mixers, thiab distribution plumbing hnav sai dua.
Cov chaw teeb tsa rau cov khoom siv CMP feem ntau xa cov voj voog qauv lossis cov kab rov ua dua tshiab los ntawm thaj chaw ntsuas, kom ntseeg tau tias cov nyeem ntawv ceev yog sawv cev rau qhov ntws tiag tiag xa mus rau cov wafers.
Precise thiab real-timekev ntsuas qhov ceev ntawm cov slurrytsim lub hauv paus ntawm cov txheej txheem tswj kev ceev ntawm cov slurry, txhawb nqa ob qho tib si tsim thiab cov qauv tshiab polishing slurry, suav nrog cov Cerium oxide (CeO₂) slurries rau cov txheej txheem interlayer thiab oxide CMP siab heev. Kev tswj hwm qhov tseem ceeb no txuas ncaj qha rau kev tsim khoom, kev tswj hwm tus nqi, thiab kev ntseeg siab ntawm cov cuab yeej thoob plaws hauv cov txheej txheem tshuaj lom neeg planarization.
Cov Ntsiab Cai thiab Cov Txuj Ci rau Kev Ntsuas Qhov Ceev ntawm Slurry
Qhov ceev ntawm cov slurry piav qhia txog qhov hnyav ntawm cov khoom khov ib chav ntim hauv cov slurry polishing, xws li Cerium oxide (CeO₂) formulations siv rau hauv kev sib xyaw ua ke ntawm cov tshuaj lom neeg (CMP). Qhov hloov pauv no txiav txim siab qhov nrawm ntawm kev tshem tawm cov khoom, qhov sib xws ntawm cov zis, thiab cov qib tsis zoo ntawm cov wafers polished. Kev ntsuas qhov ceev ntawm cov slurry zoo yog qhov tseem ceeb rau kev tswj hwm cov slurry concentration siab heev, uas cuam tshuam ncaj qha rau cov txiaj ntsig thiab qhov tsis zoo hauv kev siv hauv kev lag luam semiconductor.
Muaj ntau yam khoom siv ntsuas qhov ceev ntawm cov slurry tau siv rau hauv CMP kev ua haujlwm, txhua tus siv cov ntsiab cai ntsuas sib txawv. Cov txheej txheem Gravimetric vam khom kev sau thiab hnyav ib qho slurry ntim, muab qhov tseeb siab tab sis tsis muaj peev xwm ua haujlwm tiag tiag thiab ua rau lawv tsis yooj yim rau kev siv tas mus li hauv kev teeb tsa rau cov khoom siv CMP. Cov ntsuas qhov ceev ntawm electromagnetic siv cov teb electromagnetic los xam qhov ceev raws li kev hloov pauv ntawm kev coj ua thiab kev tso cai vim yog cov khoom siv abrasive uas raug ncua. Cov ntsuas kev co, xws li cov ntsuas vibrating tube densitometers, ntsuas qhov zaus teb ntawm lub raj uas muaj slurry; kev hloov pauv ntawm qhov ceev cuam tshuam rau qhov zaus co, ua rau muaj kev saib xyuas tas mus li. Cov thev naus laus zis no txhawb nqa kev saib xyuas inline tab sis tuaj yeem rhiab heev rau fouling lossis kev hloov pauv tshuaj lom neeg.
Cov ntsuas qhov ceev ntawm cov kua nplaum ultrasonic yog ib qho kev nce qib tseem ceeb rau kev saib xyuas qhov ceev tiag tiag hauv kev npaj tshuaj lom neeg. Cov cuab yeej no tso tawm cov nthwv dej ultrasonic los ntawm cov kua nplaum thiab ntsuas lub sijhawm ya lossis qhov ceev ntawm lub suab kis. Qhov ceev ntawm lub suab hauv ib qho nruab nrab nyob ntawm nws qhov ceev thiab qhov sib xyaw ntawm cov khoom khov, uas tso cai rau kev txiav txim siab meej ntawm cov khoom slurry. Lub tshuab ultrasonic yog qhov tsim nyog heev rau cov chaw ua haujlwm abrasive thiab cov tshuaj lom neeg ua phem feem ntau ntawm CMP, vim nws tsis cuam tshuam thiab txo cov sensor fouling piv rau cov ntsuas sib cuag ncaj qha. Lonnmeter tsim cov ntsuas qhov ceev ntawm cov kua nplaum ultrasonic inline uas tsim rau cov kab CMP kev lag luam semiconductor.
Cov txiaj ntsig ntawm ultrasonic slurry density meters muaj xws li:
- Kev ntsuas tsis cuam tshuam: Cov sensors feem ntau raug ntsia sab nraud lossis hauv cov bypass flow cell, txo qhov cuam tshuam rau cov slurry thiab zam kev txhuam ntawm cov nto sensing.
- Muaj peev xwm ua haujlwm tiag tiag: Cov zis txuas ntxiv mus ua rau muaj kev hloov kho cov txheej txheem tam sim ntawd, ua kom ntseeg tau tias cov slurry ceev nyob hauv cov kev txwv teev tseg rau qhov zoo tshaj plaws wafer polishing zoo.
