Hoʻopili Kemika Mekanika

Nā Pilikia i ka Nānā ʻana i nā Waiwai Slurry

ʻO ka mālama ʻana i ka nui o ka slurry a me ka viscosity i ke kaʻina hana polishing mechanical kemika he mea paʻakikī. Hiki ke ʻokoʻa nā waiwai slurry ma muli o nā mea e like me ka lawe ʻana, ka hoʻoheheʻe ʻana me ka wai a i ʻole ka hydrogen peroxide, ka hui kūpono ʻole, a i ʻole ka hoʻohaʻahaʻa kemika. No ka laʻana, ʻo ka noho ʻana o nā ʻāpana i loko o nā ʻeke slurry hiki ke hoʻonui i ka nui ma lalo, e alakaʻi ana i ka polishing like ʻole. ʻO nā ʻano nānā kuʻuna e like me ka pH, ka oxidation-reduction potential (ORP), a i ʻole ka conductivity ʻaʻole lawa pinepine, no ka mea ʻaʻole lākou e ʻike i nā loli liʻiliʻi i ka haku mele slurry. Hiki i kēia mau palena ke hopena i nā hemahema, ka hoʻemi ʻana i nā helu wehe, a me ka hoʻonui ʻana i nā kumukūʻai hoʻopau, e hōʻike ana i nā pilikia koʻikoʻi no nā mea hana lako semiconductor a me nā mea lawelawe lawelawe CMP. Hoʻopilikia nā loli haku mele i ka wā o ka lawelawe ʻana a me ka hāʻawi ʻana i ka hana. Pono nā kikowaena sub-10nm i ka mana paʻa ma luna o ka maʻemaʻe slurry a me ka pololei o ka hui ʻana. Hōʻike ka pH a me ORP i ka liʻiliʻi o ka loli, ʻoiai ʻokoʻa ka conductivity me ka ʻelemakule slurry. Hiki i nā waiwai slurry kūlike ʻole ke hoʻonui i nā helu hemahema a hiki i ka 20%, e like me nā haʻawina ʻoihana.

Nā Sensor Inline o Lonnmeter no ka Nānā ʻana i ka Manawa Maoli

Hoʻoponopono ʻo Lonnmeter i kēia mau pilikia me kāna mau mika density slurry non-nuclear holomua anā mea ʻike mānoanoa, me ka mika viscosity inline no nā ana viscosity in-line a me ka mika density ultrasonic no ka nānā ʻana i ka nui slurry a me ka viscosity i ka manawa like. Ua hoʻolālā ʻia kēia mau mea ʻike no ka hoʻohui maʻalahi ʻana i nā kaʻina hana CMP, e hōʻike ana i nā pilina maʻamau o ka ʻoihana. Hāʻawi nā hoʻonā a Lonnmeter i ka hilinaʻi lōʻihi a me ka mālama haʻahaʻa no kona kūkulu paʻa. Hiki i ka ʻikepili manawa maoli ke hiki i nā mea hana ke hoʻomaikaʻi i nā hui slurry, pale i nā hemahema, a hoʻonui i ka hana polishing, e lilo ai kēia mau mea hana i mea nui no nā mea hoʻolako lako hana Analysis and Testing a me nā mea hoʻolako CMP Consumables.

Nā Pōmaikaʻi o ka Nānā Mau ʻana no ka Hoʻonui ʻana i ka CMP

ʻO ka nānā mau ʻana me nā mea ʻike inline o Lonnmeter e hoʻololi i ke kaʻina hana polishing mechanical kemika ma ka hāʻawi ʻana i nā ʻike hana a me ka mālama kālā nui. ʻO ke ana ʻana i ka nui o ka slurry manawa maoli a me ka nānā ʻana i ka viscosity e hōʻemi i nā hemahema e like me nā ʻōpala a i ʻole ka polishing nui a hiki i ka 20%, e like me nā pae hoʻohālikelike o ka ʻoihana. ʻO ka hoʻohui ʻana me ka ʻōnaehana PLC e hiki ai i ka dosing automated a me ka kaohi kaʻina hana, e hōʻoia ana i nā waiwai slurry e noho i loko o nā pae kūpono. Ke alakaʻi nei kēia i ka hōʻemi ʻana o 15-25% i nā kumukūʻai hoʻopau, ka hoʻemi ʻana i ka downtime, a me ka hoʻomaikaʻi ʻana i ka wafer uniformity. No nā Semiconductor Foundries a me nā CMP Services Providers, ua unuhi ʻia kēia mau pono i ka hoʻonui ʻana i ka huahana, nā palena waiwai kiʻekiʻe, a me ka hoʻokō ʻana me nā kūlana e like me ISO 6976.