- Kev ntsuas qhov tseeb thiab kev ruaj khov: Cov tshuab ntsuas ultrasonic muab cov ntawv nyeem ruaj khov thiab rov ua dua, tsis cuam tshuam los ntawm kev hloov pauv ntawm cov tshuaj slurry lossis cov khoom me me ntawm kev teeb tsa ntev.
- Kev koom ua ke nrog cov khoom siv CMP: Lawv tus qauv tsim txhawb nqa qhov chaw teeb tsa hauv cov kab slurry rov ua dua lossis cov manifolds xa khoom, ua kom yooj yim tswj cov txheej txheem yam tsis muaj sijhawm ntau.
Cov kev tshawb fawb tsis ntev los no hauv kev tsim cov khoom siv semiconductor qhia txog kev txo qis qhov tsis zoo txog li 30% thaum kev saib xyuas qhov ceev ntawm ultrasonic hauv kab ua ke nrog kev teeb tsa cov khoom siv tshuaj lom neeg rau Cerium oxide (CeO₂) polishing slurry. Cov lus teb tsis siv neeg los ntawm cov sensors ultrasonic tso cai rau kev tswj hwm nruj dua ntawm cov qauv polishing slurry, ua rau muaj kev sib npaug ntawm cov tuab thiab cov khoom pov tseg tsawg dua. Cov ntsuas qhov ceev ntawm ultrasonic, thaum ua ke nrog cov txheej txheem calibration muaj zog, tswj kev ua tau zoo hauv kev sib hloov ntawm cov khoom sib xyaw, uas feem ntau tshwm sim hauv kev ua haujlwm CMP siab heev.
Hauv kev xaus lus, kev ntsuas qhov ceev ntawm cov slurry tiag tiag—tshwj xeeb tshaj yog siv cov thev naus laus zis ultrasonic—tau dhau los ua qhov tseem ceeb rau cov txheej txheem tswj qhov ceev ntawm cov slurry hauv CMP. Cov kev nce qib no ncaj qha txhim kho cov txiaj ntsig, kev ua haujlwm zoo, thiab qhov zoo ntawm wafer hauv kev lag luam semiconductor.
Kev Teeb tsa thiab Kev Sib Koom Ua Ke hauv CMP Systems
Kev ntsuas qhov ceev ntawm cov slurry kom raug yog qhov tseem ceeb rau kev tswj cov slurry concentration hauv cov txheej txheem chemical mechanical planarization. Kev xaiv cov chaw teeb tsa zoo rau cov slurry density meters cuam tshuam ncaj qha rau qhov tseeb, kev ruaj khov ntawm cov txheej txheem, thiab qhov zoo ntawm wafer.
Cov Yam Tseem Ceeb Rau Kev Xaiv Cov Chaw Teeb Tsa
Hauv kev teeb tsa CMP, cov ntsuas qhov ceev yuav tsum tau muab tso rau hauv qhov chaw los saib xyuas cov slurry tiag tiag siv rau kev txhuam wafer. Cov chaw teeb tsa tseem ceeb suav nrog:
- Lub tank rov ua dua tshiab:Tso lub ntsuas rau ntawm qhov hluav taws xob yuav ua rau pom tseeb txog cov dej hauv paus ua ntej faib tawm. Txawm li cas los xij, qhov chaw no yuav tsis pom cov kev hloov pauv uas tshwm sim ntxiv rau hauv qab, xws li kev tsim cov npuas dej lossis cov teebmeem kub hauv zos.
- Cov Kab Xa Khoom:Kev teeb tsa tom qab sib tov cov chav thiab ua ntej nkag mus rau hauv cov manifolds faib khoom ua kom ntseeg tau tias qhov ntsuas qhov ceev qhia txog cov slurry kawg formulation, suav nrog Cerium oxide (CeO₂) polishing slurry thiab lwm yam additives. Qhov chaw no tso cai rau kev ntes tau sai ntawm cov slurry concentration hloov pauv ua ntej wafers raug ua tiav.
- Kev Saib Xyuas Qhov Chaw Siv:Qhov chaw zoo tshaj plaws yog nyob rau sab saud ntawm lub qhov dej lossis cov cuab yeej siv. Qhov no ntes tau cov dej ntws ceev tam sim ntawd thiab ceeb toom cov neeg ua haujlwm txog kev hloov pauv hauv cov txheej txheem uas tuaj yeem tshwm sim los ntawm kev cua sov, kev sib cais, lossis kev tsim cov npuas me me.
Thaum xaiv qhov chaw teeb tsa, yuav tsum xav txog lwm yam xws li kev ntws, kev taw qhia ntawm cov yeeb nkab, thiab qhov ze ntawm cov twj lossis cov li qub:
- Kev nyiamkev teeb tsa ntsugnrog rau kev ntws mus rau sab saud kom txo cov pa npuas thiab cov av noo sib sau ua ke ntawm cov khoom siv sensing.
- Tswj ntau txoj kab uas hla ntawm lub 'meter' thiab cov chaw tseem ceeb uas ua rau muaj kev co (twj tso kua mis, cov qhov dej) kom tsis txhob nyeem yuam kev vim muaj kev cuam tshuam ntawm cov dej ntws.
- Sivkev tswj hwm kev ntws(cov khoom ncaj lossis cov seem so) rau kev ntsuam xyuas qhov ntsuas qhov ceev hauv ib puag ncig laminar ruaj khov.
Cov Teeb Meem Feem Ntau thiab Cov Kev Xyaum Zoo Tshaj Plaws rau Kev Sib Koom Tes Sensor Txhim Khu Kev Ntseeg Tau
Cov txheej txheem CMP slurry ua rau muaj ntau yam teeb meem kev koom ua ke:
- Kev Nkag Cua thiab Npuas:Cov ntsuas qhov ceev ntawm cov kua nplaum uas siv ultrasonic tuaj yeem nyeem qhov ceev yuam kev yog tias muaj cov npuas me me. Tsis txhob muab cov sensors tso ze rau ntawm cov chaw uas cua nkag lossis cov dej ntws hloov pauv sai sai, uas feem ntau tshwm sim ze ntawm cov twj tso kua mis lossis cov thoob sib tov.
- Kev ua kom av noo:Hauv cov kab kab rov tav, cov sensors yuav ntsib cov khoom khov uas poob, tshwj xeeb tshaj yog nrog CeO₂ polishing slurry. Kev teeb tsa ntsug lossis tso rau saum cov cheeb tsam uas poob tau yog qhov pom zoo kom tswj tau qhov ceev ntawm cov slurry kom raug.
- Kev puas tsuaj ntawm lub sensor:Cov tshuaj CMP slurries muaj cov tshuaj abrasive thiab cov tshuaj uas yuav ua rau muaj kev puas tsuaj lossis txheej ntawm lub sensor. Cov cuab yeej Lonnmeter inline tau tsim los txo qhov no, tab sis kev tshuaj xyuas thiab kev ntxuav tsis tu ncua tseem ceeb rau kev ntseeg tau.
- Kev co tshuab:Qhov chaw ze rau cov khoom siv kho tshuab uas ua haujlwm tuaj yeem ua rau muaj suab nrov hauv lub sensor, ua rau qhov kev ntsuas tsis raug. Xaiv cov chaw teeb tsa uas muaj kev co tsawg kawg nkaus.
Rau qhov zoo tshaj plaws ntawm kev sib koom ua ke:
- Siv cov ntu laminar flow rau kev teeb tsa.
- Xyuas kom meej tias nws sib dhos ntsug txhua qhov chaw uas ua tau.
- Muab kev nkag tau yooj yim rau kev saib xyuas thiab kev ntsuas tsis tu ncua.
- Cais cov sensors ntawm kev co thiab kev cuam tshuam ntawm kev ntws.
CMP
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Cov Tswv Yim Tswj Xyuas Kev Ntsuas Slurry
Kev tswj cov slurry concentration zoo hauv cov txheej txheem tshuaj lom neeg planarization yog qhov tseem ceeb kom tswj tau cov nqi tshem tawm cov khoom siv sib xws, txo cov qhov tsis zoo ntawm cov wafer, thiab xyuas kom meej tias muaj kev sib xws thoob plaws cov semiconductor wafers. Muaj ntau txoj hauv kev thiab cov thev naus laus zis siv los ua kom tiav qhov kev ua haujlwm no, txhawb nqa ob qho tib si kev ua haujlwm yooj yim thiab cov khoom siv siab.
Cov Txheej Txheem thiab Cov Cuab Yeej rau Kev Tswj Xyuas Qhov Zoo Tshaj Plaws Slurry Concentration
Kev tswj cov slurry concentration pib nrog kev saib xyuas lub sijhawm tiag tiag ntawm ob qho tib si abrasive particles thiab cov tshuaj lom neeg hauv cov polishing slurry. Rau Cerium oxide (CeO₂) polishing slurry thiab lwm yam CMP formulations, cov txheej txheem ncaj qha xws li kev ntsuas qhov ceev ntawm inline slurry yog qhov tseem ceeb. Ultrasonic slurry density meters, xws li cov uas tsim los ntawm Lonnmeter, xa cov kev ntsuas tas mus li ntawm slurry density, uas muaj feem cuam tshuam nrog tag nrho cov khoom khov thiab kev sib xws.
Cov txheej txheem ntxiv suav nrog kev tshuaj xyuas qhov turbidity—qhov twg cov sensors optical ntes tau qhov tawg ntawm cov khoom tawg uas raug dai—thiab cov txheej txheem spectroscopic xws li UV-Vis lossis Near-Infrared (NIR) spectroscopy los ntsuas qhov tseem ceeb ntawm cov tshuaj reactants hauv cov dej slurry. Cov kev ntsuas no yog lub hauv paus ntawm CMP cov txheej txheem tswj hwm, ua rau muaj kev hloov kho kom ruaj khov kom tswj tau lub qhov rais concentration thiab txo qis qhov sib txawv ntawm ib pawg mus rau ib pawg.
Cov cuab yeej ntsuas hluav taws xob siv rau hauv cov qauv uas muaj cov hlau ions ntau, muab cov ntaub ntawv teb sai ntawm cov ionic concentration tshwj xeeb thiab txhawb nqa kev kho kom zoo dua hauv kev siv semiconductor kev lag luam siab heev.
Cov Kev Tawm Tswv Yim thiab Kev Ua Haujlwm Tsis Siv Neeg rau Kev Tswj Xyuas Kaw-Loop
Cov khoom siv niaj hnub no siv cov tshuab tswj kev siv tshuaj lom neeg uas txuas cov ntsuas inline nrog cov tshuab faib khoom tsis siv neeg. Cov ntaub ntawv los ntawm cov ntsuas qhov ceev ntawm cov slurry thiab cov sensors cuam tshuam raug pub ncaj qha rau cov programmable logic controllers (PLCs) lossis cov tshuab tswj faib tawm (DCS). Cov tshuab no cia li ua haujlwm rau cov dej ntxiv, kev muab cov slurry sib xyaw, thiab txawm tias kev txhaj tshuaj stabilizer, kom ntseeg tau tias cov txheej txheem tseem nyob hauv qhov kev ua haujlwm xav tau txhua lub sijhawm.
Cov qauv tawm tswv yim no tso cai rau kev kho qhov tsis sib xws ntawm cov sensors tiag tiag uas pom tau, zam kev dilution ntau dhau, khaws cia qhov zoo tshaj plaws ntawm cov abrasive concentration, thiab txo kev siv tshuaj ntau dhau. Piv txwv li, hauv cov cuab yeej CMP siab rau cov wafer nodes siab heev, lub inline ultrasonic slurry density meter yuav ntes tau qhov poob ntawm cov abrasive concentration thiab tam sim ntawd qhia rau lub kaw lus dosing kom nce slurry kev qhia, kom txog thaum qhov ceev rov qab mus rau nws qhov chaw teeb tsa. Ntawm qhov tod tes, yog tias qhov ceev ntsuas tshaj qhov kev qhia tshwj xeeb, cov logic tswj pib ua kom muaj dej ntxiv kom rov qab tau qhov concentration kom raug.
Lub Luag Haujlwm ntawm Kev Ntsuas Qhov Ceev hauv Kev Kho Cov Dej Ua Kom Zoo thiab Cov Ncej Ntxiv
Kev ntsuas qhov ceev ntawm cov slurry yog lub hauv paus tseem ceeb ntawm kev tswj kev sib xyaw ua ke. Tus nqi ceev uas muab los ntawm cov cuab yeej xws li Lonnmeter's inline density meters ncaj qha qhia ob qho kev ua haujlwm tseem ceeb: ntim dej ua kom tiav thiab tus nqi pub cov slurry sib xyaw.
Los ntawm kev nrhiav cov ntsuas qhov ceev ntawm cov chaw tseem ceeb—xws li ua ntej siv CMP lossis tom qab siv lub tshuab sib tov—cov ntaub ntawv tiag tiag ua rau cov tshuab ua haujlwm tsis siv neeg kho qhov nrawm ntawm cov dej ntxiv, yog li ntawd dilute cov slurry mus rau qhov xav tau. Tib lub sijhawm, lub tshuab tuaj yeem hloov kho qhov nrawm ntawm cov slurry concentrated kom tswj tau cov abrasive thiab cov tshuaj lom neeg kom raug, suav nrog kev siv cov cuab yeej, cov teebmeem laus, thiab kev poob los ntawm cov txheej txheem.
Piv txwv li, thaum lub sijhawm ntev planarization khiav rau 3D NAND cov qauv, kev saib xyuas qhov ceev tsis tu ncua ntes cov slurry aggregation lossis settling qauv, ua rau automatic nce hauv kev ua-up dej lossis agitation, raws li qhov xav tau rau cov txheej txheem ruaj khov. Lub voj voog tswj hwm nruj no yog lub hauv paus hauv kev tswj hwm cov wafer-rau-wafer thiab hauv-wafer uniformity lub hom phiaj, tshwj xeeb tshaj yog thaum cov cuab yeej loj me thiab cov txheej txheem qhov rai nqaim.
Hauv kev xaus, cov tswv yim tswj kev sib xyaw ua ke ntawm cov slurry hauv CMP vam khom kev sib xyaw ua ke ntawm kev ntsuas hauv kab thiab cov lus teb kaw-loop. Cov ntsuas qhov ceev ntawm Slurry, tshwj xeeb tshaj yog cov ultrasonic units zoo li cov los ntawm Lonnmeter, ua lub luag haujlwm tseem ceeb hauv kev xa cov ntaub ntawv daws teeb meem siab, raws sijhawm xav tau rau kev tswj hwm cov txheej txheem nruj hauv cov kauj ruam tseem ceeb ntawm kev tsim khoom semiconductor. Cov cuab yeej thiab cov txheej txheem no txo qis qhov sib txawv, txhawb kev ruaj khov los ntawm kev ua kom zoo dua kev siv tshuaj, thiab ua kom muaj qhov tseeb xav tau rau cov thev naus laus zis niaj hnub.
Cov Lus Qhia Xaiv Cov Khoom Siv Ntsuas Qhov Ceev ntawm Slurry rau Kev Lag Luam Semiconductor
Kev xaiv lub ntsuas qhov ceev ntawm cov slurry rau kev sib xyaw ua ke ntawm cov tshuaj lom neeg (CMP) hauv kev lag luam semiconductor xav tau kev saib xyuas zoo rau ntau yam kev cai. Cov qauv tseem ceeb ntawm kev ua tau zoo thiab kev siv suav nrog kev rhiab heev, qhov tseeb, kev sib raug zoo nrog cov tshuaj lom neeg slurry, thiab kev yooj yim ntawm kev koom ua ke hauv CMP slurry delivery systems thiab cov khoom siv teeb tsa.
Cov Kev Xav Tau Txog Kev Rhiab thiab Kev Tseeb
Kev tswj cov txheej txheem CMP nyob ntawm qhov sib txawv me me hauv cov khoom sib xyaw ua ke. Lub ntsuas qhov ceev yuav tsum ntes tau qhov kev hloov pauv tsawg kawg nkaus ntawm 0.001 g / cm³ lossis zoo dua. Qib kev rhiab heev no yog qhov tseem ceeb rau kev txheeb xyuas txawm tias qhov kev hloov pauv me me hauv cov ntsiab lus abrasive - xws li cov uas pom hauv CeO₂ polishing slurry lossis silica-based slurries - vim tias cov no cuam tshuam rau cov nqi tshem tawm cov khoom siv, wafer planarity, thiab qhov tsis zoo. Ib qho kev ntsuas qhov tseeb raug rau semiconductor slurry density meters yog ± 0.001–0.002 g / cm³.
Kev Sib Tw Nrog Cov Slurries Uas Muaj Zog
Cov khoom siv hauv CMP tuaj yeem muaj cov nanoparticles abrasive xws li cerium oxide (CeO₂), alumina, lossis silica, uas raug dai rau hauv cov tshuaj lom neeg. Lub ntsuas qhov ceev yuav tsum tiv taus kev raug rau ob qho tib si kev puas tsuaj thiab kev kub ntxhov yam tsis muaj kev tawm ntawm kev ntsuas lossis kev txom nyem los ntawm kev fouling. Cov ntaub ntawv siv hauv cov khoom ntub dej yuav tsum tsis txhob siv rau txhua yam tshuaj lom neeg slurry uas siv ntau.
Yooj Yim ntawm Kev Sib Koom Ua Ke
Cov ntsuas qhov ceev ntawm cov dej ntws hauv kab yuav tsum haum rau hauv cov khoom siv CMP uas twb muaj lawm. Cov kev xav txog suav nrog:
- Qhov ntim tsawg kawg nkaus thiab qhov siab poob qis kom tsis txhob cuam tshuam rau kev xa cov slurry.
- Kev txhawb nqa rau cov txheej txheem kev lag luam txheem rau kev teeb tsa sai thiab kev saib xyuas.
- Kev sib raug zoo ntawm cov zis (piv txwv li, cov teeb liab analog / digital) rau kev sib koom ua ke nrog lub sijhawm tiag tiag nrog cov kab ke tswj kev sib xyaw ua ke, tab sis tsis tas muab cov kab ke ntawd lawv tus kheej.
Cov yam ntxwv sib piv ntawm cov thev naus laus zis sensor ua ntej
Kev tswj qhov ceev ntawm cov khoom siv polishing slurries feem ntau yog tswj hwm los ntawm ob chav kawm sensor: densitometry-based thiab refractometry-based meters. Txhua tus coj lub zog cuam tshuam rau cov ntawv thov kev lag luam semiconductor.
Cov Ntsuas Densitometry (piv txwv li, Ultrasonic Slurry Density Meter)
- Siv qhov ceev ntawm lub suab los ntawm cov slurry, ncaj qha cuam tshuam rau qhov ceev.
- Muab kev ntsuas qhov ceev siab hla ntau yam kev sib xyaw ntawm cov slurry thiab cov hom abrasive.
- Zoo rau cov slurries polishing hnyav, suav nrog CeO₂ thiab silica formulations, vim tias cov ntsiab lus sensing tuaj yeem ua tau cais tawm ntawm cov tshuaj lom neeg.
- Qhov rhiab heev thiab qhov raug raws li qhov yuav tsum tau ua qis dua 0.001 g/cm³.
- Kev teeb tsa feem ntau yog inline, tso cai rau kev ntsuas lub sijhawm tiag tiag thaum lub sijhawm ua haujlwm ntawm cov khoom siv tshuaj lom neeg.
Cov Ntsuas Uas Siv Refractometry
- Ntsuas qhov refractive index los xam qhov ceev ntawm cov slurry.
- Zoo rau kev ntes cov kev hloov pauv me me hauv cov khoom sib xyaw vim muaj kev nkag siab siab rau kev hloov pauv concentration; muaj peev xwm daws tau <0.1% qhov kev hloov pauv ntawm pawg.
- Txawm li cas los xij, qhov ntsuas refractive yog qhov rhiab heev rau cov yam ntxwv ib puag ncig xws li qhov kub thiab txias, yuav tsum tau ua tib zoo calibration thiab kev them nyiaj kub.
- Tej zaum yuav muaj kev sib xyaw tshuaj tsawg, tshwj xeeb tshaj yog nyob rau hauv cov slurries uas muaj zog heev lossis tsis pom tseeb.
Kev Ntsuas Qhov Loj ntawm Cov Khoom Me Me ua ib qho Kev Pabcuam Ntxiv
- Cov kev nyeem ceev tuaj yeem raug skewed los ntawm kev hloov pauv ntawm qhov loj me ntawm cov khoom me me lossis kev sib sau ua ke.
- Kev koom ua ke nrog kev tshuaj xyuas qhov loj ntawm cov khoom me me (piv txwv li, kev tawg ntawm lub teeb dynamic lossis electron microscopy) yog qhov kev coj ua zoo tshaj plaws hauv kev lag luam, kom ntseeg tau tias qhov kev hloov pauv ntawm qhov ceev tsis yog vim muaj kev sib sau ua ke ntawm cov khoom me me xwb.
Cov Kev Xav Txog Rau Lonnmeter Inline Density Meters
- Lonnmeter tshwj xeeb hauv kev tsim cov inline density thiab viscosity meters, yam tsis muaj kev txhawb nqa software lossis kev sib koom ua ke ntawm lub kaw lus.
- Cov ntsuas Lonnmeter tuaj yeem teev tseg kom tiv taus cov khoom siv CMP uas muaj zog thiab muaj tshuaj lom neeg thiab tau tsim los rau kev teeb tsa ncaj qha hauv cov khoom siv semiconductor, ua kom haum rau qhov xav tau kev ntsuas qhov ceev ntawm cov khoom siv slurry tiag tiag.
Thaum tshuaj xyuas cov kev xaiv, tsom mus rau cov qauv tseem ceeb ntawm kev siv: xyuas kom meej tias lub ntsuas qhov ceev ua tiav qhov kev rhiab heev thiab qhov tseeb, yog tsim los ntawm cov ntaub ntawv sib xws nrog koj cov tshuaj slurry, tiv taus kev ua haujlwm tas mus li, thiab sib xyaw ua ke zoo rau hauv kev txhuam cov kab xa khoom slurry hauv cov txheej txheem CMP. Rau kev lag luam semiconductor, kev ntsuas qhov ceev slurry meej yog lub hauv paus ntawm kev sib xws ntawm wafer, cov txiaj ntsig, thiab kev tsim khoom.
Kev Cuam Tshuam ntawm Kev Tswj Xyuas Qhov Ceev ntawm Slurry rau CMP Cov Txiaj Ntsig
Kev tswj qhov ceev ntawm cov slurry yog qhov tseem ceeb heev rau hauv cov txheej txheem tshuaj lom neeg planarization. Thaum qhov ceev ceev raug khaws cia kom sib xws, qhov ntau ntawm cov khoom abrasive uas muaj thaum lub sijhawm polishing tseem ruaj khov. Qhov no cuam tshuam ncaj qha rau qhov nrawm tshem tawm cov khoom siv (MRR) thiab qhov zoo ntawm qhov chaw ntawm wafer.
Kev txo qis ntawm qhov tsis zoo ntawm Wafer Surface thiab txhim kho WIWNU
Kev tswj kom qhov ceev ntawm cov slurry zoo tshaj plaws tau ua pov thawj tias yuav txo qhov tsis zoo ntawm cov wafer nto xws li microscratches, dishing, erosion, thiab particle contamination. Kev tshawb fawb los ntawm xyoo 2024 qhia tau hais tias qhov ntau thiab tsawg ntawm cov wafer uas tswj tau, feem ntau ntawm 1 wt% txog 5 wt% rau cov colloidal silica-based formulations, ua rau muaj qhov sib npaug zoo tshaj plaws ntawm kev tshem tawm zoo thiab kev txo qhov tsis zoo. Qhov ceev ntau dhau ua rau muaj kev sib tsoo abrasive, ua rau muaj ob mus rau peb npaug ntawm cov lej tsis zoo ib square centimeter, raws li tau lees paub los ntawm atomic force microscopy thiab ellipsometry analyses. Kev tswj qhov ceev nruj kuj txhim kho qhov tsis sib xws hauv-wafer (WIWNU), xyuas kom meej tias cov khoom raug tshem tawm sib npaug thoob plaws wafer, uas yog qhov tseem ceeb rau cov khoom siv semiconductor node siab heev. Qhov ceev sib xws pab tiv thaiv kev ua haujlwm uas yuav ua rau muaj kev phom sij rau cov hom phiaj tuab zaj duab xis lossis qhov tiaj tus.
Kev ncua sijhawm ntawm Slurry lub neej thiab kev txo qis ntawm cov nqi siv khoom
Cov txheej txheem tswj kev sib xyaw ntawm cov slurry—xws li kev saib xyuas lub sijhawm tiag tiag nrog cov ntsuas ultrasonic slurry density—nthuav lub neej siv tau ntawm CMP polishing slurry. Los ntawm kev tiv thaiv kev noj ntau dhau lossis kev dilution ntau dhau, cov khoom siv tshuaj lom neeg planarization ua tiav kev siv cov khoom siv tau zoo tshaj plaws. Txoj hauv kev no txo qhov zaus ntawm kev hloov slurry thiab ua rau cov tswv yim rov ua dua tshiab, txo cov nqi tag nrho. Piv txwv li, hauv CeO₂ polishing slurry daim ntawv thov, kev saib xyuas qhov ceev ceev ua kom zoo tso cai rau kev rov ua dua ntawm cov slurry batches thiab txo qhov ntim pov tseg yam tsis muaj kev cuam tshuam kev ua tau zoo. Kev tswj qhov ceev ceev zoo ua rau cov kws ua haujlwm txheej txheem rov qab thiab rov siv cov polishing slurry uas tseem nyob hauv qhov kev ua tau zoo, ntxiv kev tsav tsheb txuag nqi.
Kev Ua Dua Dua thiab Kev Tswj Xyuas Txheej Txheem rau Kev Tsim Khoom Qib Siab
Cov ntawv thov kev lag luam semiconductor niaj hnub no xav tau qhov rov ua dua siab hauv cov kauj ruam tshuaj-mechanical planarization. Hauv kev tsim cov node siab heev, txawm tias qhov kev hloov pauv me me hauv slurry density tuaj yeem ua rau muaj kev hloov pauv tsis raug hauv cov txiaj ntsig wafer. Kev ua haujlwm tsis siv neeg thiab kev koom ua ke ntawm inline ultrasonic slurry density meters—xws li cov uas tsim los ntawm Lonnmeter—pab txhawb kev tawm tswv yim tas mus li, lub sijhawm tiag tiag rau kev tswj cov txheej txheem. Cov cuab yeej no xa cov kev ntsuas raug hauv cov chaw tshuaj lom neeg hnyav uas ib txwm muaj ntawm CMP, txhawb nqa cov kab ke kaw uas teb tam sim ntawd rau kev hloov pauv. Kev ntsuas qhov ceev txhim khu kev qha txhais tau tias muaj kev sib xws ntau dua los ntawm wafer mus rau wafer thiab kev tswj hwm nruj dua ntawm MRR, uas yog qhov tseem ceeb rau kev tsim khoom semiconductor sub-7nm. Kev teeb tsa cov khoom siv kom raug—kev tso qhov chaw kom raug hauv kab xa khoom slurry—thiab kev saib xyuas tsis tu ncua yog qhov tseem ceeb kom ntseeg tau tias cov meters ua haujlwm tau zoo thiab muab cov ntaub ntawv tseem ceeb rau kev ruaj khov ntawm cov txheej txheem.
Kev tswj kom muaj cov slurry ntom txaus yog qhov tseem ceeb rau kev ua kom cov khoom tsim tau zoo tshaj plaws, txo qhov tsis zoo, thiab xyuas kom meej tias cov khoom tsim tau zoo hauv cov txheej txheem CMP.
Cov Lus Nug Feem Ntau (FAQs)
Lub luag haujlwm ntawm lub ntsuas qhov ceev ntawm cov slurry hauv cov txheej txheem chemical mechanical planarization yog dab tsi?
Lub ntsuas qhov ceev ntawm cov slurry ua lub luag haujlwm tseem ceeb hauv cov txheej txheem kev sib tsoo tshuaj lom neeg los ntawm kev ntsuas qhov ceev thiab qhov sib xyaw ntawm cov slurry polishing. Nws lub luag haujlwm tseem ceeb yog muab cov ntaub ntawv tiag tiag ntawm qhov sib npaug ntawm cov khoom sib xyaw thiab tshuaj lom neeg hauv cov slurry, kom ntseeg tau tias ob qho tib si nyob hauv qhov txwv tseeb rau qhov zoo tshaj plaws ntawm wafer planarization. Qhov kev tswj hwm tiag tiag no tiv thaiv cov qhov tsis zoo xws li khawb lossis tshem tawm cov khoom tsis sib xws, uas feem ntau tshwm sim nrog cov khoom sib xyaw slurry ntau dhau lossis tsis txaus. Qhov ceev ntawm cov slurry sib xws pab tswj kev rov ua dua thoob plaws kev tsim khoom, txo qis qhov sib txawv ntawm wafer-rau-wafer, thiab txhawb nqa kev ua kom zoo dua los ntawm kev ua kom raug yog tias pom muaj kev hloov pauv. Hauv kev tsim khoom semiconductor siab heev thiab cov ntawv thov kev ntseeg siab siab, kev saib xyuas tas mus li kuj txo cov khib nyiab thiab txhawb nqa cov kev ntsuas kev ruaj ntseg zoo.
Vim li cas CeO₂ polishing slurry thiaj li nyiam rau qee cov kauj ruam planarization hauv kev lag luam semiconductor?
Cov tshuaj txhuam Cerium oxide (CeO₂) yog xaiv rau cov kauj ruam tshwj xeeb ntawm kev npaj semiconductor vim nws qhov kev xaiv tshwj xeeb thiab kev sib raug zoo ntawm tshuaj lom neeg, tshwj xeeb tshaj yog rau cov iav thiab cov yeeb yaj kiab oxide. Nws cov khoom sib xyaw ua ke ua rau muaj kev npaj zoo nrog cov nqi qis heev thiab qhov khawb ntawm qhov chaw tsawg heev. Cov khoom siv tshuaj lom neeg ntawm CeO₂ ua rau muaj kev tshem tawm ruaj khov thiab rov ua dua, uas yog qhov tseem ceeb rau cov ntawv thov siab heev xws li photonics thiab cov voj voog sib xyaw ua ke siab. Tsis tas li ntawd, CeO₂ slurry tiv taus kev sib sau ua ke, tswj kev ncua tsis tu ncua txawm tias thaum lub sijhawm ua haujlwm CMP ntev.
Lub ntsuas ultrasonic slurry density meter ua haujlwm li cas piv rau lwm hom kev ntsuas?
Lub tshuab ntsuas qhov ceev ntawm cov slurry ultrasonic ua haujlwm los ntawm kev xa cov suab nthwv dej los ntawm cov slurry thiab ntsuas qhov ceev thiab qhov attenuation ntawm cov nthwv dej no. Qhov ceev ntawm cov slurry ncaj qha cuam tshuam rau qhov ceev ntawm cov nthwv dej mus ncig thiab qhov uas lawv qhov muaj zog txo qis. Txoj kev ntsuas no tsis cuam tshuam thiab muab cov ntaub ntawv slurry concentration tiag tiag yam tsis tas yuav cais lossis cuam tshuam lub cev ntawm cov txheej txheem. Cov txheej txheem ultrasonic qhia tsawg dua qhov rhiab heev rau cov hloov pauv xws li qhov ceev ntawm cov dej ntws lossis qhov loj me ntawm cov khoom me me thaum piv rau cov txheej txheem ntsuas qhov ceev ntawm cov khoom siv (float-based) lossis gravimetric. Hauv kev npaj tshuaj lom neeg, qhov no txhais tau tias muaj kev ntsuas txhim khu kev qha, ruaj khov txawm tias nyob rau hauv cov dej ntws siab, cov khoom siv nplua nuj.
Feem ntau yuav tsum tau nruab cov ntsuas qhov ceev ntawm cov slurry nyob qhov twg hauv lub kaw lus CMP?
Qhov chaw zoo tshaj plaws rau kev teeb tsa lub ntsuas qhov ceev ntawm cov slurry hauv cov khoom siv tshuaj lom neeg planarization suav nrog:
- Lub tank rov ua dua tshiab: los saib xyuas qhov ceev ntawm cov slurry ua ntej faib tawm.
- Ua ntej xa khoom mus rau lub tshuab txhuam hniav: kom paub tseeb tias cov slurry uas tau muab los ua tau raws li cov lus qhia ceev ntawm lub hom phiaj.
- Tom qab cov ntsiab lus sib tov slurry: xyuas kom meej tias cov khoom tshiab npaj ua raws li cov qauv tsim nyog ua ntej nkag mus rau hauv cov txheej txheem voj voog.
Cov chaw tseem ceeb no tso cai rau kev ntes thiab kho qhov kev hloov pauv ntawm cov slurry concentration sai sai, tiv thaiv kev puas tsuaj rau cov wafer zoo thiab kev cuam tshuam ntawm cov txheej txheem. Qhov chaw tso yog tswj los ntawm cov slurry flow dynamics, kev sib xyaw ua ke, thiab qhov xav tau kev tawm tswv yim tam sim ntawd ze ntawm lub planarization pad.
Kev tswj cov slurry concentration kom meej yuav ua li cas thiaj txhim kho kev ua tau zoo ntawm CMP cov txheej txheem?
Kev tswj cov slurry concentration kom raug txhim kho cov txheej txheem tshuaj lom neeg planarization los ntawm kev ua kom cov nqi tshem tawm sib npaug, txo qis qhov sib txawv ntawm daim ntawv tsis kam, thiab txo qhov zaus ntawm qhov tsis zoo ntawm qhov chaw. Qhov ruaj khov slurry density txuas ntxiv ob qho tib si polishing pad thiab wafer lub neej los ntawm kev tiv thaiv kev siv ntau dhau lossis siv tsis txaus. Nws kuj txo cov nqi txheej txheem los ntawm kev ua kom zoo dua kev siv slurry, txo cov haujlwm rov ua dua, thiab txhawb nqa cov khoom siv semiconductor ntau dua. Tshwj xeeb tshaj yog hauv kev tsim khoom siab heev thiab kev tsim khoom siv quantum, kev tswj hwm slurry nruj txhawb nqa qhov tiaj tiaj, kev ua haujlwm hluav taws xob sib xws, thiab txo qis kev xau thoob plaws cov qauv khoom siv.
Lub sijhawm tshaj tawm: Lub Kaum Ob Hlis-09-2025
